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    • 2. 发明授权
    • Fittings with box nuts
    • 配有盒螺母的配件
    • US5388871A
    • 1995-02-14
    • US65266
    • 1993-05-21
    • Masahiro Saitoh
    • Masahiro Saitoh
    • F16L19/02F16L47/04F16L19/06
    • F16L19/0283F16L19/0218F16L47/04
    • A resin-made detachable fitting to which a tube is connected. The fitting comprises a core of a cylindrical or ring shape forcibly inserted into the tube end to expand it, a fitting body having an inner passage, and a box nut able to mesh with ends of the fitting body and connecting the tube end to the fitting body. The fitting body comprises a cylindrical socket portion axially cylindrically extending from the fitting body ends and having an outer diameter equal to the inner diameter of the core. The socket portion has a sealing surface at its end. The fitting body further comprises a cylindrical securing portion axially extending from the fitting body ends and formed coaxially around the socket portion to form an insertions space. The securing portion has a securing wall facing the socket portion and holding, together with the socket portion, the tube inserted into the insertion space. The box nut comprises a holding surface facing the sealing surface. The box nut further has a female thread part on its inner surface and a polygonal thread head portion for turning it on its outer surface. The thread head portion is different in axial position from the female thread part and an outer surface which faces the female thread part is a complete round.
    • 连接管的树脂制可拆卸配件。 该配件包括强制插入管端以使其膨胀的圆柱形或环形的芯体,具有内部通道的装配体和能够与配件主体的端部啮合并将管端连接到配件的盒形螺母 身体。 装配体包括圆柱形插座部分,其从配件主体端部轴向圆柱形延伸并且具有等于芯部的内径的外径。 插座部分在其端部具有密封表面。 装配体还包括圆柱形固定部分,其从装配体端部轴向延伸并同轴地形成在插座部分上以形成插入空间。 固定部具有面向插座部的固定壁,并与插座部一起保持插入到插入空间中的管。 箱形螺母包括面向密封表面的保持表面。 箱形螺母在其内表面上还具有内螺纹部分,并且在其外表面上转动多边形螺纹头部。 螺纹头部与内螺纹部的轴向位置不同,面向阴螺纹部的外表面为圆形。
    • 3. 发明申请
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US20060223256A1
    • 2006-10-05
    • US11396921
    • 2006-04-04
    • Masahiro SaitohMasahiko YanagiToshiyuki Tohda
    • Masahiro SaitohMasahiko YanagiToshiyuki Tohda
    • H01L21/8238
    • H01L29/7833H01L21/28114H01L21/28273H01L21/28282H01L29/42376H01L29/6656H01L29/66636H01L29/7834
    • A method of manufacturing a semiconductor memory device includes the steps of providing a gate insulating film on an active region, depositing a first conductive film on the gate insulating film, processing the first conductive film, the gate insulating film, and the active region to provide an opening of which the bottom is located below the interface between the active region and the gate insulating film and then providing a gate electrode between the openings, depositing a first insulating film which covers the side and bottom surface of the opening, depositing a second insulating film over the first insulating film, shaping the first and second insulating films into a side wall spacer shape by etching to provide charge retention sections beside the gate electrode and providing diffusion areas at opposite sides of the gate electrode beneath the charge retention sections in the active region.
    • 一种制造半导体存储器件的方法包括以下步骤:在有源区上提供栅极绝缘膜,在栅极绝缘膜上沉积第一导电膜,处理第一导电膜,栅极绝缘膜和有源区以提供 其底部位于有源区域和栅极绝缘膜之间的界面下方的开口,然后在开口之间提供栅电极,沉积覆盖开口的侧表面和底表面的第一绝缘膜,沉积第二绝缘体 在第一绝缘膜上形成膜,通过蚀刻将第一和第二绝缘膜成形为侧壁间隔物形状,以在栅电极旁边提供电荷保持部分,并且在活性物质的电荷保持部分之下的栅电极的相对侧提供扩散区域 地区。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20090161408A1
    • 2009-06-25
    • US12440207
    • 2007-11-29
    • Hiroki TanigamiMasahiro SaitohTakayuki Taniguchi
    • Hiroki TanigamiMasahiro SaitohTakayuki Taniguchi
    • G11C11/00G11C11/416
    • G11C13/0007G11C13/0064G11C13/0069G11C2013/0088G11C2013/009G11C2213/15G11C2213/32G11C2213/34G11C2213/79
    • A semiconductor memory device comprises a memory cell array including memory cells arranged in matrix each having a selective transistor and a variable resistance element having an electric resistance changed from a first state to a second state by applying a first write voltage and from the second state to the first state by applying a second write voltage. A first write current for a first writing operation to change the electric resistance from the first state to the second state is larger than a second write current for a second writing operation to change it from the second state to the first state. A second memory cell number of memory cells subjected to the second writing operation at a time is greater than a first memory cell number of memory cells subjected to the first writing operation at a time. At least the second memory cell number is plural.
    • 半导体存储器件包括:存储单元阵列,其包括以矩阵形式排列的每个具有选择晶体管的存储单元和通过施加第一写入电压而从第一状态改变到第二状态的电阻的可变电阻元件,并且从第二状态到 第一状态通过施加第二写入电压。 用于将电阻从第一状态改变到第二状态的第一写入操作的第一写入电流大于用于将第二写入操作从第二状态改变到第一状态的第二写入电流。 一次受到第二次写入操作的存储器单元的第二存储单元数量大于经历第一次写入操作的存储单元的第一存储单元数。 至少第二存储单元号是多个。
    • 6. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US07335581B2
    • 2008-02-26
    • US11396921
    • 2006-04-04
    • Masahiro SaitohMasahiko YanagiToshiyuki Tohda
    • Masahiro SaitohMasahiko YanagiToshiyuki Tohda
    • H01L21/3205
    • H01L29/7833H01L21/28114H01L21/28273H01L21/28282H01L29/42376H01L29/6656H01L29/66636H01L29/7834
    • A method of manufacturing a semiconductor memory device includes the steps of providing a gate insulating film on an active region, depositing a first conductive film on the gate insulating film, processing the first conductive film, the gate insulating film, and the active region to provide an opening of which the bottom is located below the interface between the active region and the gate insulating film and then providing a gate electrode between the openings, depositing a first insulating film which covers the side and bottom surface of the opening, depositing a second insulating film over the first insulating film, shaping the first and second insulating films into a side wall spacer shape by etching to provide charge retention sections beside the gate electrode and providing diffusion areas at opposite sides of the gate electrode beneath the charge retention sections in the active region.
    • 一种制造半导体存储器件的方法包括以下步骤:在有源区上提供栅极绝缘膜,在栅极绝缘膜上沉积第一导电膜,处理第一导电膜,栅极绝缘膜和有源区以提供 其底部位于有源区域和栅极绝缘膜之间的界面下方的开口,然后在开口之间提供栅电极,沉积覆盖开口的侧表面和底表面的第一绝缘膜,沉积第二绝缘体 在第一绝缘膜上形成膜,通过蚀刻将第一和第二绝缘膜成形为侧壁间隔物形状,以在栅电极旁边提供电荷保持部分,并且在活性物质的电荷保持部分之下的栅电极的相对侧提供扩散区域 地区。
    • 7. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20080007993A1
    • 2008-01-10
    • US11822123
    • 2007-07-02
    • Masahiro SaitohShinichi Sato
    • Masahiro SaitohShinichi Sato
    • G11C11/00
    • G11C11/16G11C13/0007G11C13/0069G11C2013/009G11C2213/31G11C2213/32G11C2213/79
    • A semiconductor memory device comprises writing means for performing a first writing action for shifting an electric resistance of a variable resistance element from a first state to a second state by applying a first voltage between both ends of a memory cell and a gate potential to a gate of a cell access transistor, and a second writing action for shifting the electric resistance from the second state to the first state by applying a second voltage having a polarity opposite to that of the first voltage between both ends of the memory cell and a gate potential to the gate of the cell access transistor, and the polarity and absolute value of the voltage to be applied to both ends of the variable resistance element in the memory cell to be written in the first writing action is different from those in the second writing action.
    • 半导体存储器件包括写入装置,用于通过在存储单元的两端和栅极电位之间施加第一电压来执行用于将可变电阻元件的电阻从第一状态移位到第二状态的第一写入动作 以及第二写入动作,用于通过施加具有与存储单元的两端之间的第一电压的极性相反的极性的第二电压和栅极电位,将电阻从第二状态移位到第一状态 到单元存取晶体管的栅极,并且要写入第一写入动作的存储单元中的可变电阻元件的两端的施加电压的极性和绝对值与第二写入动作中的不同 。