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    • 1. 发明授权
    • Epoxy resin composition
    • 环氧树脂组合物
    • US6084039A
    • 2000-07-04
    • US33963
    • 1998-03-03
    • Mareki MiuraYoshinobu Ohnuma
    • Mareki MiuraYoshinobu Ohnuma
    • C08L63/00C08G59/06C08G59/32C09D163/00C09J163/00H01L23/29H01L23/31C08G59/04
    • C08G59/063C08G59/3218
    • An epoxy resin which is useful as adhesives, resins for coatings, encapsulants, resins for a lamination board, casting materials, molding compounds, and electric insulators, and which can provide a cured resin having excellent heat resistance and moisture resistance is provided which comprises (A) an epoxy resin containing a trisepoxy compound represented by general formula (I), and (B) a curing agent for an epoxy resin, ##STR1## wherein R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from general formula (II) ##STR2## wherein R.sub.2 and R.sub.3 are an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.
    • 可用作粘合剂的环氧树脂,用于涂料的树脂,密封剂,层压板用树脂,浇铸材料,模塑料和电绝缘体,并且可提供具有优异的耐热性和耐湿性的固化树脂,其包含( A)含有通式(I)表示的三环氧化合物的环氧树脂和(B)环氧树脂用固化剂,其中R1为甲基,n为0〜2的整数,Ar为基团 选自碳原子数为1〜6的烷基,碳原子数为1〜6的烷氧基或卤素原子的通式(II)中的R 2和R 3为整数0 到2。