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    • 1. 发明授权
    • Low noise, high frequency solid state diode
    • 低噪声,高频固态二极管
    • US06303975B1
    • 2001-10-16
    • US09436166
    • 1999-11-09
    • Robert A. GrovesDominique Nguyen-NgocDale K. JadusKeith M. Walter
    • Robert A. GrovesDominique Nguyen-NgocDale K. JadusKeith M. Walter
    • H01L2710
    • H01L27/1021H01L29/861Y10S257/91
    • A low noise, high frequency solid state diode is provided from a plurality of unit diode cells which are interconnected in parallel. Each of the unit diode cells forms an element of an array having rows and columns of unit diode cells. The diode cells include a base region of polysilicon, forming an anode, and an active cathode region which forms a diode junction with the anode. A plurality of overlapping subcollector regions interconnect the cathode regions, to provide a single, continuous collector for the diode arrays. The base region has a minimum perimeter to area ratio which reduces the resistance of each active diode region. A plurality of cathode contacts are connected to the subcollector through a respective reach region of highly doped semiconductor material. One or more metalization layers connect the cathode regions together, and the anodes of the base regions together. By controlling the size and shape of the base region of polysilicon, the series resistance of the resulting diode is minimized.
    • 从并联的多个单位二极管单元提供低噪声,高频固态二极管。 每个单位二极管单元形成具有单位二极管单元的行和列的阵列的元件。 二极管单元包括形成阳极的多晶硅的基极区域和与阳极形成二极管结的活性阴极区域。 多个重叠子集电极区域互连阴极区域,为二极管阵列提供单一的连续集电极。 基极区域具有最小的周边面积比,其减小了每个有源二极管区域的电阻。 多个阴极触点通过高掺杂半导体材料的相应到达区域连接到子集电极。 一个或多个金属化层将阴极区域连接在一起,并将基极区域的阳极连接在一起。 通过控制多晶硅的基极区域的尺寸和形状,所得二极管的串联电阻最小化。
    • 5. 发明授权
    • Method of making carrier conduction conductor-insulator semiconductor
(CIS) transistor
    • 制造载流子导体绝缘体半导体(CIS)晶体管的方法
    • US5399512A
    • 1995-03-21
    • US280742
    • 1994-07-26
    • Shaikh N. MohammadRobert B. RenbeckKeith M. Walter
    • Shaikh N. MohammadRobert B. RenbeckKeith M. Walter
    • H01L21/331H01L29/165H01L29/73H01L29/737H01L21/265
    • H01L29/66242H01L29/7311H01L29/7371
    • A Conductor Insulator Semiconductor (CIS) heterojunction transistor. The CIS transistor is on silicon (Si) substrate. A layer of n type Si is deposited on the substrate. A trench is formed through the n type Si layer, and may extend slightly into the substrate. The trench is filled with an insulator, preferably SiO.sub.2. A layer of p type Si.sub.1-z Ge.sub.z (where z is the mole fraction of Ge and 0.1.ltoreq.z.ltoreq.0.9) is deposited on the n type Si layer. A p.sup.+ base contact region is defined in the p type Si.sub.1-z Ge.sub.z region above the oxide filled trench. A n type dopant is ion implanted into both the Si.sub.1-z Ge.sub.z and n Si layers and may extend slightly into the substrate, forming a collector region. A thin oxide layer is deposited on the Si.sub.1-z Ge.sub.z layer and a low work function metal such as Al, Mg, Mn, or Ti is selectively deposited on the thin oxide and to define an emitter. Alternatively, the emitter may be p.sup.+ polysilicon. Next, the thin oxide is opened to define collector and base contacts. A suitable metal, such as Al is deposited in the base and collector contacts.
    • 导体绝缘体半导体(CIS)异质结晶体管。 CIS晶体管在硅(Si)衬底上。 在衬底上沉积一层n型Si。 通过n型Si层形成沟槽,并且可以稍微延伸到衬底中。 沟槽填充有绝缘体,优选SiO 2。 p型Si1-z Gez(其中z是Ge的摩尔分数和0.1≤n≤0.9)沉积在n型Si层上。 在氧化物填充沟槽上方的p型Si1-z Gez区域中限定了p +基极接触区域。 将n型掺杂剂离子注入到Si1-z Gez和nSi层中,并且可以稍微延伸到衬底中,形成集电极区域。 在Si1-zGez层上沉积薄的氧化物层,并且在薄氧化物上选择性地沉积诸如Al,Mg,Mn或Ti的低功函数金属并限定发射极。 或者,发射极可以是p +多晶硅。 接下来,打开薄氧化物以限定集电极和基极触点。 合适的金属如Al沉积在基极和集电极触点中。
    • 6. 发明授权
    • Carrier conduction conductor-insulator semiconductor (CIS) transistor
    • 载体导体绝缘体半导体(CIS)晶体管
    • US5382815A
    • 1995-01-17
    • US173388
    • 1993-12-23
    • Shaikh N. MohammadRobert B. RenbeckKeith M. Walter
    • Shaikh N. MohammadRobert B. RenbeckKeith M. Walter
    • H01L21/331H01L29/165H01L29/73H01L29/737H01L31/072H01L27/082H01L29/00H01L31/109
    • H01L29/66242H01L29/7311H01L29/7371
    • A Conductor Insulator Semiconductor (CIS) heterojunction transistor. The CIS transistor is on silicon (Si) substrate. A layer of n type Si is deposited on the substrate. A trench is formed through the n type Si layer, and may extend slightly into the substrate. The trench is filled with an insulator, preferably SiO.sub.2. A layer of p type Si.sub.1-z Ge.sub.z (where z is the mole fraction of Ge and 0.1.ltoreq.z.ltoreq.0.9) is deposited on the n type Si layer. A p.sup.+ base contact region is defined in the p type Si.sub.1-z Ge.sub.z region above the oxide filled trench. A n type dopant is ion implanted into both the Si.sub.1-z Ge.sub.z and n Si layers and may extend slightly into the substrate, forming a collector region. A thin oxide layer is deposited on the Si.sub.1-z Ge.sub.z layer and a low work function metal such as Al, Mg, Mn, or Ti is selectively deposited on the thin oxide and to define an emitter. Alternatively, the emitter may be p.sup.+ polysilicon. Next, the thin oxide is opened to define collector and base contacts. A suitable metal, such as Al is deposited in the base and collector contacts.
    • 导体绝缘体半导体(CIS)异质结晶体管。 CIS晶体管在硅(Si)衬底上。 在衬底上沉积一层n型Si。 通过n型Si层形成沟槽,并且可以稍微延伸到衬底中。 沟槽填充有绝缘体,优选SiO 2。 p型Si1-z Gez(其中z是Ge的摩尔分数和0.1≤n≤0.9)沉积在n型Si层上。 在氧化物填充沟槽上方的p型Si1-z Gez区域中限定了p +基极接触区域。 将n型掺杂剂离子注入到Si1-z Gez和nSi层中,并且可以稍微延伸到衬底中,形成集电极区域。 在Si1-zGez层上沉积薄的氧化物层,并且在薄氧化物上选择性地沉积诸如Al,Mg,Mn或Ti的低功函数金属并限定发射极。 或者,发射极可以是p +多晶硅。 接下来,打开薄氧化物以限定集电极和基极触点。 合适的金属如Al沉积在基极和集电极触点中。