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1. 发明申请

US20050189523A1 Polymer electronic device package having high thermal conductivity and dielectric strength 失效
标题翻译：具有高导热性和介电强度的聚合物电子器件封装
公开(公告)号：US20050189523A1
公开(公告)日：2005-09-01
申请号：US11118057
申请日：2005-04-29
申请人： E. Sagal , Kevin McCullough , James Miller
发明人： E. Sagal , Kevin McCullough , James Miller
IPC分类号： C08K3/22 , C08K3/28 , H01B3/30 , H01B1/00
CPC分类号： C08K3/22 , C08K3/28 , H01B3/30 , H01B3/301
摘要： A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
摘要翻译：提供了具有高导热性和介电强度的聚合物组合物。聚合物组合物包含基础聚合物基质和导热的电绝缘材料。可以在组合物中添加玻璃等增强材料。聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

2. 发明申请

US20050109766A1 Method for making thermoplastic thermally-conductive interface articles 失效
标题翻译：制造热塑性导热界面制品的方法
公开(公告)号：US20050109766A1
公开(公告)日：2005-05-26
申请号：US11014613
申请日：2004-12-16
申请人： James Miller , Kevin McCullough , E. Sagal , Jeffrey Panek
发明人： James Miller , Kevin McCullough , E. Sagal , Jeffrey Panek
IPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , H05B3/58
CPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , F28F2013/006
摘要： A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.
摘要翻译：提供了制造热塑性导热界面制品的方法。用于制备界面制品的方法涉及将可模压组合物注塑成型成型件。可成型组合物包含基础热塑性弹性体基质，导热填料和温度活化的相变材料。导热制品可以用作热界面以从发热电子器件散发热量。

3. 发明申请

US20050209383A1 Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same 审中-公开
标题翻译：用于电子电路的导热塑料基板及其制造方法
公开(公告)号：US20050209383A1
公开(公告)日：2005-09-22
申请号：US11129121
申请日：2005-05-13
申请人： James Miller , E. Sagal , Kevin McCullough
发明人： James Miller , E. Sagal , Kevin McCullough
IPC分类号： B29C45/00 , C08K3/22 , C08K3/28 , C08K3/38 , H05K1/03 , C08K3/40
CPC分类号： B29C45/0013 , B29K2081/04 , B29K2105/06 , B29K2105/16 , B29K2995/0007 , B29K2995/0013 , B29L2031/3406 , C08K3/22 , C08K3/28 , C08K3/38 , H05K1/0373 , H05K2201/0129 , H05K2201/0209 , H05K2201/09118
摘要： A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.
摘要翻译：提供了一种用于支撑电子电路的导热塑料基板。该基板具有相对低的介电常数和良好的机械强度。衬底由包含基础聚合物基质和导热的电绝缘材料的聚合物组合物制成。组合物可以包含聚苯硫醚和氮化硼。该组合物还可以包括诸如玻璃的增强材料。本发明还包括制备这种基材的方法。

4. 发明申请

US20050110380A1 Method for making thermally-conductive plastic articles having light reflecting surfaces 审中-公开
标题翻译：制造具有光反射表面的导热塑料制品的方法
公开(公告)号：US20050110380A1
公开(公告)日：2005-05-26
申请号：US11014514
申请日：2004-12-16
申请人： Kevin McCullough , James Miller , E. Sagal
发明人： Kevin McCullough , James Miller , E. Sagal
IPC分类号： B29C45/00 , B29C70/88 , C08K3/04 , F21V7/22 , F21V29/505 , H01J5/16 , H01J61/40 , H01K1/26 , H01K1/30
CPC分类号： B29C70/88 , B29C45/0013 , B29K2995/0013 , B29K2995/003 , B29L2011/0083 , C08K3/04 , F21S41/37 , F21V7/22 , F21V29/505 , F21W2103/00 , Y10T428/1355 , Y10T428/31504 , Y10T428/31507
摘要： A method for making molded reflector articles having light-reflecting surfaces is provided. The method involves injection-molding a thermally-conductive, polymer composition comprising: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The method can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures.
摘要翻译：提供了一种制造具有光反射表面的模制反射器制品的方法。该方法包括注塑成型导热聚合物组合物，其包含：a）约20重量％至约80重量％的基础聚合物基质如聚碳酸酯; 和b）约20重量％至约80重量％的导热碳材料如石墨。该方法可用于制造反射器制品，例如用于汽车尾灯，头灯和其他照明器具的外壳。

5. 发明申请

US20050095901A1 Thermally conductive electronic connector having molded housing 有权
标题翻译：具有模制外壳的导热电子连接器
公开(公告)号：US20050095901A1
公开(公告)日：2005-05-05
申请号：US11011996
申请日：2004-12-14
申请人： James Miller , E. Sagal , Kevin McCullough
发明人： James Miller , E. Sagal , Kevin McCullough
IPC分类号： G02B6/38 , G02B6/42 , H05K7/20 , H05K9/00 , H01R13/00
CPC分类号： H05K9/0083 , G02B6/3814 , G02B6/4201 , G02B6/4246 , G02B6/4272 , G02B6/4277 , G02B6/4284 , H05K7/20
摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.
摘要翻译：提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。外壳在电路板和发热部件上模制。壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。模制外壳能够散发来自发热部件的热量。还提供了制造电子连接器的方法。

6. 发明授权

US06976769B2 Light-emitting diode reflector assembly having a heat pipe 失效
标题翻译：具有热管的发光二极管反射器组件
公开(公告)号：US06976769B2
公开(公告)日：2005-12-20
申请号：US10459234
申请日：2003-06-11
申请人： Kevin McCullough , James Miller , E. Mikhail Sagal
发明人： Kevin McCullough , James Miller , E. Mikhail Sagal
IPC分类号： B29C45/00 , B29C45/14 , F21V7/20 , F21V7/22 , F21V15/01 , F21V29/00 , F28D15/02
CPC分类号： F21V29/51 , B29C45/006 , B29C45/14598 , B29L2031/747 , F21S41/37 , F21S45/47 , F21V7/0008 , F21V7/22 , F21V15/01 , F21V29/505 , F21Y2115/10 , F28D15/02 , H05K1/0203 , H05K1/0209 , H05K2201/10106
摘要： A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.
摘要翻译：提供具有热管和反射体的发光二极管反射器组件。组件还包括用于安装具有发光二极管阵列的电路板的安装构件。安装构件和反射体由导热聚合物组合物制成，其包含：i）约20重量％至约80重量％的基础聚合物基质如聚碳酸酯; 和ii）约20重量％至约80重量％的导热材料如碳石墨。

7. 发明申请

US20050189522A1 Method of forming an electronic device having high thermal conductivity and dielectric strength 审中-公开
标题翻译：形成具有高导热性和介电强度的电子器件的方法
公开(公告)号：US20050189522A1
公开(公告)日：2005-09-01
申请号：US11118056
申请日：2005-04-29
申请人： E. Mikhail Sagal , Kevin McCullough , James Miller
发明人： E. Mikhail Sagal , Kevin McCullough , James Miller
IPC分类号： C08K3/22 , C08K3/28 , H01B3/30 , H01B1/00
CPC分类号： C08K3/22 , C08K3/28 , H01B3/30 , H01B3/301
摘要： A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
摘要翻译：提供了具有高导热性和介电强度的聚合物组合物。聚合物组合物包含基础聚合物基质和导热的电绝缘材料。可以在组合物中添加玻璃等增强材料。聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

8. 发明授权

US06685855B1 Method of making thermally-conductive casings for optical heads in optical disc players 失效
标题翻译：在光盘播放器中制造用于光头的导热外壳的方法
公开(公告)号：US06685855B1
公开(公告)日：2004-02-03
申请号：US10459312
申请日：2003-06-11
申请人： James Miller , Kevin McCullough , E. Mikhail Sagal
发明人： James Miller , Kevin McCullough , E. Mikhail Sagal
IPC分类号： B29D1100
CPC分类号： B29C45/0013 , B29K2105/06 , B29K2105/16 , B29K2995/0013 , G11B7/22
摘要： A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.
摘要翻译：提供了一种制造用于光盘播放器中的光头的导热壳体的方法。该方法包括模制聚合物组合物，其包括：i）约20重量％至约80重量％的聚合物基质例如聚苯硫醚，和ii）约20重量％至约80重量％的导热材料如碳石墨成为光学头的外壳。可以在聚合物组合物中加入诸如玻璃的增强材料和其它添加剂，例如阻燃剂。

9. 发明授权

US07235918B2 Thermally-conductive plastic articles having light reflecting surfaces 有权
标题翻译：具有光反射表面的导热塑料制品
公开(公告)号：US07235918B2
公开(公告)日：2007-06-26
申请号：US10459254
申请日：2003-06-11
申请人： Kevin McCullough , James Miller , E. Mikhail Sagal
发明人： Kevin McCullough , James Miller , E. Mikhail Sagal
IPC分类号： G02B5/00 , G02B5/12
CPC分类号： B29C70/88 , B29C45/0013 , B29K2995/0013 , B29K2995/003 , B29L2011/0083 , C08K3/04 , F21S41/37 , F21V7/22 , F21V29/505 , F21W2103/00 , Y10T428/1355 , Y10T428/31504 , Y10T428/31507
摘要： A thermally-conductive polymer composition suitable for making molded reflector articles having light-reflecting surfaces is provided. The composition comprises: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The composition can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures. A method for manufacturing reflector articles is also provided.
摘要翻译：提供了适于制造具有光反射表面的模制反射体制品的导热聚合物组合物。组合物包含：a）约20重量％至约80重量％的基础聚合物基质如聚碳酸酯; 和b）约20重量％至约80重量％的导热碳材料如石墨。组合物可以用于制造反射器制品，例如用于汽车尾灯，头灯和其他照明装置的外壳。还提供了制造反射器制品的方法。

10. 发明申请

US20050101712A1 Thermoplastic thermally-conductive interface articles 审中-公开
标题翻译：热塑性导热界面制品
公开(公告)号：US20050101712A1
公开(公告)日：2005-05-12
申请号：US11014316
申请日：2004-12-16
申请人： James Miller , Kevin McCullough , E. Mikhail Sagal , Jeffrey Panek
发明人： James Miller , Kevin McCullough , E. Mikhail Sagal , Jeffrey Panek
IPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , C08K3/18
CPC分类号： C08K3/04 , C08K3/08 , C08K3/38 , F28D20/02 , F28F13/00 , F28F2013/006
摘要： A thermoplastic, thermally-conductive interface article is provided. The interface article is elastomeric and can be used to provide a thermally-conductive pathway between a heat-generating product such as an electronic device and a heat-sink. The interface article also can have good electrical-conductivity. The elastomeric interface article is made from a composition comprising a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material.
摘要翻译：提供了一种热塑性导热界面制品。界面制品是弹性体，并且可用于在诸如电子装置的发热产品和散热器之间提供导热通路。界面物品也可以具有良好的导电性。弹性体界面制品由包含基础热塑性弹性体基质，导热填料和温度活化相变材料的组合物制成。

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