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1. 发明授权

US08825276B2 Maintenance systems and methods for use in analyzing maintenance data 有权
标题翻译：用于分析维护数据的维护系统和方法
公开(公告)号：US08825276B2
公开(公告)日：2014-09-02
申请号：US13242652
申请日：2011-09-23
申请人： Peter James Lake , Davis Scott Kinney , Anne Kao , Stephen R. Poteet , Steven C. Runo , Jay Kevin McCullough , Steven D. Chapman , Yun-Ho Sikora , David Charles Augustine
发明人： Peter James Lake , Davis Scott Kinney , Anne Kao , Stephen R. Poteet , Steven C. Runo , Jay Kevin McCullough , Steven D. Chapman , Yun-Ho Sikora , David Charles Augustine
IPC分类号： G07C5/08 , G05B23/02
CPC分类号： G07C5/0808 , G05B23/0229 , G05B23/0248 , G05B23/0275 , G05B23/0278 , G05B23/0281 , G05B23/0283
摘要： Methods and maintenance systems for use in analyzing data related to maintenance of at least one vehicle are disclosed. One example method includes receiving at least one fault message, receiving a maintenance event log for a vehicle. The maintenance event log including at least one maintenance event associated with the at least one fault message. The example method further includes automatically identifying a corrective action within a most recent maintenance event of the at least one maintenance event and storing a diagnostic entry including the at least one fault message and the identified corrective action, such that the diagnostic entry is retrievable from the computing device to evaluate a subsequent like fault message.
摘要翻译：公开了用于分析与至少一辆车辆的维护有关的数据的方法和维护系统。一个示例性方法包括接收至少一个故障消息，接收车辆的维护事件日志。所述维护事件日志包括与所述至少一个故障消息相关联的至少一个维护事件。所述示例性方法还包括自动识别所述至少一个维护事件的最新维护事件内的纠正措施，并且存储包括所述至少一个故障消息和所识别的校正动作的诊断条目，使得所述诊断条目可从计算设备来评估随后的类似故障消息。

2. 发明申请

US20070264513A1 MOLDING COMPOSITION FOR FORMING IN-MOLD METALLIZED POLYMER COMPONENTS 失效
标题翻译：用于形成模内金属化聚合物组分的模塑组合物
公开(公告)号：US20070264513A1
公开(公告)日：2007-11-15
申请号：US11782061
申请日：2007-07-24
申请人： Kevin McCullough
发明人： Kevin McCullough
IPC分类号： B32B15/08 , B29B9/00
CPC分类号： B29C45/0013 , B29C2045/0015 , B29K2055/02 , B29K2069/00 , B29K2081/04 , B29K2705/00 , B29K2705/06 , B29L2009/003 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31699 , Y10T428/31935
摘要： A method is provided for forming a feedstock material for use in net shape molded component that includes an integral metallized coating or layer on the exterior surface thereof. The feedstock includes a carefully matched mixture of polymer resin and a metallic alloy that is suitable for use in a molding method that includes melting and injecting the material into a mold cavity under pressure. Due to the differential in material viscosities, the metal tends to migrate to the outer surface of the molded part when placed under pressure, ultimately creating a net shape molded part having a polymer core with a metallic layer at the exterior surfaces thereof.
摘要翻译：提供一种用于形成用于净形状模制部件的原料材料的方法，其中包括在其外表面上的整体金属化涂层或层。原料包括聚合物树脂和金属合金的精心匹配的混合物，其适用于包括在压力下将材料熔融和注入模腔中的模制方法中使用。由于材料粘度的差异，当放置在压力下时，金属倾向于迁移到模制部件的外表面，最终形成具有在其外表面处具有金属层的聚合物芯的网状模制部件。

3. 发明申请

US20050109766A1 Method for making thermoplastic thermally-conductive interface articles 失效
标题翻译：制造热塑性导热界面制品的方法
公开(公告)号：US20050109766A1
公开(公告)日：2005-05-26
申请号：US11014613
申请日：2004-12-16
申请人： James Miller , Kevin McCullough , E. Sagal , Jeffrey Panek
发明人： James Miller , Kevin McCullough , E. Sagal , Jeffrey Panek
IPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , H05B3/58
CPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , F28F2013/006
摘要： A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.
摘要翻译：提供了制造热塑性导热界面制品的方法。用于制备界面制品的方法涉及将可模压组合物注塑成型成型件。可成型组合物包含基础热塑性弹性体基质，导热填料和温度活化的相变材料。导热制品可以用作热界面以从发热电子器件散发热量。

4. 发明授权

US06620497B2 Polymer composition with boron nitride coated carbon flakes 有权
标题翻译：聚合物组合物与氮化硼涂覆的碳薄片
公开(公告)号：US06620497B2
公开(公告)日：2003-09-16
申请号：US09757895
申请日：2001-01-10
申请人： Lyle James Smith , E. Mikhail Sagal , James D. Miller , Kevin McCullough
发明人： Lyle James Smith , E. Mikhail Sagal , James D. Miller , Kevin McCullough
IPC分类号： B32B1800
CPC分类号： C08K9/02 , B29C45/00 , B29K2105/16 , B29K2995/0007 , B29K2995/0013 , B29L2031/3061 , Y10T428/25 , Y10T428/252 , Y10T428/29 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993
摘要： A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.
摘要翻译：提供导热和电绝缘聚合物组合物及其制备方法。导热填充材料涂覆有导热和电绝缘涂层材料，并与基础聚合物基体混合。将混合物模塑成所需的形状。电绝缘涂层材料防止电穿过填料，从而导致电绝缘组合物。

5. 发明申请

US20060250746A1 IONIC FLOW GENERATOR FOR THERMAL MANAGEMENT 有权
标题翻译：用于热管理的离子流量发生器
公开(公告)号：US20060250746A1
公开(公告)日：2006-11-09
申请号：US11381571
申请日：2006-05-04
申请人： Kevin McCullough
发明人： Kevin McCullough
IPC分类号： B05B5/03
CPC分类号： H01T23/00
摘要： The apparatus for generating ionic flow of media includes a DC voltage supply having a positive terminal and a negative terminal with a collector connected to the negative terminal of the direct current voltage supply. The collector has a substantially tubular configuration with a rear and front section with inwardly tapering frusto-conical section therebetween. An emitter pin is connected to the positive terminal of the direct current voltage supply with the majority of the tip being located within the frusto-conical section of the collector. Alternatively, the front section of the collector may be made of a dielectric material, such as plastic. As a result, fluid flow, such as air flow, is generated from the input port of the rear section of the collector, through the frusto-conical section of the collector and out the output port of the front section of the collector.
摘要翻译：用于产生介质离子流的装置包括具有正极端子和负极端子的直流电压源，集电极连接到直流电压源的负极端子。收集器具有基本上管状的构造，其具有后部和前部，其间具有向内渐缩的截头圆锥形截面。发射极引脚连接到直流电压源的正极端子，大部分尖端位于集电极的截头圆锥形部分内。或者，收集器的前部可由介电材料制成，例如塑料。结果，从收集器的后部的输入端口通过收集器的截头圆锥形部分并且从收集器的前部的输出端口出来，产生诸如空气流的流体流。

6. 发明申请

US20060243316A1 MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：可弯曲式传热装置及其制造方法
公开(公告)号：US20060243316A1
公开(公告)日：2006-11-02
申请号：US11380300
申请日：2006-04-26
申请人： Kevin McCullough
发明人： Kevin McCullough
IPC分类号： H01L35/30
CPC分类号： H01L35/32 , H01L23/38 , H01L35/26 , H01L35/34 , H01L2924/0002 , H01L2924/00
摘要： A thermal transfer device includes a body member having a base material of a first semiconductor material of a first type with a filler material dispersed therein of a second semiconductor material of a second type. Electrodes are attached on sides of the body member and electrical current is run therethrough to create thermal flow using the Peltier effect. The device is formed by injection molding and the like and the filler is introduced into the base by, for example, extrusion or pultrusion processes.
摘要翻译：热转印装置包括：本体构件，其具有第一类型的第一半导体材料的基材，其中分散有第二类型的第二半导体材料的填充材料。电极附着在主体部件的侧面，电流穿过其中，以利用珀耳帖效应产生热流。该装置通过注射成型等形成，并且通过例如挤出或拉挤成型方法将填料引入基底。

7. 发明申请

US20060231231A1 METHOD OF TWO SHOT MOLD METALLIZING OF POLYMER COMPONENTS 审中-公开
标题翻译：聚合物组分的两种模制金属化方法
公开(公告)号：US20060231231A1
公开(公告)日：2006-10-19
申请号：US11379295
申请日：2006-04-19
申请人： Kevin McCULLOUGH
发明人： Kevin McCULLOUGH
IPC分类号： B22D17/08 , B22D19/00 , B22D19/08
CPC分类号： B22D19/08 , B22D19/16 , B29C45/16 , B29C2045/1696
摘要： A component is provided that is net shape molded using a polymer to form the core structure and which includes an integrally formed metallized coating or layer on at least one of the exterior surfaces thereof. The process of forming the component includes two-shot molding process wherein a thin layer of metal or the base polymer component is molded, the mold is adjusted and then the remainder of the part is molded. Alternately, an insert molding process may be employed such that after the polymer base part is formed, it may be placed into a mold cavity that is slightly larger than the entire part, thereby allowing substantially the entire exterior surface of the part to be over molded with a molten metal.
摘要翻译：提供了使用聚合物成型以形成芯结构并且在其至少一个外表面上包括整体形成的金属化涂层或层的网状部件。形成部件的方法包括双模成型工艺，其中模制金属或基础聚合物组分的薄层，模具被调节，然后其余部分被模制。或者，可以采用插入成型工艺，使得在形成聚合物基底部件之后，可以将其放置在比整个部分稍大的模具腔中，从而基本上使部件的整个外表面过度模制与熔融金属。

8. 发明申请

US20050209383A1 Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same 审中-公开
标题翻译：用于电子电路的导热塑料基板及其制造方法
公开(公告)号：US20050209383A1
公开(公告)日：2005-09-22
申请号：US11129121
申请日：2005-05-13
申请人： James Miller , E. Sagal , Kevin McCullough
发明人： James Miller , E. Sagal , Kevin McCullough
IPC分类号： B29C45/00 , C08K3/22 , C08K3/28 , C08K3/38 , H05K1/03 , C08K3/40
CPC分类号： B29C45/0013 , B29K2081/04 , B29K2105/06 , B29K2105/16 , B29K2995/0007 , B29K2995/0013 , B29L2031/3406 , C08K3/22 , C08K3/28 , C08K3/38 , H05K1/0373 , H05K2201/0129 , H05K2201/0209 , H05K2201/09118
摘要： A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.
摘要翻译：提供了一种用于支撑电子电路的导热塑料基板。该基板具有相对低的介电常数和良好的机械强度。衬底由包含基础聚合物基质和导热的电绝缘材料的聚合物组合物制成。组合物可以包含聚苯硫醚和氮化硼。该组合物还可以包括诸如玻璃的增强材料。本发明还包括制备这种基材的方法。

9. 发明申请

US20050110380A1 Method for making thermally-conductive plastic articles having light reflecting surfaces 审中-公开
标题翻译：制造具有光反射表面的导热塑料制品的方法
公开(公告)号：US20050110380A1
公开(公告)日：2005-05-26
申请号：US11014514
申请日：2004-12-16
申请人： Kevin McCullough , James Miller , E. Sagal
发明人： Kevin McCullough , James Miller , E. Sagal
IPC分类号： B29C45/00 , B29C70/88 , C08K3/04 , F21V7/22 , F21V29/505 , H01J5/16 , H01J61/40 , H01K1/26 , H01K1/30
CPC分类号： B29C70/88 , B29C45/0013 , B29K2995/0013 , B29K2995/003 , B29L2011/0083 , C08K3/04 , F21S41/37 , F21V7/22 , F21V29/505 , F21W2103/00 , Y10T428/1355 , Y10T428/31504 , Y10T428/31507
摘要： A method for making molded reflector articles having light-reflecting surfaces is provided. The method involves injection-molding a thermally-conductive, polymer composition comprising: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The method can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures.
摘要翻译：提供了一种制造具有光反射表面的模制反射器制品的方法。该方法包括注塑成型导热聚合物组合物，其包含：a）约20重量％至约80重量％的基础聚合物基质如聚碳酸酯; 和b）约20重量％至约80重量％的导热碳材料如石墨。该方法可用于制造反射器制品，例如用于汽车尾灯，头灯和其他照明器具的外壳。

10. 发明申请

US20050095901A1 Thermally conductive electronic connector having molded housing 有权
标题翻译：具有模制外壳的导热电子连接器
公开(公告)号：US20050095901A1
公开(公告)日：2005-05-05
申请号：US11011996
申请日：2004-12-14
申请人： James Miller , E. Sagal , Kevin McCullough
发明人： James Miller , E. Sagal , Kevin McCullough
IPC分类号： G02B6/38 , G02B6/42 , H05K7/20 , H05K9/00 , H01R13/00
CPC分类号： H05K9/0083 , G02B6/3814 , G02B6/4201 , G02B6/4246 , G02B6/4272 , G02B6/4277 , G02B6/4284 , H05K7/20
摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.
摘要翻译：提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。外壳在电路板和发热部件上模制。壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。模制外壳能够散发来自发热部件的热量。还提供了制造电子连接器的方法。

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