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1. 发明申请

US20120106084A1 Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function 失效
标题翻译：热管，热管制造方法以及具有热管功能的电路板
公开(公告)号：US20120106084A1
公开(公告)日：2012-05-03
申请号：US12934996
申请日：2009-03-09
申请人： Kei Mizuta , Katsuya Tsuruta , Toshiaki Kotani , Kenji Ohsawa
发明人： Kei Mizuta , Katsuya Tsuruta , Toshiaki Kotani , Kenji Ohsawa
IPC分类号： H05K7/20 , B21D53/02 , F28D15/04
CPC分类号： H05K1/0272 , F28D15/0233 , F28D15/046 , H01L23/427 , H01L2924/0002 , H05K1/0204 , H05K1/056 , H05K3/445 , H05K2201/064 , Y10T29/4935 , H01L2924/00
摘要： A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
摘要翻译：公开了一种通过封闭的冷却介质的蒸发和冷凝来冷却放热体的热管。热管包括平板状的上板，与上板相对的平板状下板，以及在上板和下板之间彼此重叠的多个平板状中间板，并具有内部通孔。形成在多个中间板的每一个中的内部通孔适于使得每个通孔的仅一部分彼此重叠以形成毛细管路径，每个通孔的横截面积小于横截面积通孔在平面方向的面积。

2. 发明授权

US08611089B2 Heat pipe and circuit board with a heat pipe function 失效
标题翻译：热管和电路板具有热管功能
公开(公告)号：US08611089B2
公开(公告)日：2013-12-17
申请号：US12934996
申请日：2009-03-09
申请人： Kei Mizuta , Katsuya Tsuruta , Toshiaki Kotani , Kenji Ohsawa
发明人： Kei Mizuta , Katsuya Tsuruta , Toshiaki Kotani , Kenji Ohsawa
IPC分类号： H05K7/20
CPC分类号： H05K1/0272 , F28D15/0233 , F28D15/046 , H01L23/427 , H01L2924/0002 , H05K1/0204 , H05K1/056 , H05K3/445 , H05K2201/064 , Y10T29/4935 , H01L2924/00
摘要： A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
摘要翻译：公开了一种通过封闭的冷却介质的蒸发和冷凝来冷却放热体的热管。热管包括平板状的上板，与上板相对的平板状下板，以及在上板和下板之间彼此重叠的多个平板状中间板，并具有内部通孔。形成在多个中间板的每一个中的内部通孔适于使得每个通孔的仅一部分彼此重叠以形成毛细管路径，每个通孔的横截面积小于横截面积通孔在平面方向的面积。

3. 发明授权

US08982559B2 Heat sink, cooling module and coolable electronic board 有权
标题翻译：散热器，冷却模块和可冷却电子板
公开(公告)号：US08982559B2
公开(公告)日：2015-03-17
申请号：US12866883
申请日：2009-02-02
申请人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
发明人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367 , H01L23/34 , F28F7/00 , H01L23/427
CPC分类号： H01L23/3736 , H01L23/3677 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H05K7/20336 , H05K7/20409 , H05K7/20481 , H05K7/20518
摘要： A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
摘要翻译：散热器设置有与发热体相对的基体并且从发热体吸收热量。与发热体相对的基体的相对部分的热阻高于围绕相对部分的周围部分的热阻。

4. 发明申请

US20110214904A1 Heat Sink, Cooling Module And Coolable Electronic Board 有权
标题翻译：散热器，冷却模块和可冷却电子板
公开(公告)号：US20110214904A1
公开(公告)日：2011-09-08
申请号：US12866883
申请日：2009-02-02
申请人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
发明人： Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani , Kei Mizuta
IPC分类号： H05K1/00 , F28D15/04 , F28F7/00
CPC分类号： H01L23/3736 , H01L23/3677 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H05K7/20336 , H05K7/20409 , H05K7/20481 , H05K7/20518
摘要： A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
摘要翻译：散热器设置有与发热体相对的基体并且从发热体吸收热量。与发热体相对的基体的相对部分的热阻高于围绕相对部分的周围部分的热阻。

5. 发明申请

US20110308772A1 Heat Pipe And Electronic Device 审中-公开
标题翻译：热管和电子设备
公开(公告)号：US20110308772A1
公开(公告)日：2011-12-22
申请号：US13062561
申请日：2009-09-08
申请人： Katsuya Tsuruta , Rinkou Fukunaga , Toshiaki Kotani , Kei Mizuta
发明人： Katsuya Tsuruta , Rinkou Fukunaga , Toshiaki Kotani , Kei Mizuta
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).
摘要翻译：本发明提供一种热管和电子装置，其能够有效地冷却配置在端部的发光元件，从而能够将热管有效地安装在狭窄的空间内。热管设有上板（3），与上板（3）相对的下板（4），一个中间板或多个中间板（5），层压在上板（3）和下板板（4），通过层叠上板（3），下板（4）和中间板（5）而形成并能够密封冷却介质，蒸气扩散路径（6）的主体部分（2））和能够回流冷凝介质的毛细管流路（7），蒸气扩散路径（6）由主体部的第一端部（15）朝向与第一端部（15）相对的第二端部（16）。

6. 发明申请

US20120127667A1 HEAT SINK PACKAGE AND METHOD OF MANUFACTURING 审中-公开
标题翻译：散热封装及其制造方法
公开(公告)号：US20120127667A1
公开(公告)日：2012-05-24
申请号：US13259563
申请日：2010-03-24
申请人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
发明人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
IPC分类号： H05K7/20 , H05K3/32
CPC分类号： H01L23/49816 , H01L21/4867 , H01L23/367 , H01L23/4334 , H01L2224/16225 , H01L2924/15321 , Y10T29/4913
摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
摘要翻译：电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部后表面上的连接电极连接到布线图案。

7. 发明授权

US08988882B2 Heat sink package and method of manufacturing 有权
标题翻译：散热片包装及制造方法
公开(公告)号：US08988882B2
公开(公告)日：2015-03-24
申请号：US13259563
申请日：2010-03-24
申请人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
发明人： Kenji Ohsawa , Rinkou Fukunaga , Katsuya Tsuruta , Kei Mizuta , Masamichi Ishihara
IPC分类号： H05K7/20 , H01L23/498 , H01L23/367 , H01L23/433 , H05K1/00 , H01L21/48
CPC分类号： H01L23/49816 , H01L21/4867 , H01L23/367 , H01L23/4334 , H01L2224/16225 , H01L2924/15321 , Y10T29/4913
摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
摘要翻译：电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部后表面上的连接电极连接到布线图案。

8. 发明申请

US20130269913A1 HEAT PIPE 审中-公开
标题翻译：热管
公开(公告)号：US20130269913A1
公开(公告)日：2013-10-17
申请号：US11993343
申请日：2007-02-05
申请人： Susumu Ueda , Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani
发明人： Susumu Ueda , Kenji Ohsawa , Katsuya Tsuruta , Toshiaki Kotani
IPC分类号： F21V29/00 , F28D15/04
CPC分类号： H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
摘要： A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.
摘要翻译：具有延伸到周边部分的蒸气扩散流路和在蒸汽扩散流路之间形成的毛细管流路和凹部相对区域的冷却单元主体设置有安装有LED芯片的薄凹部。因此，来自LED芯片的热量可以容易地通过与凹部的变薄对应的转移，并且由热量重复由制冷剂引起的连续的循环现象，并且通过潜热来可靠地从LED芯片引出热量制冷剂蒸发的时间，使得热管能够稳定地保持LED芯片的发光状态。

9. 发明授权

US09240365B2 Cooling device and electronic device 有权
标题翻译：冷却装置和电子装置
公开(公告)号：US09240365B2
公开(公告)日：2016-01-19
申请号：US13255964
申请日：2010-03-12
申请人： Kenji Ohsawa , Katsuya Tsuruta
发明人： Kenji Ohsawa , Katsuya Tsuruta
IPC分类号： F25B41/06 , H01L23/427 , F28D15/02 , F28D15/04
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.
摘要翻译：公开了一种冷却装置。冷却装置包括热扩散单元，其可操作以辐射从加热元件获取的热量，以及传热部件，其在热扩散单元的厚度方向上层叠并由此散热。热扩散单元具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。传热部具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。上板或下板都由下板的同一部件或热传输部的上板形成。

10. 发明申请

US20120211207A1 HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE 审中-公开
标题翻译：热输送单元和电子设备
公开(公告)号：US20120211207A1
公开(公告)日：2012-08-23
申请号：US13389632
申请日：2010-08-11
申请人： Kenji Ohsawa , Katsuya Tsuruta
发明人： Kenji Ohsawa , Katsuya Tsuruta
IPC分类号： F28F3/12
CPC分类号： F28D15/0233 , F28D15/046
摘要： A heat transporting unit comprises an upper plate, a lower plate opposing the upper plate, an internal space formed by the upper plate and the lower plate and operable to enter a refrigerant, a plurality of paths dividing the internal space in a first direction, and a plurality of grooves being provided at a bottom surface of the internal space. The plurality of the paths and the plurality of the grooves are connected by capillary channels in a region, and are divided by sidewalls in another region.
摘要翻译：传热单元包括上板，与上板相对的下板，由上板和下板形成并可操作以进入制冷剂的内部空间，沿第一方向分割内部空间的多个路径，以及多个凹槽设置在内部空间的底表面处。多个路径和多个槽通过毛细通道在一个区域中连接，并且由另一区域中的侧壁划分。

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