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1. 发明申请

US20150208561A1 COMPONENT MOUNTER 审中-公开
标题翻译：组件安装
公开(公告)号：US20150208561A1
公开(公告)日：2015-07-23
申请号：US14411156
申请日：2012-07-02
申请人： Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
发明人： Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
IPC分类号： H05K13/04
CPC分类号： H05K13/0417 , B65D88/54 , Y10T29/53174
摘要： A component mounter which picks components which are stored in tape and supplied from a component supply device by a component picking device and mounts components on a board which is conveyed by a board conveyance device including a waste box which stores the cut tape after the components are picked, a scraping out device which can scrape the tape out of the waste box, and a control device which controls scraping out the stored tape by the scraping out device when the tape is stored in the waste box to a predetermined amount.
摘要翻译：一种组件安装器，其拾取存储在磁带中并通过组件拾取装置从组件供应装置提供的组件，并将组件安装在由包括存储切割磁带的废物箱的组件之后的板传送装置传送的组件上可以将废弃物盒中的胶带刮掉的刮除装置，以及控制装置，当将胶带存放在废纸箱中时，控制装置通过刮除装置刮除存储的胶带。

2. 发明授权

US10064320B2 Component mounter 有权
公开(公告)号：US10064320B2
公开(公告)日：2018-08-28
申请号：US14411156
申请日：2012-07-02
申请人： Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
发明人： Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
IPC分类号： H05K13/04 , B65D88/54
CPC分类号： H05K13/0417 , B65D88/54 , Y10T29/53174
摘要： A component mounter which picks components which are stored in tape and supplied from a component supply device by a component picking device and mounts components on a board which is conveyed by a board conveyance device including a waste box which stores the cut tape after the components are picked, a scraping out device which can scrape the tape out of the waste box, and a control device which controls scraping out the stored tape by the scraping out device when the tape is stored in the waste box to a predetermined amount.

3. 发明申请

US20150146005A1 MOUNTING AND INSPECTION DATA CREATION DEVICE AND MOUNTING AND INSPECTION DATA CREATION METHOD 有权
标题翻译：安装和检查数据创建设备和安装和检查数据创建方法
公开(公告)号：US20150146005A1
公开(公告)日：2015-05-28
申请号：US14400093
申请日：2012-05-10
申请人： Masafumi Amano , Mikio Nakajima , Kenji Sugiyama
发明人： Masafumi Amano , Mikio Nakajima , Kenji Sugiyama
IPC分类号： H04N5/225 , H04N7/18 , G06K9/00
CPC分类号： H04N5/2254 , G06K9/00664 , H04N7/181 , H04N2005/2255 , H05K13/08 , H05K13/0812 , H05K13/0813
摘要： A number one camera and number two camera are provided in the top section and lower section of a mounting and inspection data creation device. A number one lighting device and top side shielding plate are provided on the lower side of a lens of number one camera. A number two lighting device and lower side shielding plate are provided on the top side of a lens of number two camera. Component is set on transparent setting plate that is positioned between top side shielding plate and lower side shielding plate, and when imaging the top side (pickup side) of component with number one camera, top side shielding plate is slid out of the imaging area of number one camera. When imaging the bottom side (mounting side) of component with number two camera, lower side shielding plate is slid out of the imaging area of number two camera. Mounting data is created based on component bottom side image taken by number two camera, and inspection data is created based on component top side image taken by number one camera.
摘要翻译：在安装和检查数据创建装置的顶部和下部设置有第一相机和第二相机。在第一相机的透镜的下侧设置有第一照明装置和顶侧遮蔽板。第二照明装置和下侧屏蔽板设置在第二相机的透镜的顶侧。将分量设置在位于上侧屏蔽板和下侧屏蔽板之间的透明设置板上，并且当用第一相机对部件的顶侧（拾取侧）进行成像时，将顶侧屏蔽板从成像区域的第一台相机当用数字摄像机对组件的底侧（安装侧）进行成像时，下侧屏蔽板从第二摄像机的成像区域滑出。基于由第二相机拍摄的组件底侧图像创建安装数据，并且基于由第一相机拍摄的组件顶侧图像创建检查数据。

4. 发明授权

US08973255B2 Circuit-substrate-related-operation performing apparatus 有权
标题翻译：电路基板相关操作执行装置
公开(公告)号：US08973255B2
公开(公告)日：2015-03-10
申请号：US13290322
申请日：2011-11-07
申请人： Masafumi Amano , Kazumi Hoshikawa , Mikio Nakajima , Hiroyuki Ao , Yusuke Yamakage
发明人： Masafumi Amano , Kazumi Hoshikawa , Mikio Nakajima , Hiroyuki Ao , Yusuke Yamakage
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/0404 , Y10T29/53087 , Y10T29/53174
摘要： A circuit-substrate-related-operation performing apparatus for performing a circuit-substrate-related operation which is an operation on a circuit substrate, including: a plurality of heads including at least one work head and at least one detection head; a head holding device configured to hold, at a holding portion thereof, one of the plurality of heads; a moving device configured to move the head holding device; a head stock device in which the plurality of heads are stocked; and a controller configured to control the circuit-substrate-related-operation performing apparatus, wherein the controller includes a head attachment control portion configured to control the moving device and the head holding device such that the head holding device is moved to a set position which is set with respect to the head stock device and such that an arbitrary one of the plurality of heads is held by the head holding device.
摘要翻译：一种电路基板相关操作执行装置，用于执行作为电路基板上的操作的电路基板相关操作，包括：多个头，包括至少一个工作头和至少一个检测头; 头保持装置，其构造成在其保持部分处保持所述多个头中的一个; 移动装置，其构造成移动所述头部保持装置; 存放多个头部的头部存放装置; 以及控制器，被配置为控制所述电路基板相关操作执行装置，其中所述控制器包括头部附接控制部分，所述头部附接控制部分被配置为控制所述移动装置和所述头部保持装置，使得所述头部保持装置移动到设定位置，相对于头部储存装置设置，并且使得多个头部中的任意一个被头部保持装置保持。

5. 发明申请

US20120151756A1 CIRCUIT-SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS 有权
标题翻译：电路基板相关操作实现装置
公开(公告)号：US20120151756A1
公开(公告)日：2012-06-21
申请号：US13290322
申请日：2011-11-07
申请人： Masafumi AMANO , Kazumi HOSHIKAWA , Mikio NAKAJIMA , Hiroyuki AO , Yusuke YAMAKAGE
发明人： Masafumi AMANO , Kazumi HOSHIKAWA , Mikio NAKAJIMA , Hiroyuki AO , Yusuke YAMAKAGE
IPC分类号： H05K13/00
CPC分类号： H05K13/0413 , H05K13/0404 , Y10T29/53087 , Y10T29/53174
摘要： A circuit-substrate-related-operation performing apparatus for performing a circuit-substrate-related operation which is an operation on a circuit substrate, including: a plurality of heads including at least one work head and at least one detection head; a head holding device configured to hold, at a holding portion thereof, one of the plurality of heads; a moving device configured to move the head holding device; a head stock device in which the plurality of heads are stocked; and a controller configured to control the circuit-substrate-related-operation performing apparatus, wherein the controller includes a head attachment control portion configured to control the moving device and the head holding device such that the head holding device is moved to a set position which is set with respect to the head stock device and such that an arbitrary one of the plurality of heads is held by the head holding device.
摘要翻译：一种电路基板相关操作执行装置，用于执行作为电路基板上的操作的电路基板相关操作，包括：多个头，包括至少一个工作头和至少一个检测头; 头保持装置，其构造成在其保持部分处保持所述多个头中的一个; 移动装置，其构造成移动所述头部保持装置; 存放多个头部的头部存放装置; 以及控制器，被配置为控制所述电路基板相关操作执行装置，其中所述控制器包括头部附接控制部分，所述头部附接控制部分被配置为控制所述移动装置和所述头部保持装置，使得所述头部保持装置移动到设定位置，相对于头部储存装置设置，并且使得多个头部中的任意一个被头部保持装置保持。

6. 发明授权

US09756230B2 Mounting and inspection data creation device and mounting and inspection data creation method 有权
公开(公告)号：US09756230B2
公开(公告)日：2017-09-05
申请号：US14400093
申请日：2012-05-10
申请人： Masafumi Amano , Mikio Nakajima , Kenji Sugiyama
发明人： Masafumi Amano , Mikio Nakajima , Kenji Sugiyama
IPC分类号： H05K13/08 , G06T7/70 , H04N5/225 , G06K9/00 , H04N7/18
CPC分类号： H04N5/2254 , G06K9/00664 , H04N7/181 , H04N2005/2255 , H05K13/08 , H05K13/0812 , H05K13/0813
摘要： A number one camera and number two camera are provided in the top section and lower section of a mounting and inspection data creation device. A number one lighting device and top side shielding plate are provided on the lower side of a lens of number one camera. A number two lighting device and lower side shielding plate are provided on the top side of a lens of number two camera. Component is set on transparent setting plate that is positioned between top side shielding plate and lower side shielding plate, and when imaging the top side (pickup side) of component with number one camera, top side shielding plate is slid out of the imaging area of number one camera. When imaging the bottom side (mounting side) of component with number two camera, lower side shielding plate is slid out of the imaging area of number two camera. Mounting data is created based on component bottom side image taken by number two camera, and inspection data is created based on component top side image taken by number one camera.

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