专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09240365B2 Cooling device and electronic device 有权
标题翻译：冷却装置和电子装置
公开(公告)号：US09240365B2
公开(公告)日：2016-01-19
申请号：US13255964
申请日：2010-03-12
申请人： Kenji Ohsawa , Katsuya Tsuruta
发明人： Kenji Ohsawa , Katsuya Tsuruta
IPC分类号： F25B41/06 , H01L23/427 , F28D15/02 , F28D15/04
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.
摘要翻译：公开了一种冷却装置。冷却装置包括热扩散单元，其可操作以辐射从加热元件获取的热量，以及传热部件，其在热扩散单元的厚度方向上层叠并由此散热。热扩散单元具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。传热部具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。上板或下板都由下板的同一部件或热传输部的上板形成。

2. 发明授权

US08988882B2 Heat sink package and method of manufacturing 有权
标题翻译：散热片包装及制造方法
公开(公告)号：US08988882B2
公开(公告)日：2015-03-24
申请号：US13259563
申请日：2010-03-24
申请人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
发明人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
IPC分类号： H05K7/20 , H01L23/498 , H01L23/367 , H01L23/433 , H05K1/00 , H01L21/48
CPC分类号： H01L23/49816 , H01L21/4867 , H01L23/367 , H01L23/4334 , H01L2224/16225 , H01L2924/15321 , Y10T29/4913
摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
摘要翻译：电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部后表面上的连接电极连接到布线图案。

3. 发明申请

US20120211207A1 HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE 审中-公开
标题翻译：热输送单元和电子设备
公开(公告)号：US20120211207A1
公开(公告)日：2012-08-23
申请号：US13389632
申请日：2010-08-11
申请人： Kenji Ohsawa , Katsuya Tsuruta
发明人： Kenji Ohsawa , Katsuya Tsuruta
IPC分类号： F28F3/12
CPC分类号： F28D15/0233 , F28D15/046
摘要： A heat transporting unit comprises an upper plate, a lower plate opposing the upper plate, an internal space formed by the upper plate and the lower plate and operable to enter a refrigerant, a plurality of paths dividing the internal space in a first direction, and a plurality of grooves being provided at a bottom surface of the internal space. The plurality of the paths and the plurality of the grooves are connected by capillary channels in a region, and are divided by sidewalls in another region.
摘要翻译：传热单元包括上板，与上板相对的下板，由上板和下板形成并可操作以进入制冷剂的内部空间，沿第一方向分割内部空间的多个路径，以及多个凹槽设置在内部空间的底表面处。多个路径和多个槽通过毛细通道在一个区域中连接，并且由另一区域中的侧壁划分。

4. 发明申请

US20100189415A1 RECORDING MEDIUM REPRODUCING DEVICE AND REPRODUCING METHOD 审中-公开
标题翻译：记录介质再现设备和再现方法
公开(公告)号：US20100189415A1
公开(公告)日：2010-07-29
申请号：US12160924
申请日：2007-01-16
申请人： Kenji Ohsawa
发明人： Kenji Ohsawa
IPC分类号： H04N5/91
CPC分类号： G11B27/11 , G11B27/105 , G11B2220/2562 , G11B2220/65
摘要： [Problems] An object of the present invention is to perform switching of audio and subtitle and so on automatically or by simple operation when a recording medium such as a DVD, on which a plurality of streams of audio and subtitle are recorded, is reproduced.[Means for Solving Problems] A playback pattern based on combination of streams of video, audio, and subtitle which was reproduced in the past is stored in a flash memory 12. Then, a microcontroller 10 makes an audio/video/subtitle processing section 7 reproduce a playback pattern based on combination of the streams different from the playback pattern stored in the flash memory 12.
摘要翻译：发明内容本发明的目的在于，当再现记录有多个音频和字幕流的诸如DVD的记录介质时，自动或通过简单的操作来执行音频和字幕等的切换。解决问题的手段将过去再现的基于视频，音频和副标题的流的组合的重放模式存储在闪速存储器12中。然后，微控制器10使音频/视频/字幕处理部分7 基于与存储在闪速存储器12中的重放模式不同的流的组合再现播放模式。

5. 发明授权

US5937278A Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer 失效
标题翻译：制造引线框架的方法，其具有通过金属蚀刻停止层连接到外部引线的内部引线
公开(公告)号：US5937278A
公开(公告)日：1999-08-10
申请号：US732817
申请日：1996-10-15
申请人： Makoto Ito , Kenji Ohsawa , Mutsumi Nagano
发明人： Makoto Ito , Kenji Ohsawa , Mutsumi Nagano
IPC分类号： H01L21/48 , H01L23/495 , H01L21/44 , H01L21/60
CPC分类号： H01L21/4828 , H01L23/49524 , H01L2924/0002 , H01L2924/16195
摘要： A method of manufacturing a lead frame comprises the steps of preparing a three-layered material comprising a metal base, an etching stopper layer made of a metal material different from that of the metal layer formed on a first surface of the metal base and a chromium layer formed on the etching stopper layer, forming a resist layer having a negative pattern relative to an inner lead to be formed on the chromium layer of the three-layered material, forming an inner lead by plating copper by using the resist layer as a mask, forming an outer lead on the metal base, removing a back of a region in which an inner lead of the metal base is formed by etching, removing the etching stopper layer, and removing the chromium layer.
摘要翻译：制造引线框架的方法包括以下步骤：制备包括金属基底的三层材料，由与金属基底的第一表面上形成的金属层不同的金属材料制成的蚀刻阻挡层和铬形成在蚀刻停止层上的层，形成相对于在三层材料的铬层上形成的内部引线具有负图案的抗蚀剂层，通过使用抗蚀剂层作为掩模，通过电镀铜形成内部引线在金属基底上形成外部引线，通过蚀刻除去金属基底的内部引线的区域的背面，去除蚀刻停止层，以及去除铬层。

6. 发明申请

US20210310745A1 HEAT PIPE AND METHOD FOR MANUFACTURING SAME 有权
公开(公告)号：US20210310745A1
公开(公告)日：2021-10-07
申请号：US11993939
申请日：2007-02-26
申请人： Kenji Ohsawa
发明人： Kenji Ohsawa
IPC分类号： F28D15/02 , F28D15/04
摘要： A heat pipe capable of being remarkably increased in service life by surely exerting sealing effect even under high temperature, and a method of manufacturing the heat pipe. A heat pipe remarkably reduced in cost by increasing productivity and capable of being increased in service life. In the heat pipe (1), an upper plate reinforcement part (50), intermediate plate reinforcement parts (52), reinforcement parts (55) with slits, and a lower plate reinforcement part (60) are fitted to each other in a steam diffusing flow passage (44) facing the peripheral areas of a refrigerant filling hole (4) and an air exhaust hole (5) to form a column structure. Since an external force from a press (75) is supported by the column structure composed of the upper plate reinforcement part (50), the intermediate plate reinforcement parts (52), the reinforcement parts (55) with slits, and the lower plate reinforcement part (60), such disadvantages can be prevented that an upper plate (2) or a lower plate (3) is damaged by the external force, and thereby an internal space (10a) is collapsed.

7. 发明授权

US08982559B2 Heat sink, cooling module and coolable electronic board 有权
标题翻译：散热器，冷却模块和可冷却电子板
公开(公告)号：US08982559B2
公开(公告)日：2015-03-17
申请号：US12866883
申请日：2009-02-02
申请人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
发明人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367 , H01L23/34 , F28F7/00 , H01L23/427
CPC分类号： H01L23/3736 , H01L23/3677 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H05K7/20336 , H05K7/20409 , H05K7/20481 , H05K7/20518
摘要： A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
摘要翻译：散热器设置有与发热体相对的基体并且从发热体吸收热量。与发热体相对的基体的相对部分的热阻高于围绕相对部分的周围部分的热阻。

8. 发明申请

US20130269913A1 HEAT PIPE 审中-公开
标题翻译：热管
公开(公告)号：US20130269913A1
公开(公告)日：2013-10-17
申请号：US11993343
申请日：2007-02-05
申请人： Susumu Ueda , Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani
发明人： Susumu Ueda , Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani
IPC分类号： F21V29/00 , F28D15/04
CPC分类号： H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
摘要： A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.
摘要翻译：具有延伸到周边部分的蒸气扩散流路和在蒸汽扩散流路之间形成的毛细管流路和凹部相对区域的冷却单元主体设置有安装有LED芯片的薄凹部。因此，来自LED芯片的热量可以容易地通过与凹部的变薄对应的转移，并且由热量重复由制冷剂引起的连续的循环现象，并且通过潜热来可靠地从LED芯片引出热量制冷剂蒸发的时间，使得热管能够稳定地保持LED芯片的发光状态。

9. 发明申请

US20080135214A1 Heat Pipe and Method for Manufacturing Same 审中-公开
标题翻译：热管及其制造方法相同
公开(公告)号：US20080135214A1
公开(公告)日：2008-06-12
申请号：US11573534
申请日：2006-08-31
申请人： Kenji Ohsawa , Katsuya Tsuruta
发明人： Kenji Ohsawa , Katsuya Tsuruta
IPC分类号： F28D15/02 , B21D53/04
CPC分类号： F28D15/0233 , B23P15/26 , B23P2700/09 , F28D15/046 , F28F3/048 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49366 , H01L2924/00
摘要： A small and thin heat pipe with enhanced heat conductivity. Between an upper member having a grid-like upper concave portion on an inside lower surface and a lower member having a grid-like lower concave portion on an inside upper surface are provided intermediate plate members. The members are each formed with multiple vapor diffusion flow paths extending in a planar direction, communicating with the concave portions of the members, respectively. Thus, a sealed space is defined therebetween so that a refrigerant is enclosed therein. Capillary flow paths are formed through a portion of the members except where the vapor diffusion flow paths are formed such that the capillary flow paths extend vertically or both vertically and horizontally, communicating with the concave portions of the members.
摘要翻译：具有增强导热性的小而薄的热管。在中间板构件之间设置有在内侧下表面上具有格子状的上凹部的上部构件和在内侧上表面具有格子状的下部凹部的下部构件。各构件分别形成有沿着平面方向延伸的多个蒸气扩散流路，分别与构件的凹部连通。因此，在其间限定了密封空间，从而将制冷剂封闭在其中。除了形成蒸气扩散流动路径之外，毛细管流动路径通过一部分构件形成，使得毛细管流动路径垂直或垂直和水平地延伸，与构件的凹部连通。

10. 发明申请

US20070056711A1 Heat pipe and method for manufacturing same 有权
标题翻译：热管及其制造方法
公开(公告)号：US20070056711A1
公开(公告)日：2007-03-15
申请号：US10583504
申请日：2006-01-31
申请人： Kenji Ohsawa
发明人： Kenji Ohsawa
IPC分类号： F28D15/00
CPC分类号： F28D15/0233 , B23P15/26 , B23P2700/09 , F28D15/046 , F28F3/048 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49366 , H01L2924/00
摘要： A thin and flat type heat pipe with aced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with e rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so tat a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.
摘要翻译：具有导电性的薄型扁平型热管。在下表面具有矩形区域24b的上部构件22和在上部区域上具有矩形区域24a的下部构件20之间设置有中间板构件32,30。构件32,30各自形成有狭缝8 构成沿着平面方向延伸的蒸气路径，分别与构件22,20的e个矩形区域24a，24b连通。因此，密封空间由狭缝8和矩形区域24a，24b限定，使得制冷剂被封闭在密封空间中。毛细孔10通过中间板构件32,30的非切口部分形成，使得每个毛细管孔10用作垂直延伸的流动通道，以与构件22,20的矩形区域24a，24b连通。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式