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    • 2. 发明申请
    • THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, AND MOLDED PRODUCT OBTAINED FROM SAME
    • 热固性树脂,含有该组合物的热固化组合物和从其获得的成型产品
    • US20090187003A1
    • 2009-07-23
    • US12088681
    • 2006-09-25
    • Yuji EguchiKazuo DoyamaHatsuo Ishida
    • Yuji EguchiKazuo DoyamaHatsuo Ishida
    • C08G65/00
    • C08G73/06C07D265/14C08L79/04
    • An object of the invention is to provide a thermosetting resin excellent in dielectric characteristics and heat resistance, and to provide a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin. The present invention provides a thermosetting resin having a dihydrobenzoxazine ring structure represented by formula (I) in a main chain thereof, a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin. (in formula (I), Ar1 represents a tetravalent aromatic group, R1 is a hydrocarbon group having a fused alicyclic structure, and n represents an integer from 2 to 500).
    • 本发明的目的是提供一种介电特性和耐热性优异的热固性树脂,并且提供一种包含热固性树脂的热固性组合物,以及由热固性树脂获得的模塑产品,电子器件等的基材 。 本发明提供一种热固性树脂,其主链具有由式(I)表示的二氢苯并恶嗪环结构,包含热固性树脂的热固性组合物,以及模塑产品,电子器件用基材等 热固性树脂。 (式(I)中,Ar 1表示四价芳香族基,R 1表示稠合脂环式结构的烃基,n表示2〜500的整数)。
    • 4. 发明申请
    • Thermosetting resin composition and its article
    • 热固性树脂组合物及其制品
    • US20070191555A1
    • 2007-08-16
    • US10811952
    • 2004-03-30
    • Hatsuo IshidaKoichi ShibayamaHiroshi Abe
    • Hatsuo IshidaKoichi ShibayamaHiroshi Abe
    • C08L63/02C08L63/04
    • C08G59/027C08G59/4014H05K1/0346
    • The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.
    • 本发明提供一种包含双官能二氢苯并恶嗪化合物和环氧化合物的热固性树脂组合物,并提供通过热固化热固性树脂组合物获得的热固性树脂模制品。 该模制品具有优异的低介电常数和低介电损耗角正切的电性能。 树脂组合物包含下述通式(1)的环氧化合物和双官能二氢苯并恶嗪化合物,其中环氧化合物与双官能二氢苯并恶嗪化合物的当量比为1 /(0.1〜20):其中R表示直链亚烷基 具有至少2个碳原子,或者由烷基衍生自其中的氢原子衍生的支链亚烷基,苯环的氢原子可以被烷基或烷氧基取代。
    • 9. 发明授权
    • Activated arylamine-based polybenzoxazines
    • 活性芳胺基聚苯并恶嗪
    • US6160079A
    • 2000-12-12
    • US291466
    • 1999-04-14
    • Hatsuo IshidaDaniel Sanders
    • Hatsuo IshidaDaniel Sanders
    • C07D265/16C08G14/06C08G61/12C08G8/04
    • C08G61/12C07D265/16C08G14/06
    • Arylamines with electron donating groups such as alkyl and alkoxy groups in the meta position on the aromatic ring change the polymerization temperature of the benzoxazine prepared therefrom and offer an opportunity for an additional crosslinking site (the para position on the aromatic amine can couple to a Mannich base generated by the opening of the oxazine ring of the benzoxazine or a methylene bridge generated by a degradation reaction). Naphthenic amines with an alkyl or alkoxy substituent on the 5.sup.th through the 8.sup.th carbon atom on the naphthalene ring can function similarly. The polymers for benzoxazines prepared from at least 10% substituted aromatic or naphthenic amines are useful due to low polymerization temperatures and higher Tg (glass transition temperature).
    • 在芳环上的间位的具有供体基团如烷基和烷氧基的芳胺改变由其制备的苯并恶嗪的聚合温度,并提供另外的交联位点的机会(芳胺上的对位可以连接到曼尼希 通过苯并恶嗪的恶嗪环的开放产生的碱或由降解反应产生的亚甲基桥)。 在萘环上的第5个到第8个碳原子上具有烷基或烷氧基取代基的环烷胺类似地起作用。 由至少10%取代的芳族或环烷胺制备的苯并恶嗪的聚合物是有用的,因为低聚合温度和较高的Tg(玻璃化转变温度)。