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1. 发明申请

US20110283530A1 COMPONENT MOUNTING SYSTEM 有权
标题翻译：组件安装系统
公开(公告)号：US20110283530A1
公开(公告)日：2011-11-24
申请号：US13101596
申请日：2011-05-05
申请人： Hiroyuki Ao , Tomohiko Hattori
发明人： Hiroyuki Ao , Tomohiko Hattori
IPC分类号： B23P19/00
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/53083 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An inspection camera unit that images an inspection target part of a circuit board can be mounted, replaceably with a mounting head, on a moving mechanism of any one of a plurality of mounting machine modules arranged in alignment along a direction of conveying the circuit board. Also, an inspection image processing unit that processes an image signal output from the inspection camera unit to inspect the inspection target part of the circuit board can be mounted, replaceably with a feeder, on a feeder mount base of any one of the mounting machine modules. The inspection image processing unit is provided with a computer for image processing, a display panel that displays inspection information, and others.
摘要翻译：可以将电路板的检查对象部分成像的检查照相机单元可更换为安装头，沿着沿着传送电路板的方向排列的多个安装机模块中的任一个的移动机构安装。此外，处理从检查照相机单元输出的图像信号以检查电路板的检查对象部分的检查图像处理单元可以在馈送器上可替换地安装在任何一个安装机模块。检查图像处理单元设置有用于图像处理的计算机，显示检查信息的显示面板等。

2. 发明授权

US08973255B2 Circuit-substrate-related-operation performing apparatus 有权
标题翻译：电路基板相关操作执行装置
公开(公告)号：US08973255B2
公开(公告)日：2015-03-10
申请号：US13290322
申请日：2011-11-07
申请人： Masafumi Amano , Kazumi Hoshikawa , Mikio Nakajima , Hiroyuki Ao , Yusuke Yamakage
发明人： Masafumi Amano , Kazumi Hoshikawa , Mikio Nakajima , Hiroyuki Ao , Yusuke Yamakage
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/0404 , Y10T29/53087 , Y10T29/53174
摘要： A circuit-substrate-related-operation performing apparatus for performing a circuit-substrate-related operation which is an operation on a circuit substrate, including: a plurality of heads including at least one work head and at least one detection head; a head holding device configured to hold, at a holding portion thereof, one of the plurality of heads; a moving device configured to move the head holding device; a head stock device in which the plurality of heads are stocked; and a controller configured to control the circuit-substrate-related-operation performing apparatus, wherein the controller includes a head attachment control portion configured to control the moving device and the head holding device such that the head holding device is moved to a set position which is set with respect to the head stock device and such that an arbitrary one of the plurality of heads is held by the head holding device.
摘要翻译：一种电路基板相关操作执行装置，用于执行作为电路基板上的操作的电路基板相关操作，包括：多个头，包括至少一个工作头和至少一个检测头; 头保持装置，其构造成在其保持部分处保持所述多个头中的一个; 移动装置，其构造成移动所述头部保持装置; 存放多个头部的头部存放装置; 以及控制器，被配置为控制所述电路基板相关操作执行装置，其中所述控制器包括头部附接控制部分，所述头部附接控制部分被配置为控制所述移动装置和所述头部保持装置，使得所述头部保持装置移动到设定位置，相对于头部储存装置设置，并且使得多个头部中的任意一个被头部保持装置保持。

3. 发明授权

US08302291B2 Component mounting system 有权
标题翻译：组件安装系统
公开(公告)号：US08302291B2
公开(公告)日：2012-11-06
申请号：US13101596
申请日：2011-05-05
申请人： Hiroyuki Ao , Tomohiko Hattori
发明人： Hiroyuki Ao , Tomohiko Hattori
IPC分类号： B23P19/00
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/53083 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.
摘要翻译：一种组件安装系统，包括沿着传送电路板的方向的安装机构; 每个安装机器中的馈线安装座; 可移除地安装在每个安装机器的进料器安装基座上的进料器; 在每个安装机中安装头，所述安装头吸取从所述馈线供应的部件，用于安装在所述电路板上; 每个安装机器中的移动机构，所述移动机构构造成可拆卸地安装和移动安装头; 检查摄像机单元，被配置为对所述电路板的检查对象部分进行成像; 以及检查图像处理单元，其安装在所述馈送器上，所述检查图像处理单元安装在所述检查摄像机单元的所述馈送器安装基座上，所述检查图像处理单元处理从所述检查照相机单元输出的图像信号以检查所述检查对象部分。

4. 发明申请

US20120151756A1 CIRCUIT-SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS 有权
标题翻译：电路基板相关操作实现装置
公开(公告)号：US20120151756A1
公开(公告)日：2012-06-21
申请号：US13290322
申请日：2011-11-07
申请人： Masafumi AMANO , Kazumi HOSHIKAWA , Mikio NAKAJIMA , Hiroyuki AO , Yusuke YAMAKAGE
发明人： Masafumi AMANO , Kazumi HOSHIKAWA , Mikio NAKAJIMA , Hiroyuki AO , Yusuke YAMAKAGE
IPC分类号： H05K13/00
CPC分类号： H05K13/0413 , H05K13/0404 , Y10T29/53087 , Y10T29/53174
摘要： A circuit-substrate-related-operation performing apparatus for performing a circuit-substrate-related operation which is an operation on a circuit substrate, including: a plurality of heads including at least one work head and at least one detection head; a head holding device configured to hold, at a holding portion thereof, one of the plurality of heads; a moving device configured to move the head holding device; a head stock device in which the plurality of heads are stocked; and a controller configured to control the circuit-substrate-related-operation performing apparatus, wherein the controller includes a head attachment control portion configured to control the moving device and the head holding device such that the head holding device is moved to a set position which is set with respect to the head stock device and such that an arbitrary one of the plurality of heads is held by the head holding device.
摘要翻译：一种电路基板相关操作执行装置，用于执行作为电路基板上的操作的电路基板相关操作，包括：多个头，包括至少一个工作头和至少一个检测头; 头保持装置，其构造成在其保持部分处保持所述多个头中的一个; 移动装置，其构造成移动所述头部保持装置; 存放多个头部的头部存放装置; 以及控制器，被配置为控制所述电路基板相关操作执行装置，其中所述控制器包括头部附接控制部分，所述头部附接控制部分被配置为控制所述移动装置和所述头部保持装置，使得所述头部保持装置移动到设定位置，相对于头部储存装置设置，并且使得多个头部中的任意一个被头部保持装置保持。

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