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1. 发明授权

US09436084B2 Positive-working photoresist composition for thick film formation 有权
标题翻译：用于厚膜形成的正性光致抗蚀剂组合物
公开(公告)号：US09436084B2
公开(公告)日：2016-09-06
申请号：US11792752
申请日：2006-03-22
申请人： Koichi Misumi , Toshiki Okui
发明人： Koichi Misumi , Toshiki Okui
IPC分类号： G03F7/004 , G03F7/039 , H01L21/027 , C08F220/18 , C07D251/02
CPC分类号： G03F7/0397 , C07D251/02 , C08F220/18 , G03F7/004 , G03F7/0392 , H01L21/0274
摘要： The invention provides a chemical-amplification positive-working photoresist composition suitable for forming a resist film of a relatively large thickness on a substrate in addition to other advantages. The inventive composition contains (A) a photoacid-generating agent, (B) an alkali-insoluble resin capable of being imparted with increased alkali-solubility by interaction with an acid, (C) an alkali-soluble resin and (D) an organic solvent, wherein the component (C) is (C1) a polyhydroxystyrene or a copolymer having at least 80% by mass of the hydroxystyrene units in an amount not exceeding 15 parts by mass relative to 100 parts by mass of the total amount of the components (B) and (C).
摘要翻译：本发明提供了除了其它优点之外，还适用于在基片上形成厚度相对较大的抗蚀剂膜的化学放大正性光致抗蚀剂组合物。本发明的组合物含有（A）光致酸产生剂，（B）能够通过与酸相互作用而赋予碱溶性增加的碱不溶性树脂，（C）碱溶性树脂和（D）有机溶剂，其中组分（C）为（C1）聚羟基苯乙烯或共聚物，相对于100质量份的组分的总量，相对于100质量份，羟基苯乙烯单元的至少80质量％的量不超过15质量份（B）和（C）。

2. 发明授权

US08901234B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08901234B2
公开(公告)日：2014-12-02
申请号：US12457579
申请日：2009-06-16
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： C08F222/40 , C08L37/00 , C08L39/00 , C09J133/14 , C09J135/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其能够在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

3. 发明授权

US07977030B2 Photosensitive resin composition, photosensitive resin laminate, and method for pattern forming 有权
标题翻译：感光性树脂组合物，感光性树脂层叠体及图案形成方法
公开(公告)号：US07977030B2
公开(公告)日：2011-07-12
申请号：US12136354
申请日：2008-06-10
申请人： Takahiro Senzaki , Koichi Misumi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Koji Saito
IPC分类号： G03F7/029 , G03F7/11 , G03F7/20 , G03F7/30 , G03F7/40
CPC分类号： C08F2/50 , G03F7/0045 , G03F7/038 , G03F7/161 , Y10S430/122 , Y10S430/126 , Y10S430/127
摘要： A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C).
摘要翻译：提供了一种感光性树脂组合物，感光性树脂层叠体，以及在使用含有环氧基的丙烯酸类树脂时能够实现高硬度的图案的形成方法。在包含（A）含环氧基丙烯酸树脂，（B）光聚合引发剂和（C）敏化剂）的感光性树脂组合物中，使用具有特定结构的鎓盐作为（B）成分，至少使用1,5-二羟基萘，2,3-二羟基萘和2,6-二羟基萘中的一种作为（C）成分。

4. 发明申请

US20110123928A1 Photosensitive Resin Composition and Pattern Forming Method Using the Same 有权
标题翻译：感光树脂组合物和使用其的图案形成方法
公开(公告)号：US20110123928A1
公开(公告)日：2011-05-26
申请号：US12223913
申请日：2007-02-15
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/004 , G03F7/20
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/0385
摘要： Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition.Means for Resolution: A photosensitive resin composition characterized by containing (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator and (c) an aromatic polycyclic compound as a sensitizer (such as 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene or 2,6-dihydroxynaphthalene), which has at least two substituents capable of forming cross-links with component (a).
摘要翻译：问题：提供一种具有高灵敏度的感光性树脂组合物，在加热下固化时能够容易地体积收缩，并且可以形成具有高外形轮廓的抗蚀剂图案，以及使用这种组合物的图案形成方法。解决方法：一种感光性树脂组合物，其特征在于，含有（a）多官能环氧树脂，（b）阳离子聚合引发剂和（c）作为敏化剂的芳香族多环化合物（如2,3-二羟基萘，二羟基萘或2,6-二羟基萘），其具有至少两个能够与组分（a）形成交联的取代基。

5. 发明申请

US20110061800A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD 有权
公开(公告)号：US20110061800A1
公开(公告)日：2011-03-17
申请号：US12950203
申请日：2010-11-19
申请人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
发明人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
IPC分类号： B32B38/10
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

6. 发明申请

US20110059574A1 COATING APPARATUS AND COATING METHOD 有权
标题翻译：涂装和涂装方法
公开(公告)号：US20110059574A1
公开(公告)日：2011-03-10
申请号：US12874117
申请日：2010-09-01
申请人： Hidenori Miyamoto , Kenji Maruyama , Tadahiko Hirakawa , Koichi Misumi
发明人： Hidenori Miyamoto , Kenji Maruyama , Tadahiko Hirakawa , Koichi Misumi
IPC分类号： H01L21/20 , B05C11/00 , B05D7/00
CPC分类号： H01L31/0322 , B05B16/20 , B05B16/60 , B05B16/95 , H01L21/02568 , H01L21/02614 , H01L21/02623 , Y02E10/541
摘要： A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating section in which the coating part applies the liquid material on the substrate and a transport section into which the liquid material is transported; an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber; and a control part which stops an operation of the coating part in response to the entrance of foreign object into the chamber.
摘要翻译：一种涂布装置，包括：涂布部，其在基材上涂布包含可氧化金属的液体材料; 具有涂布部的室，其中所述涂布部将所述液体材料施加到所述基板上;以及运送部，所述液体材料被输送到所述输送部中; 调节部，其调节所述室内的氧浓度和湿度中的至少一个; 以及控制部，其响应于异物进入室而停止涂布部的操作。

7. 发明申请

US20100178497A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开
标题翻译：胶粘组合物，胶粘剂和组合物的生产方法
公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译：公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

8. 发明申请

US20100069593A1 ADHESIVE COMPOSITION AND ADHESIVE FILM 有权
标题翻译：胶粘组合物和粘合膜
公开(公告)号：US20100069593A1
公开(公告)日：2010-03-18
申请号：US12516363
申请日：2007-09-27
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
IPC分类号： C08F18/02
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译：作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物，具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

9. 发明申请

US20100068453A1 METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE 审中-公开
标题翻译：生产加工玻璃基板的方法
公开(公告)号：US20100068453A1
公开(公告)日：2010-03-18
申请号：US12558850
申请日：2009-09-14
申请人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
发明人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
IPC分类号： B32B3/24 , C03C19/00 , C03C15/00 , G03F7/20
CPC分类号： G03F7/2022 , C03C15/00 , C03C19/00 , C03C2218/34 , Y10T428/24273
摘要： A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity.
摘要翻译：本发明的处理衬底包括具有多个通孔的透光性衬底，每个通孔在（a）穿过开口平面的中心点的直线之间存在0至5μm的间隙所述多个通孔中的每一个并且垂直于所述开口平面，并且（b）直线，其穿过所述多个通孔中的每一个的另一开口平面的中心点并且垂直于从而能够提供（i）具有通孔的处理基板，其中每个中心轴对准，其可以容易地以高生产率生产，和（ii）其制造方法。此外，本发明的加工玻璃基板的制造方法包括：（a）在玻璃基板的表面上形成感光性树脂层; （b）在玻璃基板中形成通孔; 和（c）将玻璃基板浸入酸中，其中感光性树脂层保留在两面上。因此，不需要在步骤（c）之后对玻璃基板的表面进行平滑化，从而以高生产率成功制造具有通孔的加工玻璃基板。

10. 发明申请

US20090226850A1 PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN 有权
标题翻译：生产电阻图案和导体图案的方法
公开(公告)号：US20090226850A1
公开(公告)日：2009-09-10
申请号：US11720180
申请日：2005-11-28
申请人： Koichi Misumi , Koji Saito , Kaoru Ishikawa
发明人： Koichi Misumi , Koji Saito , Kaoru Ishikawa
IPC分类号： G03F7/20
CPC分类号： H05K3/108 , G03F7/0397 , G03F7/11 , H05K3/384 , H05K2201/0317
摘要： This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.
摘要翻译：制造抗蚀剂图案的方法包括：（a）具有铜的上表面的载体的层叠步骤，（b）由无机物质源供给的无机物质构成的无机物质层，（c）由化学放大型正性光致抗蚀剂组合物构成的光致抗蚀剂层，以获得光致抗蚀剂层压体，选择性地向所述光致抗蚀剂层压体照射活性光或放射线的步骤，以及将所述（c）光致抗蚀剂层与所述（b ）无机物质层以形成抗蚀剂图案。

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