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    • 2. 发明授权
    • Diesel engine start-up assisting device
    • 柴油发动机起动辅助装置
    • US08166946B2
    • 2012-05-01
    • US12690328
    • 2010-01-20
    • Keiichi SekiguchiShigeo YoshizakiHideki Asuke
    • Keiichi SekiguchiShigeo YoshizakiHideki Asuke
    • F02N11/08F02N11/10
    • F02P19/02F02N19/02F02P19/023F02P19/027
    • A diesel engine start-up assisting device includes a plurality of first-and-second switching elements 11a to 11d between a common direct-current power source 1 and a plurality of electrical load 3a to 3d, a plurality of start-up assisting main parts 10a to 10d and an input-and-output unit 7. The diesel engine start-up assisting device is constructed so as to enable start-up of a diesel engine when power distribution is applied to at least one of the electrical loads 3a to 3d. In arrangement, the first-and-second switching elements 11a to 11d, the start-up assisting main parts 10a to 10d and the input-and-output unit 7 are integrated into one package having a lead frame. Defining the first-and-second switching element as a pair of switching elements, the first-and-second switching elements 11a to 11d are arranged in parallel with each other on the lead frame, and the lead frame has a notch part formed between two pairs of switching elements adjoined to each other.
    • 柴油发动机起动辅助装置包括在公共直流电源1和多个电负载3a至3d之间的多个第一和第二开关元件11a至11d,多个启动辅助主要部分 10a至10d以及输入和输出单元7.柴油发动机起动辅助装置被构造成使得当对至少一个电负载3a至3d施加配电时能够启动柴油发动机 。 在第一和第二开关元件11a至11d,启动辅助主体部10a至10d以及输入和输出单元7中,集成在具有引线框架的一个封装中。 将第一和第二开关元件定义为一对开关元件,第一和第二开关元件11a至11d在引线框架上彼此平行地布置,并且引线框架具有形成在两个开关元件之间的切口部分 成对的开关元件彼此相邻。
    • 3. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US07776681B2
    • 2010-08-17
    • US12581328
    • 2009-10-19
    • Keiichi Sekiguchi
    • Keiichi Sekiguchi
    • H01L21/8238
    • H01L27/1288H01L27/1214H01L27/1266H01L27/13
    • A first resist mask and a second resist mask used for forming a gate electrode for a p-channel TFT and a gate electrode for an n-channel TFT are left, and a third resist mask is formed afterwards over a first area where one of the p-channel TFT and the n-channel TFT is to be formed; thus, a source region and a drain region are formed in a semiconductor film of the other one of the p-channel TFT and the n-channel TFT by adding first impurity ions using the second resist mask and the third resist mask. After that, the first resist mask, the second resist mask, and the third resist mask are removed, and a source region and a drain region are formed in a semiconductor film of the one of the p-channel TFT and the n-channel TFT by adding second impurity ions using a fourth resist mask.
    • 留下用于形成用于p沟道TFT的栅电极和用于n沟道TFT的栅电极的第一抗蚀剂掩模和第二抗蚀剂掩模,并且在第一区域之后形成第三抗蚀剂掩模, 要形成p沟道TFT和n沟道TFT; 因此,通过使用第二抗蚀剂掩模和第三抗蚀剂掩模添加第一杂质离子,在p沟道TFT和n沟道TFT中的另一个的半导体膜中形成源极区和漏极区。 之后,去除第一抗蚀剂掩模,第二抗蚀剂掩模和第三抗蚀剂掩模,并且在p沟道TFT和n沟道TFT之一的半导体膜中形成源极区和漏极区 通过使用第四抗蚀剂掩模添加第二杂质离子。
    • 5. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07705358B2
    • 2010-04-27
    • US11957270
    • 2007-12-14
    • Satoru OkamotoKeiichi Sekiguchi
    • Satoru OkamotoKeiichi Sekiguchi
    • H01L27/14
    • H01L29/78621H01L27/1214H01L27/127H01L29/42384H01L29/4908H01L29/66757H01L2029/7863
    • It is an object to improve operation characteristics and reliability of a semiconductor device. A semiconductor device which includes an island-shaped semiconductor film having a channel-formation region, a first low-concentration impurity region, a second low-concentration impurity region, and a high-concentration impurity region including a silicide layer; a gate insulating film; a first gate electrode overlapping with the channel-formation region and the first low-concentration impurity region with the gate insulating film interposed therebetween; a second gate electrode overlapping with the channel-formation region with the gate insulating film and the first gate electrode interposed therebetween; and a sidewall formed on side surfaces of the first gate electrode and the second gate electrode. In the semiconductor device, a thickness of the gate insulating film is smaller in a region over the second low-concentration impurity region than in a region over the first low-concentration impurity region.
    • 本发明的目的是提高半导体器件的操作特性和可靠性。 一种半导体器件,包括具有沟道形成区域,第一低浓度杂质区域,第二低浓度杂质区域和包括硅化物层的高浓度杂质区域的岛状半导体膜; 栅极绝缘膜; 与所述沟道形成区域和所述第一低浓度杂质区域重叠的第一栅极电极,其间具有所述栅极绝缘膜; 与所述沟道形成区域重叠的栅极电极与所述栅极绝缘膜和所述第一栅极电极重叠; 以及形成在第一栅电极和第二栅电极的侧表面上的侧壁。 在半导体器件中,栅极绝缘膜的厚度在第二低浓度杂质区域以上比在第一低浓度杂质区域以上的区域小。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100041190A1
    • 2010-02-18
    • US12581328
    • 2009-10-19
    • Keiichi SEKIGUCHI
    • Keiichi SEKIGUCHI
    • H01L21/8238
    • H01L27/1288H01L27/1214H01L27/1266H01L27/13
    • A first resist mask and a second resist mask used for forming a gate electrode for a p-channel TFT and a gate electrode for an n-channel TFT are left, and a third resist mask is formed afterwards over a first area where one of the p-channel TFT and the n-channel TFT is to be formed; thus, a source region and a drain region are formed in a semiconductor film of the other one of the p-channel TFT and the n-channel TFT by adding first impurity ions using the second resist mask and the third resist mask. After that, the first resist mask, the second resist mask, and the third resist mask are removed, and a source region and a drain region are formed in a semiconductor film of the one of the p-channel TFT and the n-channel TFT by adding second impurity ions using a fourth resist mask.
    • 留下用于形成用于p沟道TFT的栅电极和用于n沟道TFT的栅电极的第一抗蚀剂掩模和第二抗蚀剂掩模,并且在第一区域之后形成第三抗蚀剂掩模, 要形成p沟道TFT和n沟道TFT; 因此,通过使用第二抗蚀剂掩模和第三抗蚀剂掩模添加第一杂质离子,在p沟道TFT和n沟道TFT中的另一个的半导体膜中形成源极区和漏极区。 之后,去除第一抗蚀剂掩模,第二抗蚀剂掩模和第三抗蚀剂掩模,并且在p沟道TFT和n沟道TFT之一的半导体膜中形成源极区和漏极区 通过使用第四抗蚀剂掩模添加第二杂质离子。
    • 7. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US07638372B2
    • 2009-12-29
    • US11452288
    • 2006-06-14
    • Keiichi Sekiguchi
    • Keiichi Sekiguchi
    • H01L21/00
    • H01L27/1288H01L27/1214H01L27/1266H01L27/13
    • A first resist mask and a second resist mask used for forming a gate electrode for a p-channel TFT and a gate electrode for an n-channel TFT are left, and a third resist mask is formed afterwards over a first area where one of the p-channel TFT and the n-channel TFT is to be formed; thus, a source region and a drain region are formed in a semiconductor film of the other one of the p-channel TFT and the n-channel TFT by adding first impurity ions using the second resist mask and the third resist mask. After that, the first resist mask, the second resist mask, and the third resist mask are removed, and a source region and a drain region are formed in a semiconductor film of the one of the p-channel TFT and the n-channel TFT by adding second impurity ions using a fourth resist mask.
    • 留下用于形成用于p沟道TFT的栅电极和用于n沟道TFT的栅电极的第一抗蚀剂掩模和第二抗蚀剂掩模,并且在第一区域之后形成第三抗蚀剂掩模, 要形成p沟道TFT和n沟道TFT; 因此,通过使用第二抗蚀剂掩模和第三抗蚀剂掩模添加第一杂质离子,在p沟道TFT和n沟道TFT中的另一个的半导体膜中形成源极区和漏极区。 之后,去除第一抗蚀剂掩模,第二抗蚀剂掩模和第三抗蚀剂掩模,并且在p沟道TFT和n沟道TFT之一的半导体膜中形成源极区和漏极区 通过使用第四抗蚀剂掩模添加第二杂质离子。