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1. 发明申请

US20130337229A1 ROUGHED CURED MATERIAL AND LAMINATED 审中-公开
标题翻译：粗糙的固化材料和层压材料
公开(公告)号：US20130337229A1
公开(公告)日：2013-12-19
申请号：US13982909
申请日：2012-01-27
申请人： Takayuki Kobayashi , Koichi Shibayama , Shuichiro Matsumoto
发明人： Takayuki Kobayashi , Koichi Shibayama , Shuichiro Matsumoto
IPC分类号： H05K1/03
CPC分类号： H05K1/0353 , B32B3/085 , B32B15/08 , B32B15/092 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2264/102 , B32B2307/206 , B32B2307/412 , B32B2307/538 , B32B2457/08 , C08G59/18 , C08J7/02 , C08J2363/00 , Y10T428/24421 , Y10T428/31529
摘要： A roughened cured material allows reduction of surface roughness and increase in adhesive strength between a cured object and a metal layer. A roughened cured material is obtained by advancing curing of an epoxy resin material to obtain a preliminary-cured material and conducting roughening treatment on a surface of the preliminary-cured material. The epoxy resin material contains an epoxy resin, a curing agent, and a silica whose mean particle diameter is not smaller than 0.2 μm but not larger than 1.2 μm. When a roughening-treated surface of the roughened cured material is photographed with a scanning electron microscope, in a 5 μm×5 μm sized area of the roughening-treated surface in a photographed image, the number of particles of the silica that are exposed from the roughening-treated surface and whose exposed portions have a maximum length of 0.3 μM or longer in the image is not greater than 15.
摘要翻译：粗化固化材料可以降低表面粗糙度，增加固化物和金属层之间的粘合强度。通过使环氧树脂材料的固化前进来获得预固化材料并在预固化材料的表面上进行粗糙化处理，获得粗糙化的固化材料。环氧树脂材料包含环氧树脂，固化剂和平均粒径不小于0.2μm，但不大于1.2μm的二氧化硅。当用扫描电子显微镜对经粗化处理的粗化材料进行粗糙化处理的表面时，在经拍摄的图像中的经粗糙处理的表面的5mum×5mum大小的区域中，暴露于二氧化硅的颗粒数粗糙化处理的表面和其曝光部分在图像中具有0.3μm或更大的最大长度不大于15。

2. 发明申请

US20090256283A1 THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE 审中-公开
标题翻译：热塑性树脂组合物，基材材料和基材薄膜
公开(公告)号：US20090256283A1
公开(公告)日：2009-10-15
申请号：US12488560
申请日：2009-06-20
申请人： Koichi Shibayama , Koji Yonezawa
发明人： Koichi Shibayama , Koji Yonezawa
IPC分类号： B29C70/60
CPC分类号： H05K1/0373 , H05K2201/0129 , H05K2201/0209
摘要： Disclosed is a thermoplastic cresin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistence. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.
摘要翻译：公开了一种热塑性树脂组合物，其能够获得即使在成型后加热制品并且尺寸稳定性和耐热性优异的情况下也能够保持成型体的成型体。热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度，也可以保持制品的模制形状的75％以上。还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

3. 发明申请

US20080233386A1 Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate 失效
标题翻译：热固性树脂组合物，树脂片和绝缘基材树脂片
公开(公告)号：US20080233386A1
公开(公告)日：2008-09-25
申请号：US10581928
申请日：2004-12-07
申请人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
发明人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
IPC分类号： C08G59/62 , B32B15/092 , C08K3/36 , C08K5/17
CPC分类号： H01L23/295 , C08G59/625 , H01L2924/0002 , H05K1/0373 , H05K2201/0245 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31525 , H01L2924/00
摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.
摘要翻译：能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即，显示出低的线性膨胀系数。此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物以及由树脂片构成的绝缘基板用树脂片。

4. 发明授权

US07173068B2 Thermoplastic foam and method for production thereof 失效
标题翻译：热塑性泡沫及其制造方法
公开(公告)号：US07173068B2
公开(公告)日：2007-02-06
申请号：US10918552
申请日：2004-08-16
申请人： Koichiro Iwasa , Hiroki Erami , Naoki Ueda , Koichi Shibayama , Juichi Fukatani
发明人： Koichiro Iwasa , Hiroki Erami , Naoki Ueda , Koichi Shibayama , Juichi Fukatani
IPC分类号： C08J9/32
CPC分类号： C04B20/0024 , C04B26/045 , C08J9/0066 , C08J9/04 , C04B14/20 , C04B14/106
摘要： A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed.A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1–50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells 6, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 Å when determined by an X-ray diffractometry.
摘要翻译：提供了一种热塑性泡沫，其包含热塑性树脂和层状硅酸盐，其中泡沫体和层状硅酸盐均匀且细分散。在100重量份热塑性树脂和0.1-50重量份层状硅酸盐的复合材料中，将体积膨胀气体或热分解发泡剂并入层状硅酸盐的层间空间中，气体或发泡剂允许体积膨胀或热分解以形成泡沫体6，从而获得热塑性泡沫，其中当通过X射线衍射法测定时，层状硅酸盐具有超过60的平均层间距。

5. 发明申请

US20090267263A1 THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE 审中-公开
标题翻译：热固性树脂组合物，基材材料和基材薄膜
公开(公告)号：US20090267263A1
公开(公告)日：2009-10-29
申请号：US12501462
申请日：2009-07-12
申请人： Koichi Shibayama , Koji Yonezawa
发明人： Koichi Shibayama , Koji Yonezawa
IPC分类号： B29C71/00
CPC分类号： H05K1/0373 , C08K3/34 , C08K7/10 , C08L21/00 , C08L63/00 , H05K2201/0209 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 μm. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.
摘要翻译：公开了一种热固性树脂组合物，其能够获得机械性能，尺寸稳定性和耐热性优异的成型体，并且即使在树脂组合物固化后，还能够保持固化前的制品的形状。热固性树脂组合物含有100重量份热固性树脂和1-100重量份分散在热固性树脂中的无机化合物，并且无机化合物的分散体粒径不大于2μm。在树脂组合物固化后，保持固化前模制的制品形状的75％以上。还公开了通过使用这种热固性树脂组合物分别构成的基板材料和基板用薄膜。

6. 发明申请

US20070072963A1 Thermoplastic resin composition, material for substrate and film for substrate 审中-公开
标题翻译：热塑性树脂组合物，基材用材料和基材用膜
公开(公告)号：US20070072963A1
公开(公告)日：2007-03-29
申请号：US10582883
申请日：2004-12-14
申请人： Koichi Shibayama , Koji Yonezawa
发明人： Koichi Shibayama , Koji Yonezawa
IPC分类号： C08K3/02
CPC分类号： H05K1/0373 , H05K2201/0129 , H05K2201/0209
摘要： Disclosed is a thermoplastic resin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistance. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.
摘要翻译：公开了一种热塑性树脂组合物，其能够获得即使在制品在成型后被加热并且尺寸稳定性和耐热性优异的情况下也能够保持模塑形状的模塑制品。热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度，也可以保持制品的模制形状的75％以上。还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

7. 发明申请

US20130108861A1 PRELIMINARY-CURED MATERIAL, ROUGHENED PRELIMINARY-CURED MATERIAL, AND LAMINATED BODY 有权
标题翻译：初始固化材料，粗化初始固化材料和层压体
公开(公告)号：US20130108861A1
公开(公告)日：2013-05-02
申请号：US13582214
申请日：2011-03-31
申请人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
发明人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
IPC分类号： B32B15/092 , C08K3/36
CPC分类号： B32B15/092 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/38 , B32B2264/102 , B32B2307/538 , C08G59/4014 , C08G59/42 , C08G59/621 , C08G59/686 , C08J7/00 , C08K3/36 , C08L63/00 , Y10T428/259 , Y10T428/268 , C08L71/12
摘要： A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
摘要翻译：预固化材料允许粗糙化处理的表面的表面粗糙度降低，并且增加固化物体和金属层之间的粘合强度。预固化材料是通过使包含环氧树脂，固化剂和二氧化硅的环氧树脂材料进行固化而得到的。预固化材料包括待粗化处理的第一主表面和第二主表面。二氧化硅包括粒径不小于0.01μm但小于0.5μm的第一小粒径二氧化硅和粒径不小于0.5μm但不大于20μm的第二大粒径二氧化硅。第一小粒径二氧化硅被定位成大量存在于第一主表面的一侧，第二大颗粒直径二氧化硅在第二主表面的一侧大量存在。

8. 发明申请

US20110003914A1 RESIN COMPOSITION AND MULTILAYER RESIN FILM EMPLOYING THE SAME 审中-公开
标题翻译：树脂组合物和使用其的多层树脂膜
公开(公告)号：US20110003914A1
公开(公告)日：2011-01-06
申请号：US12676943
申请日：2009-01-30
申请人： Reona Yokota , Koichi Shibayama , Kazuyoshi Shiomi , Hiroshi Kouyanagi
发明人： Reona Yokota , Koichi Shibayama , Kazuyoshi Shiomi , Hiroshi Kouyanagi
IPC分类号： C08K5/07 , C08K5/101
CPC分类号： H05K1/0373 , C08K3/36 , C08K5/132 , C08K5/315 , C08L63/00 , H05K3/0032 , H05K3/4676 , H05K2201/0112 , H05K2201/0209
摘要： A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B). A multilayer resin film is provided in which the resin composition is laminated on a base material so as to be in a sheet shape and in which: the sheet-shaped resin composition on the base material is dried; and the content of the solvent is from 0.01 to 5 parts by weight with respect to the entire resin composition.
摘要翻译：提供了树脂组合物，其可以提高树脂的紫外线激光加工性，并且不仅可以用作积层板等的绝缘膜的电子材料，而且还可以用于形成电绝缘的电路板财产不会恶化。提供了使用该树脂组合物的多层树脂膜。提供了含有热固性树脂（A），固化剂（B），二氧化硅（C），紫外线吸收剂（D）和溶剂（E））的树脂组合物，其中：紫外线吸收剂（D）相对于热固性树脂（A），固化剂（B）和紫外线吸收剂（D）的总量为0.5〜50重量份。溶剂（E）的配合量相对于100重量份热固性树脂（A）和固化剂（B）的总量为20〜500重量份。提供一种多层树脂膜，其中树脂组合物层压在基材上以成为片状，并且其中基材上的片状树脂组合物被干燥; 相对于整个树脂组合物，溶剂的含量为0.01〜5重量份。

9. 发明授权

US07709085B2 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate 失效
标题翻译：绝热基板的热固性树脂组合物，树脂片和树脂片
公开(公告)号：US07709085B2
公开(公告)日：2010-05-04
申请号：US10581928
申请日：2004-12-07
申请人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
发明人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
IPC分类号： B32B15/16 , C08L63/00 , C08K3/24 , B32B27/20 , B32B27/38
CPC分类号： H01L23/295 , C08G59/625 , H01L2924/0002 , H05K1/0373 , H05K2201/0245 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31525 , H01L2924/00
摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.
摘要翻译：能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即，显示出低的线性膨胀系数。此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物以及由树脂片构成的绝缘基板用树脂片。

10. 发明申请

US20070191555A1 Thermosetting resin composition and its article 审中-公开
标题翻译：热固性树脂组合物及其制品
公开(公告)号：US20070191555A1
公开(公告)日：2007-08-16
申请号：US10811952
申请日：2004-03-30
申请人： Hatsuo Ishida , Koichi Shibayama , Hiroshi Abe
发明人： Hatsuo Ishida , Koichi Shibayama , Hiroshi Abe
IPC分类号： C08L63/02 , C08L63/04
CPC分类号： C08G59/027 , C08G59/4014 , H05K1/0346
摘要： The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.
摘要翻译：本发明提供一种包含双官能二氢苯并恶嗪化合物和环氧化合物的热固性树脂组合物，并提供通过热固化热固性树脂组合物获得的热固性树脂模制品。该模制品具有优异的低介电常数和低介电损耗角正切的电性能。树脂组合物包含下述通式（1）的环氧化合物和双官能二氢苯并恶嗪化合物，其中环氧化合物与双官能二氢苯并恶嗪化合物的当量比为1 /（0.1〜20）：其中R表示直链亚烷基具有至少2个碳原子，或者由烷基衍生自其中的氢原子衍生的支链亚烷基，苯环的氢原子可以被烷基或烷氧基取代。

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