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    • 4. 发明授权
    • Device and method for optimally detecting a surface condition of wafers
    • 用于最佳检测晶片表面状态的装置和方法
    • US06285199B1
    • 2001-09-04
    • US09229991
    • 1999-01-14
    • Tae-Kye Kim
    • Tae-Kye Kim
    • G01R31302
    • G01R31/2656
    • A device and method for optimally detecting the surface conditions of different types of wafers are disclosed. The device includes a light generating unit for impinging light on a wafer to generate a reflected light from the wafer, a combining unit including a plurality of filters having different light cut-off ratios for reducing the amount of the reflected light to generate a reduced amount of the reflected light depending on the reflection rate of the wafer, and a detection unit for processing the appropriately reduced amount of the reflected light to detect the surface condition of the wafer. A different filter or a different combination of the filters are selected depending on the reflection rate of the wafer being processed in order to appropriately reduce the amount of reflected light to be processed by the detection unit.
    • 公开了一种用于最佳地检测不同类型晶片的表面状况的装置和方法。 该装置包括用于将光照射在晶片上以产生来自晶片的反射光的光产生单元,包括具有不同遮光率的多个滤光器的组合单元,用于减少反射光的量以产生减少的量 取决于晶片的反射率的反射光;以及检测单元,用于处理适当减少的反射光量以检测晶片的表面状态。 根据正在处理的晶片的反射率来选择不同的滤光器或滤光片的不同组合,以便适当地减少由检测单元处理的反射光的量。