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1. 发明申请

US20100068649A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMATION METHOD USING THE SAME 有权
标题翻译：光敏树脂组合物和使用其的图案形成方法
公开(公告)号：US20100068649A1
公开(公告)日：2010-03-18
申请号：US12449060
申请日：2008-01-11
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/20 , G03F7/004
CPC分类号： G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/0385 , G03F7/40
摘要： A photosensitive resin composition is provided that is highly safe, provides a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability. According to a photosensitive resin composition including, in addition to an onium fluorinated alkyl fluorophosphate based cation polymerization initiator having a specific structure, a specified solvent or a specified sensitizing agent as essential components, a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and also is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability.
摘要翻译：提供一种高度安全的感光性树脂组合物，提供均匀性优异的涂膜，可以提高固化树脂图案的固化密度，并且能够形成具有大膜厚度和高纵横比的微观抗蚀剂图案，灵敏度高，分辨能力高。根据具有特定结构的含氟氟烷基氟磷酸酯类阳离子聚合引发剂，特定溶剂或特定敏化剂作为必要成分的感光性树脂组合物，具有均匀性优异的涂膜可以提高固化密度固化树脂图案，并且还能够以高灵敏度和高分辨能力形成具有大膜厚度和高纵横比的微抗蚀剂图案。

2. 发明申请

US20110123928A1 Photosensitive Resin Composition and Pattern Forming Method Using the Same 有权
标题翻译：感光树脂组合物和使用其的图案形成方法
公开(公告)号：US20110123928A1
公开(公告)日：2011-05-26
申请号：US12223913
申请日：2007-02-15
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/004 , G03F7/20
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/0385
摘要： Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition.Means for Resolution: A photosensitive resin composition characterized by containing (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator and (c) an aromatic polycyclic compound as a sensitizer (such as 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene or 2,6-dihydroxynaphthalene), which has at least two substituents capable of forming cross-links with component (a).
摘要翻译：问题：提供一种具有高灵敏度的感光性树脂组合物，在加热下固化时能够容易地体积收缩，并且可以形成具有高外形轮廓的抗蚀剂图案，以及使用这种组合物的图案形成方法。解决方法：一种感光性树脂组合物，其特征在于，含有（a）多官能环氧树脂，（b）阳离子聚合引发剂和（c）作为敏化剂的芳香族多环化合物（如2,3-二羟基萘，二羟基萘或2,6-二羟基萘），其具有至少两个能够与组分（a）形成交联的取代基。

3. 发明授权

US08617795B2 Photosensitive resin composition and pattern forming method using the same 有权
标题翻译：感光树脂组合物和使用其的图案形成方法
公开(公告)号：US08617795B2
公开(公告)日：2013-12-31
申请号：US12223913
申请日：2007-02-15
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/40 , G03F7/004 , G03F7/038
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/0385
摘要： Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition.Means for Resolution: A photosensitive resin composition characterized by containing (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator and (c) an aromatic polycyclic compound as a sensitizer (such as 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene or 2,6-dihydroxynaphthalene), which has at least two substituents capable of forming cross-links with component (a).
摘要翻译：问题：提供一种具有高灵敏度的感光性树脂组合物，在加热下固化时能够容易地体积收缩，并且可以形成具有高外形轮廓的抗蚀剂图案，以及使用这种组合物的图案形成方法。解决方法：一种感光性树脂组合物，其特征在于，含有（a）多官能环氧树脂，（b）阳离子聚合引发剂和（c）作为敏化剂的芳香族多环化合物（如2,3-二羟基萘，二羟基萘或2,6-二羟基萘），其具有至少两个能够与组分（a）形成交联的取代基。

4. 发明授权

US08288078B2 Photosensitive resin composition, and pattern formation method using the same 有权
标题翻译：感光树脂组合物和使用其的图案形成方法
公开(公告)号：US08288078B2
公开(公告)日：2012-10-16
申请号：US12449060
申请日：2008-01-11
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/038 , G03F7/004 , G03F7/30
CPC分类号： G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/0385 , G03F7/40
摘要： A photosensitive resin composition is provided that is highly safe, provides a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability. According to a photosensitive resin composition including, in addition to an onium fluorinated alkyl fluorophosphate based cation polymerization initiator having a specific structure, a specified solvent or a specified sensitizing agent as essential components, a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and also is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability.
摘要翻译：提供一种高度安全的感光性树脂组合物，提供均匀性优异的涂膜，可以提高固化树脂图案的固化密度，并且能够形成具有大膜厚度和高纵横比的微观抗蚀剂图案，灵敏度高，分辨能力高。根据具有特定结构的含氟氟烷基氟磷酸酯类阳离子聚合引发剂，特定溶剂或特定敏化剂作为必要成分的感光性树脂组合物，具有均匀性优异的涂膜可以提高固化密度固化树脂图案，并且还能够以高灵敏度和高分辨能力形成具有大膜厚度和高纵横比的微抗蚀剂图案。

5. 发明申请

US20100068648A1 PHOTOSENSITIVE RESIN COMPOSITION, AND RESIST PATTERN FORMATION METHOD USING THE SAME 审中-公开
标题翻译：光敏树脂组合物，以及使用它的耐光图案形成方法
公开(公告)号：US20100068648A1
公开(公告)日：2010-03-18
申请号：US12448913
申请日：2008-01-11
申请人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
发明人： Takahiro Senzaki , Koichi Misumi , Atsushi Yamanouchi , Koji Saito
IPC分类号： G03F7/20 , G03F7/004
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/0048 , G03F7/0385 , G03F7/40
摘要： A photosensitive resin composition capable of controlling occurrence of defects and capable of forming a resist pattern having a favorable configuration, and a method for forming a resist pattern using the same are provided. According to a photosensitive resin composition including, as component (a), a polyfunctional epoxy resin, and, as component (b), a cation polymerization initiator, in which the concentration of propylene carbonate in the photosensitive resin composition is no greater than 10% by mass, the occurrence of defects can be controlled, and a resist pattern having a favorable shape can be formed.
摘要翻译：提供能够控制缺陷发生并且能够形成具有良好结构的抗蚀剂图案的光敏树脂组合物，以及使用其形成抗蚀剂图案的方法。根据包含作为组分（a）的多官能环氧树脂和作为组分（b））的光敏树脂组合物，其中感光性树脂组合物中的碳酸亚丙酯的浓度不大于10％，可以控制缺陷的发生，并且可以形成具有良好形状的抗蚀剂图案。

6. 发明授权

US08187408B2 Method of forming precision microspace, process for manufacturing member with precision microspace, and photosensitive laminated film 有权
标题翻译：精密微孔成型方法，精密微孔制造方法及感光层压薄膜
公开(公告)号：US08187408B2
公开(公告)日：2012-05-29
申请号：US12304974
申请日：2007-06-14
申请人： Atsushi Yamanouchi , Koichi Misumi , Takahiro Senzaki , Koji Saito
发明人： Atsushi Yamanouchi , Koichi Misumi , Takahiro Senzaki , Koji Saito
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： B32B37/0023 , B29C65/02 , B29C65/14 , B29C65/18 , B29C65/7894 , B29C66/4722 , B29C66/474 , B29C66/71 , B29C66/723 , B29C66/8362 , B29C66/9141 , B29C66/91421 , B29C66/91645 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/934 , B29C66/939 , B29L2016/00 , B29L2031/767 , B32B3/30 , B32B7/06 , B32B27/08 , B32B27/18 , B32B27/24 , B32B27/32 , B32B27/36 , B32B27/38 , B32B37/0046 , B32B2250/24 , B32B2307/308 , B32B2307/70 , B32B2307/734 , B32B2307/748 , Y10T156/10 , Y10T156/1043 , B29K2023/06 , B29K2023/12 , B29K2067/003
摘要： A method of forming a precision microspace with given configuration and volume; a process for manufacturing a member having a precision microspace with given configuration and volume; etc. There is provided a method of forming a precision microspace by the step of laying a film on a substratum having a precision microscopic depressed portion, comprising the steps of mounting such a substratum on a first stage and setting a second stage covering the outer circumference of the first stage so that the uppermost face of the second stage is higher than that of the first stage; and laying a film on the substratum to thereby obtain a precision microspace with given configuration and volume.
摘要翻译：形成具有给定配置和体积的精密微孔的方法; 用于制造具有给定配置和体积的精密微空间的构件的方法; 提供了一种通过将膜放置在具有精密微小凹部的基底上的步骤来形成精密微空间的方法，包括以下步骤：将这种基底安装在第一阶段上，并设置覆盖外周的第二阶段使得第二阶段的最上面的面高于第一阶段的最上面; 并在基底上铺上薄膜，从而获得具有给定配置和体积的精密微孔。

7. 发明申请

US20080311512A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PATTERN FORMING 审中-公开
标题翻译：光敏树脂组合物和形成图案的方法
公开(公告)号：US20080311512A1
公开(公告)日：2008-12-18
申请号：US12136438
申请日：2008-06-10
申请人： Takahiro Senzaki , Atsushi Yamanouchi , Junzo Yonekura , Koji Saito
发明人： Takahiro Senzaki , Atsushi Yamanouchi , Junzo Yonekura , Koji Saito
IPC分类号： G03F7/004 , G03F7/20
CPC分类号： G03F7/085 , G03F7/0045 , G03F7/038 , H05K3/0076 , H05K3/389 , H05K2203/122
摘要： A photosensitive resin composition, which displays superior adhesion with substrates when forming a film and can form fine resin patterns with larger film thicknesses and higher aspect ratios, and a method for forming a pattern using the same are provided. Diphenyl sulfone or derivatives thereof are included into the photosensitive resin composition as an adhesion enhancer. Preferably, the diphenyl sulfone derivative is derived by substituting at least one hydrogen atom of diphenyl sulfone with an amino group, a nitro group, hydroxyl group, carboxyl group, fluorine atom, chlorine atom or acid anhydride.
摘要翻译：一种感光性树脂组合物，其在形成膜时显示出与基材的优异的粘合性，并且可以形成具有更大膜厚和更高纵横比的精细树脂图案，并且提供了使用其形成图案的方法。将二苯基砜或其衍生物作为粘合增强剂包含在感光性树脂组合物中。优选地，通过用氨基，硝基，羟基，羧基，氟原子，氯原子或酸酐取代二苯基砜的至少一个氢原子而得到二苯基砜衍生物。

8. 发明申请

US20090173433A1 METHOD OF FORMING PRECISION MICROSPACE, PROCESS FOR MANUFACTURING MEMBER WITH PRECISION MICROSPACE, AND PHOTOSENSITIVE LAMINATED FILM 有权
标题翻译：形成精密微孔的方法，具有精密微观制造成员的方法和感光层压膜
公开(公告)号：US20090173433A1
公开(公告)日：2009-07-09
申请号：US12304974
申请日：2007-06-14
申请人： Atsushi Yamanouchi , Koichi Misumi , Takahari Senzaki , Koji Saito
发明人： Atsushi Yamanouchi , Koichi Misumi , Takahari Senzaki , Koji Saito
IPC分类号： B32B37/00
CPC分类号： B32B37/0023 , B29C65/02 , B29C65/14 , B29C65/18 , B29C65/7894 , B29C66/4722 , B29C66/474 , B29C66/71 , B29C66/723 , B29C66/8362 , B29C66/9141 , B29C66/91421 , B29C66/91645 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/934 , B29C66/939 , B29L2016/00 , B29L2031/767 , B32B3/30 , B32B7/06 , B32B27/08 , B32B27/18 , B32B27/24 , B32B27/32 , B32B27/36 , B32B27/38 , B32B37/0046 , B32B2250/24 , B32B2307/308 , B32B2307/70 , B32B2307/734 , B32B2307/748 , Y10T156/10 , Y10T156/1043 , B29K2023/06 , B29K2023/12 , B29K2067/003
摘要： A method of forming a precision microspace with given configuration and volume; a process for manufacturing a member having a precision microspace with given configuration and volume; etc. There is provided a method of forming a precision microspace by the step of laying a film on a substratum having a precision microscopic depressed portion, comprising the steps of mounting such a substratum on a first stage and setting a second stage covering the outer circumference of the first stage so that the uppermost face of the second stage is higher than that of the first stage; and laying a film on the substratum to thereby obtain a precision microspace with given configuration and volume.
摘要翻译：形成具有给定配置和体积的精密微孔的方法; 用于制造具有给定构造和体积的精密微空间的构件的方法; 提供了一种通过将膜放置在具有精密微小凹部的基底上的步骤来形成精密微空间的方法，包括以下步骤：将这种基底安装在第一阶段上并设置覆盖外周的第二阶段使得第二阶段的最上面的面高于第一阶段的最上面; 并在基底上铺上薄膜，从而获得具有给定配置和体积的精密微孔。

9. 发明申请

US20070078072A1 Photoresist stripping solution 审中-公开
标题翻译：光阻剥离溶液
公开(公告)号：US20070078072A1
公开(公告)日：2007-04-05
申请号：US11431750
申请日：2006-05-11
申请人： Shigeru Yokoi , Atsushi Yamanouchi
发明人： Shigeru Yokoi , Atsushi Yamanouchi
IPC分类号： C11D7/32
CPC分类号： C11D11/0047 , C11D7/06 , C11D7/261 , C11D7/263 , C11D7/34 , C11D7/5004
摘要： Disclosed is a photoresist stripping solution consisting essentially of (a) a quaternary ammonium hydroxide (e.g., tetramethylammonium hydroxide), (b) at least one water-soluble organic solvent selected from glycols and glycol ethers (e.g., propylene glycol, ethylene glycol, diethylene glycol monobutyl ether), and (c) a non-amine water-soluble organic solvent (e.g., dimethyl sulfoxide, N-methyl-2-pyrrolidone). The photoresist stripping solution of the invention has an excellent photoresist strippability, not causing damage of swelling/coloration to acrylic transparent films used in production of liquid-crystal panels and not causing damage to electrode materials. In particular, it has an excellent photoresist strippability to remove even a thick-film negative photoresist (photosensitive dry film) used in production of semiconductor chip packages (especially, wafer-level chip size packages, W-CSP), not causing damage to copper.
摘要翻译：公开了一种基本上由（a）季铵氢氧化物（例如四甲基氢氧化铵），（b）至少一种选自二醇和二醇醚的水溶性有机溶剂（例如丙二醇，乙二醇，二乙烯）的光致抗蚀剂剥离溶液乙二醇单丁醚）和（c）非胺水溶性有机溶剂（例如二甲基亚砜，N-甲基-2-吡咯烷酮）。本发明的光致抗蚀剂剥离溶液具有优异的光致抗蚀剂剥离性，不会对生产液晶面板使用的丙烯酸类透明膜造成溶胀/着色的损伤，并且不会对电极材料造成损害。特别是具有良好的光致抗蚀剂剥离性，即使在半导体芯片封装（特别是晶片级芯片尺寸封装，W-CSP）的生产中使用的厚膜负性光致抗蚀剂（感光性干膜）也能够除去，不会对铜造成损害。

10. 发明授权

US08114825B2 Photoresist stripping solution 有权
标题翻译：光阻剥离溶液
公开(公告)号：US08114825B2
公开(公告)日：2012-02-14
申请号：US12585973
申请日：2009-09-30
申请人： Shigeru Yokoi , Atsushi Yamanouchi
发明人： Shigeru Yokoi , Atsushi Yamanouchi
IPC分类号： C11D7/50
CPC分类号： C11D11/0047 , C11D7/06 , C11D7/261 , C11D7/263 , C11D7/34 , C11D7/5004
摘要： Disclosed is a photoresist stripping solution consisting essentially of (a) a quaternary ammonium hydroxide (e.g., tetramethylammonium hydroxide), (b) at least one water-soluble organic solvent selected from glycols and glycol ethers (e.g., propylene glycol, ethylene glycol, diethylene glycol monobutyl ether), and (c) a non-amine water-soluble organic solvent (e.g., dimethyl sulfoxide, N-methyl-2-pyrrolidone). The photoresist stripping solution of the invention has an excellent photoresist strippability, not causing damage of swelling/coloration to acrylic transparent films used in production of liquid-crystal panels and not causing damage to electrode materials. In particular, it has an excellent photoresist strippability to remove even a thick-film negative photoresist (photosensitive dry film) used in production of semiconductor chip packages (especially, wafer-level chip size packages, W-CSP), not causing damage to copper.
摘要翻译：公开了一种基本上由（a）季铵氢氧化物（例如四甲基氢氧化铵），（b）至少一种选自二醇和二醇醚的水溶性有机溶剂（例如丙二醇，乙二醇，二乙烯）的光致抗蚀剂剥离溶液乙二醇单丁醚）和（c）非胺水溶性有机溶剂（例如二甲基亚砜，N-甲基-2-吡咯烷酮）。本发明的光致抗蚀剂剥离溶液具有优异的光致抗蚀剂剥离性，不会对生产液晶面板使用的丙烯酸类透明膜造成溶胀/着色的损伤，并且不会对电极材料造成损害。特别是具有良好的光致抗蚀剂剥离性，即使在半导体芯片封装（特别是晶片级芯片尺寸封装，W-CSP）的生产中使用的厚膜负性光致抗蚀剂（感光性干膜）也能够除去，不会对铜造成损害。

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