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1. 发明授权

US09110438B2 Flange member, photosensitive drum, process cartridge, image forming apparatus, and image forming method 有权
标题翻译：凸缘部件，感光鼓，处理盒，成像设备和图像形成方法
公开(公告)号：US09110438B2
公开(公告)日：2015-08-18
申请号：US13881636
申请日：2011-11-10
申请人： Daisuke Kubo , Keiichi Yano , Akira Nakamura , Yoko Arai
发明人： Daisuke Kubo , Keiichi Yano , Akira Nakamura , Yoko Arai
IPC分类号： G03G15/00 , G03G21/18
CPC分类号： G03G21/18 , G03G15/751 , G03G15/757
摘要： A disclosed flange member includes a press-fitted portion to be press-fitted in an axial end-opening portion of a hollow and cylindrical sleeve member; an axle opening portion including an axle opening into which a shaft member is inserted when the press-fitted portion is press-fitted in the end-opening portion; and a linking portion extending in a direction parallel to a circular cross section of the sleeve member and connecting the axle opening portion to the press-fitted portion. The linking portion includes a stress-absorbing portion that is deformed so as to absorb stress to which an outer peripheral surface of the press-fitted portion is subjected upon contact with an inner peripheral surface of the sleeve member when the press-fitted portion is press-fitted in the end-opening portion, thus preventing the stress from being transmitted to the axle opening portion via the linking portion.
摘要翻译：所公开的凸缘构件包括压配合部分，该压配部分压配合在中空和圆柱形套筒构件的轴向端部开口部分中; 所述车轴开口部包括车轴开口，当所述压配合部压配合在所述端部开口部时，所述轴构件插入到所述轴孔中; 以及连接部，其在与所述套筒构件的圆形截面平行的方向上延伸并将所述车轴开口部连接到所述压入部。连接部分包括应力吸收部分，该压力部分被变形以吸收当按压配合部分被按压时压配部分的外周面与套筒部件的内周面接触时受到的应力设置在端部开口部分，从而防止应力通过连接部分传递到车轴开口部分。

2. 发明授权

US08419538B2 Storage medium storing game program, game apparatus and game control method 有权
标题翻译：存储媒体存储游戏程序，游戏装置和游戏控制方法
公开(公告)号：US08419538B2
公开(公告)日：2013-04-16
申请号：US11416257
申请日：2006-05-03
申请人： Masahiko Mashimo , Shinya Saito , Keiichi Yano , Norihide Okada
发明人： Masahiko Mashimo , Shinya Saito , Keiichi Yano , Norihide Okada
IPC分类号： A63F9/24 , A63F13/00 , G06F17/00 , G06F19/00
CPC分类号： A63F13/2145 , A63F13/10 , A63F13/426 , A63F13/44 , A63F13/814 , A63F2300/1075 , A63F2300/301 , A63F2300/303 , A63F2300/638 , A63F2300/8047
摘要： A game apparatus includes an LCD, and a game screen is displayed on the LCD. A touch panel is provided on the LCD. The game screen presents a marker image so as to be variable in position in time with performance of music, and also presents a timer circle image for indicating touch timing for the marker image. A player needs to touch a marker image to be touched with precise timing, listening to the music or watching the timer circle image. The player's touch is evaluated on the basis of the touch timing and the touch position. If the touch is evaluated as a failure, the game screen is shaken.
摘要翻译：一种游戏装置，包括LCD，在LCD上显示游戏画面。 LCD上提供触摸面板。游戏屏幕呈现标记图像，以便随着音乐的表现而随时间变化，并且还呈现用于指示标记图像的触摸定时的定时器圆形图像。玩家需要触摸要被精确定时触摸的标记图像，聆听音乐或观看定时器圈图像。基于触摸定时和触摸位置来评估玩家的触摸。如果触摸被评估为失败，则游戏画面被摇动。

3. 发明申请

US20120234735A1 SIEVING DEVICE, SIEVING DEVICE FOR DEVELOPING DEVICE, AND POWDER-CHARGING DEVICE 有权
标题翻译：开发设备，开发设备的设备和粉末充电设备
公开(公告)号：US20120234735A1
公开(公告)日：2012-09-20
申请号：US13418970
申请日：2012-03-13
申请人： Hideo ICHIKAWA , Kaori Ozeki , Tatsushi Umayahara , Takashi Ono , Masayoshi Suzuki , Teruo Shibata , Keiichi Yano , Masato Suzuki , Eiichi Masushio , Hiroshi Sano , Yusuke Uchida , Junji Yamabe , Seiji Terazawa , Masashi Hasegawa
发明人： Hideo ICHIKAWA , Kaori Ozeki , Tatsushi Umayahara , Takashi Ono , Masayoshi Suzuki , Teruo Shibata , Keiichi Yano , Masato Suzuki , Eiichi Masushio , Hiroshi Sano , Yusuke Uchida , Junji Yamabe , Seiji Terazawa , Masashi Hasegawa
IPC分类号： B07B1/46
CPC分类号： B07B1/06 , B07B1/55 , B07B4/08 , B07B13/16 , B65G65/48 , B65G65/4809 , G03G9/08 , G03G9/0817
摘要： A sieving device including a hollow cylindrical body, a filter disposed at a bottom portion of the hollow cylindrical body, and a blade configured to rotate in close proximity to the filter around a rotation axis thereof crossing the filter to thereby stir powder supplied to the hollow cylindrical body.
摘要翻译：一种筛分装置，包括中空圆柱体，设置在中空圆柱体的底部的过滤器和一个叶片，其构造成围绕过滤器的旋转轴线紧邻过滤器旋转，从而搅拌供应到中空的粉末圆柱体。

4. 发明授权

US07812360B2 Light emitting device, lighting equipment or liquid crystal display device using such light emitting device 有权
标题翻译：发光装置，照明装置或使用这种发光装置的液晶显示装置
公开(公告)号：US07812360B2
公开(公告)日：2010-10-12
申请号：US11576533
申请日：2005-09-30
申请人： Keiichi Yano
发明人： Keiichi Yano
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L25/0753 , H01L33/60 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2924/00014 , H01L2924/00
摘要： A light emitting apparatus 11 comprises: an aluminum nitride co-fired substrate 13; at least one light emitting device 15 mounted on a front surface of the co-fired substrate 13 through a flip-tip method; and a reflector 16 having an inclined surface 14 for reflecting a light emitted from the light emitting device 15 to a front side direction, the reflector 16 is bonded to a surface of the aluminum nitride co-fired substrate 13 so as to surround a circumference of the light emitting device 15. This configuration can simplify the process of manufacturing the apparatus and can provide light emitting apparatus that are excellent in heat radiation performance, allow a larger current to pass therethrough, and can have a significantly increased luminance with a high luminous efficiency.
摘要翻译：发光装置11包括：氮化铝共烧基板13; 至少一个发光装置15，通过翻盖法安装在共烧基板13的前表面上; 以及具有用于将从发光装置15发射的光反射到前侧方向的倾斜面14的反射体16，反射体16以氮化铝烧结基板13的表面贴合该配置可以简化制造装置的过程，并且可以提供散热性能优异的发光装置，允许较大的电流通过，并且可以以高发光效率具有显着增加的亮度。

5. 发明申请

US20090314154A1 GAME DATA GENERATION BASED ON USER PROVIDED SONG 审中-公开
标题翻译：基于用户提供的歌曲的游戏数据生成
公开(公告)号：US20090314154A1
公开(公告)日：2009-12-24
申请号：US12142832
申请日：2008-06-20
申请人： Christopher Esaki , Keiichi Yano
发明人： Christopher Esaki , Keiichi Yano
IPC分类号： G10H1/40
CPC分类号： G10H1/365 , G10H2210/046 , G10H2210/066 , G10H2210/076 , G10H2210/091 , G10H2240/155
摘要： The vocal track of any song provided by a user may be isolated and data based on the vocal track, such as pitch, rhythm, and/or duration, may be generated. The data may be used in a game in which the user may sing into a microphone and may try to match their singing as closely as possible to that of the vocal track. Feedback may be provided to the user at as to how the user's singing compares with respect to the vocal track based on the on the pitch, rhythm, and/or duration.
摘要翻译：可以隔离由用户提供的任何歌曲的声道，并且可以生成基于声道的数据，例如音调，节奏和/或持续时间。数据可以用在用户可以唱入麦克风的游戏中，并且可以尝试将他们的歌唱尽可能接近于声道的歌曲。可以基于音调，节奏和/或持续时间，向用户提供关于用户的歌唱如何与声乐轨道相比较的反馈。

6. 发明申请

US20070200128A1 Light Emitting Device 有权
标题翻译：发光装置
公开(公告)号：US20070200128A1
公开(公告)日：2007-08-30
申请号：US10572595
申请日：2004-09-29
申请人： Keiichi Yano
发明人： Keiichi Yano
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2924/00011 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A light emitting apparatus 10 includes an aluminum nitride co-fired substrate 11 and a light emitting device 12 arranged on a front surface of the co-fired substrate, in which the front surface of the aluminum nitride substrate 11 bearing the light emitting device 12 is mirror-polished so as to have a surface roughness of 0.3 μm Ra or less, and the light emitting apparatus 10 further includes a vapor-deposited metal film 14 and via holes 15. The vapor-deposited metal film 14 is arranged on the front surface of the aluminum nitride substrate 11 around the light emitting device 12 and has a reflectivity of 90% or more with respect to light emitted from the light emitting device 12. The via holes 15 penetrates the aluminum nitride substrate 11 from the front surface bearing the light emitting device 12 to the rear surface to thereby allow conduction to the light emitting device 12 from the rear surface. This configuration can reduce light emitting apparatuses in size and can provide light emitting apparatuses that are excellent in heat radiation performance, allow a larger current to pass therethrough, and can have a significantly increased luminance with a high luminous efficiency.
摘要翻译：发光装置10包括氮化铝共烧基板11和布置在共烧基板的前表面上的发光装置12，其中承载发光装置12的氮化铝基板11的前表面是镜面抛光以使表面粗糙度为0.3μmRa或更小，并且发光装置10还包括气相沉积金属膜14和通孔15。蒸镀金属膜14配置在发光元件12的周围的氮化铝基板11的正面上，相对于从发光元件12发出的光的反射率为90％以上。通孔15从承载发光器件12的前表面穿过氮化铝衬底11到后表面，从而允许从后表面导电到发光器件12。这种结构可以减小发光装置的尺寸，并且可以提供散热性能优异的发光装置，允许较大的电流通过，并且可以以高发光效率显着提高亮度。

7. 发明申请

US20060281179A1 Inducer for differentiation of embryo stem cells into ectodermal cells method of obtaining the same and use thereof 审中-公开
标题翻译：用于将胚胎干细胞分化为外胚层细胞的诱导剂获得相同的用途和用途
公开(公告)号：US20060281179A1
公开(公告)日：2006-12-14
申请号：US10495567
申请日：2002-11-14
申请人： Yoshiki Sasai , Hiroo Iwata , Yoshinobu Murakami , Mitsuo Satoh , Masato Kobori , Keiichi Yano
发明人： Yoshiki Sasai , Hiroo Iwata , Yoshinobu Murakami , Mitsuo Satoh , Masato Kobori , Keiichi Yano
IPC分类号： C12N5/08 , C12N15/09 , C07K14/475
CPC分类号： G01N33/5073 , A61K35/12 , A61K35/48 , A61K38/1709 , C12N5/0603 , C12N5/0619 , C12N2501/415 , C12N2501/90 , C12N2501/91 , C12N2502/13 , C12N2503/02 , C12N2506/02 , G01N33/5008 , G01N33/5023 , G01N33/5058 , G01N33/6896
摘要： A method for obtaining a solution having activity to induce differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell, which comprises culturing a stromal cell in a culture comprising a polyanionic compound and recovering the culture; a solution having activity to induce differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell, which is obtainable by the method; and an agent for inducing differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell.
摘要翻译：一种获得具有诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的活性的溶液的方法，其包括在包含聚阴离子化合物的培养物中培养基质细胞并回收培养物; 具有诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的活性的溶液，其可通过该方法获得; 以及用于诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的药剂。

8. 发明授权

US06316116B1 Ceramic circuit board and method of manufacturing the same 有权
标题翻译：陶瓷电路板及其制造方法
公开(公告)号：US06316116B1
公开(公告)日：2001-11-13
申请号：US09548276
申请日：2000-04-12
申请人： Miho Nakamura , Hideki Sato , Keiichi Yano , Nobuyuki Mizunoya , Tadashi Ishii , Seiko Nagano
发明人： Miho Nakamura , Hideki Sato , Keiichi Yano , Nobuyuki Mizunoya , Tadashi Ishii , Seiko Nagano
IPC分类号： B32B1504
CPC分类号： C04B41/009 , C04B41/5133 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , Y10T428/2495 , Y10T428/266 , C04B41/4539 , C04B41/4572 , C04B41/4578 , C04B35/581 , H01L2924/00
摘要： The present invention provides a ceramic circuit board comprising: a ceramic substrate comprising ceramic crystal grains and liquid phase component grains; and a conductive layer to be formed as a circuit integrally formed to the ceramic substrate, wherein the ceramic substrate has a thermal conductivity of 180 W/m·K or more and the ceramic crystal grains have an average grain size of 10 &mgr;m or less. According to the structure described above, there can be provided a ceramic circuit board which has a high thermal conductivity of 180 W/m·K or more, an excellent heat radiating property and a high strength which is capable of reducing crack formation during the assembling and operation of the circuit board, and is capable of reducing short-circuit accident to be occurred in the conductive layer.
摘要翻译：本发明提供一种陶瓷电路板，包括：陶瓷基板，其包含陶瓷晶粒和液相成分颗粒; 以及作为与陶瓷基板一体形成的电路形成的导电层，其中陶瓷基板的导热率为180W / m·K以上，陶瓷晶粒的平均粒径为10μm以下。根据上述结构，可以提供一种具有180W / mK以上的高导热性的陶瓷电路基板，具有优异的散热性和高强度，能够减少在组装和操作期间的裂纹形成的电路板，并且能够减少在导电层中发生的短路事故。

9. 发明授权

US6046499A Heat transfer configuration for a semiconductor device 失效
标题翻译：半导体器件的传热配置
公开(公告)号：US6046499A
公开(公告)日：2000-04-04
申请号：US824844
申请日：1997-03-26
申请人： Keiichi Yano , Hironori Asai
发明人： Keiichi Yano , Hironori Asai
IPC分类号： H01L23/367 , H01L23/498 , H01L23/34 , H01L23/48
CPC分类号： H01L23/49816 , H01L23/3677 , H01L24/45 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45565 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L24/48 , H01L24/73 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011
摘要： Disclosed is a semiconductor package having: a semiconductor chip; a package substrate; a wire connected to the semiconductor chip; and an electric connection member formed on the package substrate to electrically connect the wire to a printed board when the package substrate is mounted on the printed board. One surface of the package substrate has a first area in which the semiconductor chip is mounted and a second area in which the wire are arranged, and the other surface has a third area which is located in the rear of the second area and in which the electric connection member connects the wire to the printed board and a fourth area which is located in the rear of the first area. A heat-transfer member is provided in the fourth area and transmits heat generated by the semiconductor chip to the printed board through the package substrate.
摘要翻译：公开了一种半导体封装，其具有：半导体芯片; 封装衬底; 连接到半导体芯片的导线; 以及电连接构件，形成在所述封装基板上，以在将所述封装基板安装在所述印刷电路板上时将所述导线电连接到印刷电路板。封装基板的一个表面具有其中安装半导体芯片的第一区域和布置导线的第二区域，另一个表面具有位于第二区域的后部的第三区域，电连接构件将导线连接到印刷电路板和位于第一区域后部的第四区域。传热部件设置在第四区域中，并且通过封装基板将由半导体芯片产生的热量传递到印刷电路板。

10. 发明授权

US5969413A Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads 失效
标题翻译：半导体器件具有在载带上具有引线布线的片状芯片，该导线布置在用作外部引线的载带上
公开(公告)号：US5969413A
公开(公告)日：1999-10-19
申请号：US855931
申请日：1997-05-14
申请人： Keiichi Yano , Kazuo Kimura , Hironori Asai , Jun Monma , Koji Yamakawa , Mitsuyoshi Endo , Hirohisa Osoguchi
发明人： Keiichi Yano , Kazuo Kimura , Hironori Asai , Jun Monma , Koji Yamakawa , Mitsuyoshi Endo , Hirohisa Osoguchi
IPC分类号： H01L23/10 , H01L23/15 , H01L23/28 , H01L23/495 , H01L23/02 , H01L23/12 , H01L23/48
CPC分类号： H01L23/10 , H01L23/15 , H01L23/49572 , H01L24/50 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/30107
摘要： A semiconductor chip is supported on a tape carrier provided with lead wirings. The semiconductor chip is electrically connected to the lead wirings. The semiconductor chip of this quality is bonded in combination with the pe carrier to an aluminum nitride substrate. The lead wirings provided on the carrier combine the two functions as an internal lead and an external lead. The semiconductor package of such a structure as is described above allows multi-terminal connection by the narrowing of pitches between the leads and permits provision of a miniature package excelling in the heat-radiating property. Alternatively, the lead wirings supported on the tape carrier and electrically connected to the semiconductor chip are utilized as internal leads. For the external leads, such lead frames as are bonded to the aluminum nitride substrate are used. The lead frames are electrically connected to the internal leads provided in the tape carrier.
摘要翻译：半导体芯片被支撑在带有引线配线的带载体上。半导体芯片电连接到引线配线。该质量的半导体芯片与pe载体结合到氮化铝衬底上。载体上提供的导线结合了作为内部引线和外部引线的两个功能。如上所述的这种结构的半导体封装允许通过引线之间的间距变窄来实现多端子连接，并且允许提供具有优异的散热性能的微型封装。或者，支撑在带载体上并电连接到半导体芯片的引线配线被用作内部引线。对于外部引线，使用与氮化铝基板结合的引线框架。引线框架电连接到设置在带式载体中的内部引线。

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