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1. 发明申请

US20120241216A1 COMPRESSION AND COLD WELD SEALING METHODS AND DEVICES 有权
标题翻译：压缩和冷焊密封方法和装置
公开(公告)号：US20120241216A1
公开(公告)日：2012-09-27
申请号：US13488355
申请日：2012-06-04
申请人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, JR. , Douglas Snell , Catherine M.B. Santini
发明人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, JR. , Douglas Snell , Catherine M.B. Santini
IPC分类号： F16B11/00 , B23K20/00 , H01R4/02
CPC分类号： B81C1/00269 , A61K9/0097 , A61M5/14276 , A61M2205/0244 , A61M2207/00 , B23K20/02 , B33Y80/00 , B81B2201/06 , B81C1/00047 , B81C1/00095 , B81C2203/0109 , B81C2203/019 , B81C2203/038 , F16B4/004 , F16B5/08 , F16B11/004 , H01L23/10 , H01L23/3142 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05568 , H01L2224/056 , H01L2224/16237 , H01L2224/81193 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/16315 , Y10T403/477 , H01L2924/00 , H01L2924/00014
摘要： Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
摘要翻译：提供压缩冷焊方法，接头结构和密封的密封装置。该方法包括提供具有至少一个第一接头结构的第一基底，该第一接合结构包括第一接合表面，该表面包括第一金属; 提供具有至少一个第二接头结构的第二基底，所述第二接头结构包括第二接合表面，所述表面包括第二金属; 以及将所述至少一个第一接合结构和所述至少一个第二接头结构压在一起，以在一个或多个界面上局部变形和剪切所述接合表面，所述接合面有效地在所述第一金属和所述第二接头结构之间形成金属与金属之间的接合金属的接合面。在接合表面上的重叠有效地移动表面污染物并促进接合表面之间的紧密接触而不需要热量输入。密封装置可以包含药物制剂，生物传感器或MEMS装置。

2. 发明申请

US20060115323A1 Compression and cold weld sealing methods and devices 有权
标题翻译：压缩和冷焊接密封方法和装置
公开(公告)号：US20060115323A1
公开(公告)日：2006-06-01
申请号：US11267541
申请日：2005-11-04
申请人： Jonathan Coppeta , Kurt Shelton , Norman Sheppard , Douglas Snell , Catherine Santini
发明人： Jonathan Coppeta , Kurt Shelton , Norman Sheppard , Douglas Snell , Catherine Santini
IPC分类号： F16B11/00
CPC分类号： B81C1/00269 , A61K9/0097 , A61M5/14276 , A61M2205/0244 , A61M2207/00 , B23K20/02 , B33Y80/00 , B81B2201/06 , B81C1/00047 , B81C1/00095 , B81C2203/0109 , B81C2203/019 , B81C2203/038 , F16B4/004 , F16B5/08 , F16B11/004 , H01L23/10 , H01L23/3142 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05568 , H01L2224/056 , H01L2224/16237 , H01L2224/81193 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/16315 , Y10T403/477 , H01L2924/00 , H01L2924/00014
摘要： Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
摘要翻译：提供压缩冷焊方法，接头结构和密封的密封装置。该方法包括提供具有至少一个第一接头结构的第一基底，该第一接合结构包括第一接合表面，该表面包括第一金属; 提供具有至少一个第二接头结构的第二基底，所述第二接头结构包括第二接合表面，所述表面包括第二金属; 以及将所述至少一个第一接合结构和所述至少一个第二接头结构压在一起，以在一个或多个界面上局部变形和剪切所述接合表面，所述接合面有效地在所述第一金属和所述第二接头结构之间形成金属与金属之间的接合金属的接合面。在接合表面上的重叠有效地移动表面污染物并促进接合表面之间的紧密接触而不需要热量输入。密封装置可以包含药物制剂，生物传感器或MEMS装置。

3. 发明授权

US09796583B2 Compression and cold weld sealing method for an electrical via connection 有权
公开(公告)号：US09796583B2
公开(公告)日：2017-10-24
申请号：US13488355
申请日：2012-06-04
申请人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, Jr. , Douglas Snell , Catherine M. B. Santini
发明人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, Jr. , Douglas Snell , Catherine M. B. Santini
IPC分类号： B81C1/00 , A61K9/00 , B23K20/02 , F16B4/00 , F16B5/08 , F16B11/00 , H01L23/10 , H01L23/31 , B33Y80/00 , A61M5/142
CPC分类号： B81C1/00269 , A61K9/0097 , A61M5/14276 , A61M2205/0244 , A61M2207/00 , B23K20/02 , B33Y80/00 , B81B2201/06 , B81C1/00047 , B81C1/00095 , B81C2203/0109 , B81C2203/019 , B81C2203/038 , F16B4/004 , F16B5/08 , F16B11/004 , H01L23/10 , H01L23/3142 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05568 , H01L2224/056 , H01L2224/16237 , H01L2224/81193 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/16315 , Y10T403/477 , H01L2924/00 , H01L2924/00014
摘要： Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

4. 发明授权

US08191756B2 Hermetically sealing using a cold welded tongue and groove structure 有权
标题翻译：密封采用冷焊舌榫结构
公开(公告)号：US08191756B2
公开(公告)日：2012-06-05
申请号：US11267541
申请日：2005-11-04
申请人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, Jr. , Douglas Snell , Catherine M. B. Santini
发明人： Jonathan R. Coppeta , Kurt Shelton , Norman F. Sheppard, Jr. , Douglas Snell , Catherine M. B. Santini
IPC分类号： B23K20/12 , B23K31/00
CPC分类号： B81C1/00269 , A61K9/0097 , A61M5/14276 , A61M2205/0244 , A61M2207/00 , B23K20/02 , B33Y80/00 , B81B2201/06 , B81C1/00047 , B81C1/00095 , B81C2203/0109 , B81C2203/019 , B81C2203/038 , F16B4/004 , F16B5/08 , F16B11/004 , H01L23/10 , H01L23/3142 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05568 , H01L2224/056 , H01L2224/16237 , H01L2224/81193 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/16315 , Y10T403/477 , H01L2924/00 , H01L2924/00014
摘要： Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
摘要翻译：提供压缩冷焊方法，接头结构和密封的密封装置。该方法包括提供具有至少一个第一接头结构的第一基底，该第一接合结构包括第一接合表面，该表面包括第一金属; 提供具有至少一个第二接头结构的第二基底，所述第二接头结构包括第二接合表面，所述表面包括第二金属; 以及将所述至少一个第一接合结构和所述至少一个第二接头结构压在一起，以在一个或多个界面上局部变形和剪切所述接合表面，所述接合面有效地在所述第一金属和所述第二接头结构之间形成金属与金属之间的接合金属的接合面。在接合表面上的重叠有效地移动表面污染物并促进接合表面之间的紧密接触而不需要热量输入。密封装置可以包含药物制剂，生物传感器或MEMS装置。

5. 发明申请

US20100151113A1 MANUFACTURE OF A RADIATING STRUCTURE FOR A MEDICAL IMPLANT 审中-公开
标题翻译：用于医疗植入物的放射结构的制造
公开(公告)号：US20100151113A1
公开(公告)日：2010-06-17
申请号：US12334184
申请日：2008-12-12
申请人： Kurt Shelton
发明人： Kurt Shelton
IPC分类号： B05D1/00 , A61B5/07
CPC分类号： A61B5/0031
摘要： A method of manufacturing a radiating structure having a selected capacitance. The method includes receiving a particular lot of a dielectric material having a nominal permittivity; receiving a measured value of an actual permittivity for the particular lot, the actual permittivity being different from the nominal permittivity; using the actual permittivity, determining the number of laminas of dielectric material required to cause the radiating structure to have the selected capacitance; causing the determined number of laminas of the dielectric material to be formed on a substrate, thereby forming a dielectric layer; and causing the radiating element to form on the layer.
摘要翻译：一种制造具有选定电容的辐射结构的方法。该方法包括接收具有额定介电常数的特定批次的介电材料; 接收特定批次实际介电常数的实测值，实际介电常数与标称介电常数不同; 使用实际介电常数，确定使辐射结构具有选定电容所需的电介质材料层数; 导致在衬底上形成确定数量的电介质材料，从而形成电介质层; 并使该辐射元件形成在该层上。

6. 发明申请

US20070088442A1 PASSIVE WEAR-INDICATING SENSOR FOR IMPLANTABLE PROSTHETIC DEVICE 审中-公开
标题翻译：无源磨损传感器，用于可植入的前置设备
公开(公告)号：US20070088442A1
公开(公告)日：2007-04-19
申请号：US11549831
申请日：2006-10-16
申请人： Michael Cima , John Santini , Kurt Shelton , James Prescott , Mark Staples , Jonathan Coppeta
发明人： Michael Cima , John Santini , Kurt Shelton , James Prescott , Mark Staples , Jonathan Coppeta
IPC分类号： A61F2/30 , A61F2/28 , A61B6/12
CPC分类号： A61B5/055 , A61B5/4514 , A61B5/4528 , A61B6/037 , A61B6/481 , A61B8/481 , A61F2/32 , A61F2/34 , A61F2/36 , A61F2/38 , A61F2/3804 , A61F2/3859 , A61F2/389 , A61F2/40 , A61F2/4425 , A61F2/4657 , A61F2002/2817 , A61F2002/30004 , A61F2002/30062 , A61F2002/30075 , A61F2002/30113 , A61F2002/30154 , A61F2002/30156 , A61F2002/30326 , A61F2002/30673 , A61F2002/30677 , A61F2002/30682 , A61F2002/30733 , A61F2002/30787 , A61F2002/3081 , A61F2002/30838 , A61F2002/30878 , A61F2002/30884 , A61F2002/30904 , A61F2002/30971 , A61F2002/3401 , A61F2002/3456 , A61F2002/3469 , A61F2002/3495 , A61F2002/3611 , A61F2002/3625 , A61F2002/4662 , A61F2002/488 , A61F2210/0004 , A61F2210/0061 , A61F2230/0006 , A61F2230/0021 , A61F2230/0023 , A61F2250/0014 , A61F2250/0037 , A61F2310/00011 , A61F2310/00179 , A61L27/50
摘要： A method is provided for non-invasively detecting mechanical wear of a prosthetic device implanted in a patient, the method comprises using a non-invasive imaging technique to image the prosthetic device that includes a wear indicating composition; and detecting whether the wear indicating composition has been released from the prosthetic device, and, if so, the location, type, and/or amount thereof. The implant device includes a prosthetic device body having at least one outer surface area; at least one reservoir (e.g., a plurality of discretely spaced micro-reservoirs) in the device body; a wear indicator composition disposed in said at least one reservoir, wherein mechanical wear of the at least one outer surface area of the device body in vivo causes release of at least part of the wear indicator composition. The prosthetic device body may be one for replacement of a hip, a knee, a shoulder, an elbow, or a vertebra.
摘要翻译：提供了一种用于非侵入性地检测植入患者体内的假体装置的机械磨损的方法，所述方法包括使用非侵入性成像技术对包括磨损指示组合物的假体装置进行成像; 以及检测磨损指示组合物是否已经从假体装置释放，以及如果是，则其位置，类型和/或数量。植入装置包括具有至少一个外表面区域的假体装置主体; 设备主体中的至少一个储存器（例如，多个离散间隔的微储器）; 布置在所述至少一个储存器中的磨损指示剂组合物，其中所述装置主体的所述至少一个外表面区域的体内机械磨损导致所述磨损指示剂组合物的至少一部分的释放。假体装置主体可以是用于替换髋部，膝盖，肩部，肘部或椎骨的人造体。

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