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    • 1. 发明申请
    • Application using non-covalent bond between a cucurbituril derivative and a ligand
    • 在葫芦巴衍生物和配体之间使用非共价键的应用
    • US20070092867A1
    • 2007-04-26
    • US11407143
    • 2006-04-20
    • Kimoon KimKangkyun BaekJeeyeon KimIiha HwangYoung KoNarayanan SelvapalamErumaipatty NagarajanKyeng Park
    • Kimoon KimKangkyun BaekJeeyeon KimIiha HwangYoung KoNarayanan SelvapalamErumaipatty NagarajanKyeng Park
    • C12Q1/70C12Q1/68G01N33/53C07F5/00C12M1/34C07D487/22
    • C07D487/22B01D15/3804B01J31/0249B01J31/0251B01J31/1658B82Y5/00B82Y15/00C07K1/22
    • Provided are a kit including a first component that is a compound of formula (1) below bound to a first material and a second component that is a ligand bound to a second material, wherein each of the first and second materials is independently selected from the group consisting of a solid phase, a biomolecule, an antioxidant, a chemical therapeutic agent, an anti-histaminic agent, a cucurbituril dendrimer, a cyclodextrin derivative, a crown ether derivative, a calixarene derivative, a cyclophane derivative, a cyclic peptide derivative, a metallic ion, a chromophore, a fluorescent material, a phosphor, a radioactive material, and a catalyst; and the ligand can non-covalently bind to the compound of formula (1); a method of separating and purifying a material bound to a ligand using the compound of formula (1) bound to a solid phase; a method of separating and purifying the compound of formula (1) or a material bound to the compound using a ligand bound to a solid phase; a sensor chip including a compound of formula (1) bound to a first material and a ligand bound to a second material; and a solid-catalyst complex including the compound of formula (1) bound to a first material and a ligand bound to a second material.
    • 本发明提供了一种试剂盒,其包含第一组分,其为下式结合于第一材料的式(1)化合物,第二组分为与第二材料结合的配体,其中第一和第二材料中的每一种独立地选自 由固相,生物分子,抗氧化剂,化学治疗剂,抗组胺药,葫芦巴树枝状大分子,环糊精衍生物,冠醚衍生物,杯芳烃衍生物,环戊烷衍生物,环肽衍生物, 金属离子,发色团,荧光材料,荧光体,放射性材料和催化剂; 并且配体可以非共价结合式(1)的化合物; 使用与固相结合的式(1)化合物分离和纯化与配体结合的材料的方法; 使用与固相结合的配体分离和纯化式(1)化合物或与化合物结合的物质的方法; 包含与第一材料结合的式(1)化合物和与第二材料结合的配体的传感器芯片; 和包含与第一材料结合的式(1)化合物和与第二材料结合的配体的固体催化剂络合物。