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1. 发明申请

US20070092867A1 Application using non-covalent bond between a cucurbituril derivative and a ligand 有权
标题翻译：在葫芦巴衍生物和配体之间使用非共价键的应用
公开(公告)号：US20070092867A1
公开(公告)日：2007-04-26
申请号：US11407143
申请日：2006-04-20
申请人： Kimoon Kim , Kangkyun Baek , Jeeyeon Kim , Iiha Hwang , Young Ko , Narayanan Selvapalam , Erumaipatty Nagarajan , Kyeng Park
发明人： Kimoon Kim , Kangkyun Baek , Jeeyeon Kim , Iiha Hwang , Young Ko , Narayanan Selvapalam , Erumaipatty Nagarajan , Kyeng Park
IPC分类号： C12Q1/70 , C12Q1/68 , G01N33/53 , C07F5/00 , C12M1/34 , C07D487/22
CPC分类号： C07D487/22 , B01D15/3804 , B01J31/0249 , B01J31/0251 , B01J31/1658 , B82Y5/00 , B82Y15/00 , C07K1/22
摘要： Provided are a kit including a first component that is a compound of formula (1) below bound to a first material and a second component that is a ligand bound to a second material, wherein each of the first and second materials is independently selected from the group consisting of a solid phase, a biomolecule, an antioxidant, a chemical therapeutic agent, an anti-histaminic agent, a cucurbituril dendrimer, a cyclodextrin derivative, a crown ether derivative, a calixarene derivative, a cyclophane derivative, a cyclic peptide derivative, a metallic ion, a chromophore, a fluorescent material, a phosphor, a radioactive material, and a catalyst; and the ligand can non-covalently bind to the compound of formula (1); a method of separating and purifying a material bound to a ligand using the compound of formula (1) bound to a solid phase; a method of separating and purifying the compound of formula (1) or a material bound to the compound using a ligand bound to a solid phase; a sensor chip including a compound of formula (1) bound to a first material and a ligand bound to a second material; and a solid-catalyst complex including the compound of formula (1) bound to a first material and a ligand bound to a second material.
摘要翻译：本发明提供了一种试剂盒，其包含第一组分，其为下式结合于第一材料的式（1）化合物，第二组分为与第二材料结合的配体，其中第一和第二材料中的每一种独立地选自由固相，生物分子，抗氧化剂，化学治疗剂，抗组胺药，葫芦巴树枝状大分子，环糊精衍生物，冠醚衍生物，杯芳烃衍生物，环戊烷衍生物，环肽衍生物，金属离子，发色团，荧光材料，荧光体，放射性材料和催化剂; 并且配体可以非共价结合式（1）的化合物; 使用与固相结合的式（1）化合物分离和纯化与配体结合的材料的方法; 使用与固相结合的配体分离和纯化式（1）化合物或与化合物结合的物质的方法; 包含与第一材料结合的式（1）化合物和与第二材料结合的配体的传感器芯片; 和包含与第一材料结合的式（1）化合物和与第二材料结合的配体的固体催化剂络合物。

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