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    • 3. 发明授权
    • Field-effect transistor
    • 场效应晶体管
    • US07432538B2
    • 2008-10-07
    • US11523095
    • 2006-09-19
    • Masayoshi KosakiKoji Hirata
    • Masayoshi KosakiKoji Hirata
    • H01L29/778
    • H01L29/7787H01L29/2003
    • A field-effect transistor includes a channel layer having a channel and a carrier supply layer, disposed on the channel layer, containing a semiconductor represented by the formula AlxGa1-xN, wherein x is greater than 0.04 and less than 0.45. The channel is formed near the interface between the channel layer and the carrier supply layer or depleted, the carrier supply layer has a band gap energy greater than that of the channel layer, and x in the formula AlxGa1-xN decreases monotonically with an increase in the distance from the interface. The channel layer may be crystalline of gallium nitride. The channel layer may be undoped. X of the formula AlxGa1-xN of the carrier supply layer is greater than or equal to 0.15 and less than or equal to 0.40 at the interface.
    • 场效应晶体管包括具有通道的沟道层和载流子供应层,该沟道层设置在沟道层上,该沟道层包含由式Al x Ga 1-x N,其中x大于0.04且小于0.45。 通道形成在沟道层和载流子供应层之间的界面附近,或者耗尽,载流子供应层的带隙能量大于沟道层的带隙能量,并且公式A1 x x 随着与界面的距离的增加,Ga 1-x N单调减小。 沟道层可以是氮化镓的结晶。 通道层可以是未掺杂的。 载体供给层的式Al x Ga 1-x N的X在界面处大于或等于0.15且小于或等于0.40。
    • 5. 发明申请
    • Method for producing n-type Group III nitride semicondutor
    • 生产n型III族氮化物半导体的方法
    • US20110306190A1
    • 2011-12-15
    • US13067549
    • 2011-06-08
    • Masayoshi KosakiHiroshi Miwa
    • Masayoshi KosakiHiroshi Miwa
    • H01L21/205B82Y40/00
    • H01L21/0242B82Y10/00B82Y40/00H01L21/02458H01L21/02502H01L21/0254H01L21/02576H01L21/02658
    • The present invention provides a method for producing an n-type Group III nitride semiconductor product having a high Si concentration and exhibiting favorable crystallinity. In the production method, specifically, an AlN buffer layer is formed on a sapphire substrate by MOCVD, and then a first layer (thickness: 2 μm) is formed from undoped GaN on the buffer layer by MOCVD at 1,140° C. Subsequently, a second layer (thickness: 200 nm) is formed from SiO2 on the first layer by plasma CVD, and then the second layer is removed by use of BHF (buffered hydrofluoric acid). Next, a GaN layer (thickness: 50 nm) is grown, by MOCVD at 1,140° C., on the first layer exposed by removal of the second layer without supply of an n-type dopant gas. Thus, on the first layer is provided a third layer formed of n-type GaN doped with Si at a high concentration and exhibiting favorable crystallinity.
    • 本发明提供一种具有高Si浓度并具有良好结晶性的n型III族氮化物半导体产品的制造方法。 在制造方法中,具体而言,通过MOCVD在蓝宝石基板上形成AlN缓冲层,然后通过MOCVD在1140℃在缓冲层上由未掺杂的GaN形成第一层(厚度:2μm)。随后, 通过等离子体CVD在第一层上由SiO 2形成第二层(厚度:200nm),然后通过使用BHF(缓冲氢氟酸)除去第二层。 接下来,通过在1140℃下的MOCVD生长GaN层(厚度:50nm),在不提供n型掺杂气体的情况下,通过去除第二层而暴露的第一层上。 因此,在第一层上提供由掺杂有高浓度的Si并且具有良好结晶度的n型GaN形成的第三层。
    • 7. 发明申请
    • Field-effect transistor
    • 场效应晶体管
    • US20070063220A1
    • 2007-03-22
    • US11523095
    • 2006-09-19
    • Masayoshi KosakiKoji Hirata
    • Masayoshi KosakiKoji Hirata
    • H01L31/00
    • H01L29/7787H01L29/2003
    • A field-effect transistor includes a channel layer having a channel and a carrier supply layer, disposed on the channel layer, containing a semiconductor represented by the formula AlxGa1-xN, wherein x is greater than 0.04 and less than 0.45. The channel is formed near the interface between the channel layer and the carrier supply layer or depleted, the carrier supply layer has a band gap energy greater than that of the channel layer, and x in the formula AlxGa1-xN decreases monotonically with an increase in the distance from the interface. The channel layer may be crystalline of gallium nitride. The channel layer may be undoped. X of the formula AlxGa1-xN of the carrier supply layer is greater than or equal to 0.15 and less than or equal to 0.40 at the interface.
    • 场效应晶体管包括具有通道的沟道层和载流子供应层,该沟道层设置在沟道层上,该沟道层包含由式Al x Ga 1-x N,其中x大于0.04且小于0.45。 通道形成在沟道层和载流子供应层之间的界面附近,或者耗尽,载流子供应层的带隙能量大于沟道层的带隙能量,并且公式A1 x x 随着与界面的距离的增加,Ga 1-x N单调减小。 沟道层可以是氮化镓的结晶。 通道层可以是未掺杂的。 载体供给层的式Al x Ga 1-x N的X在界面处大于或等于0.15且小于或等于0.40。
    • 8. 发明授权
    • Method for producing n-type group III nitride semiconductor
    • 制造n型III族氮化物半导体的方法
    • US08420516B2
    • 2013-04-16
    • US13067549
    • 2011-06-08
    • Masayoshi KosakiHiroshi Miwa
    • Masayoshi KosakiHiroshi Miwa
    • H01L21/311
    • H01L21/0242B82Y10/00B82Y40/00H01L21/02458H01L21/02502H01L21/0254H01L21/02576H01L21/02658
    • The present invention provides a method for producing an n-type Group III nitride semiconductor product having a high Si concentration and exhibiting favorable crystallinity. In the production method, specifically, an AlN buffer layer is formed on a sapphire substrate by MOCVD, and then a first layer (thickness: 2 μm) is formed from undoped GaN on the buffer layer by MOCVD at 1,140° C. Subsequently, a second layer (thickness: 200 nm) is formed from SiO2 on the first layer by plasma CVD, and then the second layer is removed by use of BHF (buffered hydrofluoric acid). Next, a GaN layer (thickness: 50 nm) is grown, by MOCVD at 1,140° C., on the first layer exposed by removal of the second layer without supply of an n-type dopant gas. Thus, on the first layer is provided a third layer formed of n-type GaN doped with Si at a high concentration and exhibiting favorable crystallinity.
    • 本发明提供一种具有高Si浓度并具有良好结晶性的n型III族氮化物半导体产品的制造方法。 在制造方法中,具体而言,通过MOCVD在蓝宝石基板上形成AlN缓冲层,然后通过MOCVD在1140℃在缓冲层上由未掺杂的GaN形成第一层(厚度:2μm)。随后, 通过等离子体CVD在第一层上由SiO 2形成第二层(厚度:200nm),然后通过使用BHF(缓冲氢氟酸)除去第二层。 接下来,通过在1140℃下的MOCVD生长GaN层(厚度:50nm),在不提供n型掺杂气体的情况下,通过去除第二层而暴露的第一层上。 因此,在第一层上提供由掺杂有高浓度的Si并且具有良好结晶度的n型GaN形成的第三层。