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    • 3. 发明申请
    • NITRIDE SEMICONDUCTOR DEVICE
    • 氮化物半导体器件
    • US20100117061A1
    • 2010-05-13
    • US12350188
    • 2009-01-07
    • Suk Ho YOONKi Ho ParkJoong Kon Son
    • Suk Ho YOONKi Ho ParkJoong Kon Son
    • H01L29/12
    • H01L33/06
    • There is provided a nitride semiconductor device. A nitride semiconductor device according to an aspect of the invention may include: an n-type nitride semiconductor layer; a p-type nitride semiconductor layer; an active layer provided between the n-type and p-type nitride semiconductor layers and having quantum well layers and quantum barrier layers alternately stacked on each other; and an electron blocking layer provided between the active layer and the p-type nitride semiconductor layer, and having a plurality of first nitride layers formed of a material having a higher band gap energy than the quantum barrier layers and a plurality of second nitride layers formed of a material having a lower band gap energy than the first nitride layers, the first and second nitride layers alternately stacked on each other to form a stacked structure, wherein the plurality of first nitride layers have energy levels bent at predetermined inclinations, and with greater proximity to the p-type nitride semiconductor layer, the first nitride layers have a smaller inclination of the energy level.
    • 提供一种氮化物半导体器件。 根据本发明的一个方面的氮化物半导体器件可以包括:n型氮化物半导体层; p型氮化物半导体层; 设置在n型和p型氮化物半导体层之间并且具有彼此交替堆叠的量子阱层和量子势垒层的有源层; 以及设置在有源层和p型氮化物半导体层之间的电子阻挡层,并且具有由具有比量子势垒层更高的带隙能量的材料形成的多个第一氮化物层和形成的多个第二氮化物层 具有比第一氮化物层低的带隙能量的材料,第一和第二氮化物层彼此交替堆叠以形成堆叠结构,其中多个第一氮化物层具有以预定倾斜度弯曲的能级,并且具有更大的 靠近p型氮化物半导体层,第一氮化物层具有较小的能级倾斜度。
    • 4. 发明申请
    • MICROACTUATOR USING BUBBLE GROWTH AND DESTRUCTION
    • 微生物使用泡沫生长和破坏
    • US20140047823A1
    • 2014-02-20
    • US14113972
    • 2012-05-11
    • Sung-Il KimKi-Ho ParkWon-Pyo ChunKye-Jung Lee
    • Sung-Il KimKi-Ho ParkWon-Pyo ChunKye-Jung Lee
    • F15B21/04
    • F15B21/042F03G7/06F15B15/00F15B2015/208Y10T137/2196
    • Disclosed is a microactuator using growth and destruction of bubbles including a first chamber provided with a heating plate installed at an exterior of a bottom surface of the first chamber to generate heat, and filled with a first liquid working fluid such that bubbles are caused, by heat, to grow at an interface of a cavity on an inner surface of the first chamber to be heated, a second chamber provided with a heating plate installed at an exterior of a bottom surface of the second chamber to generate heat, and filled with a second liquid working fluid such that bubbles are caused, by heat, to grow at an interface of a cavity on an inner surface of the second chamber to be heated, a connection path to connect the first chamber and the second chamber to each other, the connection path being provided therein with a moving member adapted to isolate the first and second chambers from each other and to move when internal pressure changes according to growth and destruction of the bubbles, a first subline to connect the connection path to the second chamber such that the first working fluid moves the moving member to one side and is guided to the second chamber according to increase in the internal pressure by growth of the bubbles in the first chamber, a second subline to connect the connection path to the first chamber such that the second working fluid moves the moving member to the other side and is guided to the first chamber according to increase in internal pressure by growth of the bubbles in the second chamber, and a plurality of cooling means installed on the first subline and the second subline to destroy bubbles produced in the first and second chambers.
    • 公开了一种使用气泡生长和破坏的微致动器,其包括设置有安装在第一室的底表面的外部的加热板的第一室,以产生热量,并且填充有引起气泡的第一液体工作流体,通过 加热,以在待加热的第一室的内表面上的腔的界面处生长;第二室,设置有加热板,该加热板安装在第二室的底表面的外部以产生热量,并且填充有 第二液体工作流体,使得通过热引起气泡在待加热的第二室的内表面上的空腔的界面处生长,将第一室和第二室彼此连接的连接路径, 连接路径在其中设置有适于将第一和第二腔室彼此隔离并且当内部压力根据气泡的生长和破坏而改变时移动的移动构件 连接路径到第二室的第一子线,使得第一工作流体将移动构件移动到一侧,并且通过第一室中的气泡的增长随着内部压力的增加而被引导到第二室, 将连接路径连接到第一室的第二子管,使得第二工作流体将移动构件移动到另一侧,并且通过第二室中的气泡的生长随内部压力的增加而被引导到第一室;以及 多个冷却装置,安装在第一副线和第二子线上,以破坏在第一和第二室中产生的气泡。
    • 6. 发明授权
    • Nitride semiconductor device
    • 氮化物半导体器件
    • US07868316B2
    • 2011-01-11
    • US12350188
    • 2009-01-07
    • Suk Ho YoonKi Ho ParkJoong Kon Son
    • Suk Ho YoonKi Ho ParkJoong Kon Son
    • H01L33/06
    • H01L33/06
    • There is provided a nitride semiconductor device. A nitride semiconductor device according to an aspect of the invention may include: an n-type nitride semiconductor layer; a p-type nitride semiconductor layer; an active layer provided between the n-type and p-type nitride semiconductor layers and having quantum well layers and quantum barrier layers alternately stacked on each other; and an electron blocking layer provided between the active layer and the p-type nitride semiconductor layer, and having a plurality of first nitride layers formed of a material having a higher band gap energy than the quantum barrier layers and a plurality of second nitride layers formed of a material having a lower band gap energy than the first nitride layers, the first and second nitride layers alternately stacked on each other to form a stacked structure, wherein the plurality of first nitride layers have energy levels bent at predetermined inclinations, and with greater proximity to the p-type nitride semiconductor layer, the first nitride layers have a smaller inclination of the energy level.
    • 提供一种氮化物半导体器件。 根据本发明的一个方面的氮化物半导体器件可以包括:n型氮化物半导体层; p型氮化物半导体层; 设置在n型和p型氮化物半导体层之间并且具有彼此交替堆叠的量子阱层和量子势垒层的有源层; 以及设置在有源层和p型氮化物半导体层之间的电子阻挡层,并且具有由具有比量子势垒层更高的带隙能量的材料形成的多个第一氮化物层和形成的多个第二氮化物层 具有比第一氮化物层低的带隙能量的材料,第一和第二氮化物层彼此交替堆叠以形成堆叠结构,其中多个第一氮化物层具有以预定倾斜度弯曲的能级,并且具有更大的 靠近p型氮化物半导体层,第一氮化物层具有较小的能级倾斜度。
    • 9. 发明授权
    • Microactuator using bubble growth and destruction
    • 微致动器使用气泡生长和破坏
    • US09103360B2
    • 2015-08-11
    • US14113972
    • 2012-05-11
    • Sung-Il KimKi-Ho ParkWon-Pyo ChunKye-Jung Lee
    • Sung-Il KimKi-Ho ParkWon-Pyo ChunKye-Jung Lee
    • F01P1/00F01B1/00F02G1/02F15B21/04F15B15/00F03G7/06F15B15/20
    • F15B21/042F03G7/06F15B15/00F15B2015/208Y10T137/2196
    • Disclosed is a microactuator using growth and destruction of bubbles including a first chamber provided with a heating plate installed at an exterior of a bottom surface of the first chamber to generate heat, and filled with a first liquid working fluid such that bubbles are caused, by heat, to grow at an interface of a cavity on an inner surface of the first chamber to be heated, a second chamber provided with a heating plate installed at an exterior of a bottom surface of the second chamber to generate heat, and filled with a second liquid working fluid such that bubbles are caused, by heat, to grow at an interface of a cavity on an inner surface of the second chamber to be heated, a connection path to connect the first chamber and the second chamber to each other, the connection path being provided therein with a moving member adapted to isolate the first and second chambers from each other and to move when internal pressure changes according to growth and destruction of the bubbles, a first subline to connect the connection path to the second chamber such that the first working fluid moves the moving member to one side and is guided to the second chamber according to increase in the internal pressure by growth of the bubbles in the first chamber, a second subline to connect the connection path to the first chamber such that the second working fluid moves the moving member to the other side and is guided to the first chamber according to increase in internal pressure by growth of the bubbles in the second chamber, and a plurality of cooling means installed on the first subline and the second subline to destroy bubbles produced in the first and second chambers.
    • 公开了一种使用气泡生长和破坏的微致动器,其包括设置有安装在第一室的底表面的外部的加热板的第一室,以产生热量,并且填充有引起气泡的第一液体工作流体,通过 加热,以在待加热的第一室的内表面上的腔的界面处生长;第二室,设置有加热板,该加热板安装在第二室的底表面的外部以产生热量,并且填充有 第二液体工作流体,使得通过热引起气泡在待加热的第二室的内表面上的空腔的界面处生长,将第一室和第二室彼此连接的连接路径, 连接路径在其中设置有适于将第一和第二腔室彼此隔离并且当内部压力根据气泡的生长和破坏而改变时移动的移动构件 连接路径到第二室的第一子线,使得第一工作流体将移动构件移动到一侧,并且通过第一室中的气泡的增长随着内部压力的增加而被引导到第二室, 将连接路径连接到第一室的第二子管,使得第二工作流体将移动构件移动到另一侧,并且通过第二室中的气泡的生长随内部压力的增加而被引导到第一室;以及 多个冷却装置,安装在第一副线和第二子线上,以破坏在第一和第二室中产生的气泡。