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    • 4. 发明授权
    • Diesel engine start-up assisting device
    • 柴油发动机起动辅助装置
    • US08166946B2
    • 2012-05-01
    • US12690328
    • 2010-01-20
    • Keiichi SekiguchiShigeo YoshizakiHideki Asuke
    • Keiichi SekiguchiShigeo YoshizakiHideki Asuke
    • F02N11/08F02N11/10
    • F02P19/02F02N19/02F02P19/023F02P19/027
    • A diesel engine start-up assisting device includes a plurality of first-and-second switching elements 11a to 11d between a common direct-current power source 1 and a plurality of electrical load 3a to 3d, a plurality of start-up assisting main parts 10a to 10d and an input-and-output unit 7. The diesel engine start-up assisting device is constructed so as to enable start-up of a diesel engine when power distribution is applied to at least one of the electrical loads 3a to 3d. In arrangement, the first-and-second switching elements 11a to 11d, the start-up assisting main parts 10a to 10d and the input-and-output unit 7 are integrated into one package having a lead frame. Defining the first-and-second switching element as a pair of switching elements, the first-and-second switching elements 11a to 11d are arranged in parallel with each other on the lead frame, and the lead frame has a notch part formed between two pairs of switching elements adjoined to each other.
    • 柴油发动机起动辅助装置包括在公共直流电源1和多个电负载3a至3d之间的多个第一和第二开关元件11a至11d,多个启动辅助主要部分 10a至10d以及输入和输出单元7.柴油发动机起动辅助装置被构造成使得当对至少一个电负载3a至3d施加配电时能够启动柴油发动机 。 在第一和第二开关元件11a至11d,启动辅助主体部10a至10d以及输入和输出单元7中,集成在具有引线框架的一个封装中。 将第一和第二开关元件定义为一对开关元件,第一和第二开关元件11a至11d在引线框架上彼此平行地布置,并且引线框架具有形成在两个开关元件之间的切口部分 成对的开关元件彼此相邻。
    • 5. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US07776681B2
    • 2010-08-17
    • US12581328
    • 2009-10-19
    • Keiichi Sekiguchi
    • Keiichi Sekiguchi
    • H01L21/8238
    • H01L27/1288H01L27/1214H01L27/1266H01L27/13
    • A first resist mask and a second resist mask used for forming a gate electrode for a p-channel TFT and a gate electrode for an n-channel TFT are left, and a third resist mask is formed afterwards over a first area where one of the p-channel TFT and the n-channel TFT is to be formed; thus, a source region and a drain region are formed in a semiconductor film of the other one of the p-channel TFT and the n-channel TFT by adding first impurity ions using the second resist mask and the third resist mask. After that, the first resist mask, the second resist mask, and the third resist mask are removed, and a source region and a drain region are formed in a semiconductor film of the one of the p-channel TFT and the n-channel TFT by adding second impurity ions using a fourth resist mask.
    • 留下用于形成用于p沟道TFT的栅电极和用于n沟道TFT的栅电极的第一抗蚀剂掩模和第二抗蚀剂掩模,并且在第一区域之后形成第三抗蚀剂掩模, 要形成p沟道TFT和n沟道TFT; 因此,通过使用第二抗蚀剂掩模和第三抗蚀剂掩模添加第一杂质离子,在p沟道TFT和n沟道TFT中的另一个的半导体膜中形成源极区和漏极区。 之后,去除第一抗蚀剂掩模,第二抗蚀剂掩模和第三抗蚀剂掩模,并且在p沟道TFT和n沟道TFT之一的半导体膜中形成源极区和漏极区 通过使用第四抗蚀剂掩模添加第二杂质离子。
    • 7. 发明申请
    • LOAD DRIVE APPARATUS
    • 负载驱动装置
    • US20090237853A1
    • 2009-09-24
    • US12307321
    • 2007-06-21
    • Yuji KatoKeiichi SekiguchiKiyokatsu Satoh
    • Yuji KatoKeiichi SekiguchiKiyokatsu Satoh
    • H02H5/04
    • H03K17/0822H03K2017/0806
    • A load drive apparatus is provided which comprises a switching element 3 connected in series to a DC power source Vccand an electric load 4, a drive circuit 5 for generating control signals to turn switching element 3 on and off, a thermal detection element 6 for sensing a temperature of switching element 3, an overheat protective circuit 7 for generating an overheat detection signal when thermal detection element 6 senses the temperature of switching element 3 over a predetermined temperature level, and a disconnection detection circuit 11 provided with a current mirror circuit 12 connected between one and the other terminals of thermal detection element 6 for detecting a disconnection in wiring between thermal detection element 6 and overheat protective circuit 7. When overheat protective circuit 7 produces an overheat detection signal or when disconnection detection circuit 11 detects a breaking of wiring between thermal detection element 6 and overheat protective circuit 7, the control signal from drive circuit 5 is prohibited to be given to switching element 3. In case of disconnection in wiring between the thirmal detection element 6 and overheat protective circuit 7, the load drive apparatus can prevent thermal damage to the switching element used therein.
    • 提供一种负载驱动装置,其包括与DC电源Vcc和电负载4串联连接的开关元件3,用于产生控制信号以使开关元件3导通和截止的驱动电路5,用于感测的热检测元件6 开关元件3的温度,当热检测元件6在预定温度水平上感测开关元件3的温度时产生过热检测信号的过热保护电路7以及连接有电流镜电路12的断路检测电路11 用于检测热检测元件6和过热保护电路7之间的布线断开的热检测元件6的一个端子和另一个端子之间。当过热保护电路7产生过热检测信号时,或者当断路检测电路11检测到 热检测元件6和过热保护电路7, 来自驱动电路5的起动信号被禁止提供给开关元件3.在这些检测元件6与过热保护电路7之间的布线断开的情况下,负载驱动装置可以防止对其中使用的开关元件的热损坏。
    • 8. 发明授权
    • Manufacturing method of SOI substrate
    • SOI衬底的制造方法
    • US08936999B2
    • 2015-01-20
    • US13341057
    • 2011-12-30
    • Keiichi SekiguchiKazuya HanaokaDaigo Ito
    • Keiichi SekiguchiKazuya HanaokaDaigo Ito
    • H01L21/84H01L21/02H01L29/786
    • H01L21/02024H01L21/0206H01L21/76254H01L29/78603
    • An SOI substrate including a semiconductor layer whose thickness is even is provided. According to a method for manufacturing the SOI substrate, the semiconductor layer is formed over a base substrate. In the method, a first surface of a semiconductor substrate is polished to be planarized; a second surface of the semiconductor substrate which is opposite to the first surface is irradiated with ions, so that an embrittled region is formed in the semiconductor substrate; the second surface is attached to the base substrate, so that the semiconductor substrate is attached to the base substrate; and separation in the embrittled region is performed. The value of 3σ (σ denotes a standard deviation of thickness of the semiconductor layer) is less than or equal to 1.5 nm.
    • 提供了包括厚度均匀的半导体层的SOI衬底。 根据SOI基板的制造方法,在基底基板上形成半导体层。 在该方法中,半导体衬底的第一表面被抛光以被平面化; 半导体衬底的与第一表面相对的第二表面被离子照射,从而在半导体衬底中形成脆化区域; 所述第二表面附接到所述基底基板,使得所述半导体基板被附接到所述基底基板; 并进行脆化区域的分离。 3&sgr的价值 (&sgr;表示半导体层的厚度的标准偏差)小于或等于1.5nm。
    • 9. 发明授权
    • Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
    • 半导体基板的制造方法及半导体装置的制造方法
    • US08445358B2
    • 2013-05-21
    • US13070513
    • 2011-03-24
    • Keiichi Sekiguchi
    • Keiichi Sekiguchi
    • H01L21/762
    • H01L27/1266H01L21/76254H01L27/1214H01L27/1296H01L29/66772
    • An object of the present invention is to reduce the influence of a foreign substance adhering to a single crystalline semiconductor substrate and manufacture a semiconductor substrate with a high yield. Another object of the present invention is to manufacture, with a high yield, a semiconductor device which has stable characteristics. In the process of manufacturing a semiconductor substrate, when an embrittled region is to be formed in a single crystalline semiconductor substrate, the surface of the single crystalline semiconductor substrate is irradiated with hydrogen ions from oblique directions at multiple (at least two) different angles, thereby allowing the influence of a foreign substance adhering to the single crystalline semiconductor substrate to be reduced and allowing a semiconductor substrate including a uniform single crystalline semiconductor layer to be manufactured with a high yield.
    • 本发明的目的是减少附着在单晶半导体衬底上的异物的影响,并以高产率制造半导体衬底。 本发明的另一个目的是以高产率制造具有稳定特性的半导体器件。 在制造半导体衬底的过程中,当在单晶半导体衬底中形成脆化区域时,单斜半导体衬底的表面以多个(至少两个)不同的角度从倾斜方向照射氢离子, 从而允许降低附着在单晶半导体衬底上的异物的影响,并允许以高产率制造包括均匀的单晶半导体层的半导体衬底。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20080150027A1
    • 2008-06-26
    • US11957270
    • 2007-12-14
    • Satoru OkamotoKeiichi Sekiguchi
    • Satoru OkamotoKeiichi Sekiguchi
    • H01L29/786H01L21/84
    • H01L29/78621H01L27/1214H01L27/127H01L29/42384H01L29/4908H01L29/66757H01L2029/7863
    • It is an object to improve operation characteristics and reliability of a semiconductor device. A semiconductor device which includes an island-shaped semiconductor film having a channel-formation region, a first low-concentration impurity region, a second low-concentration impurity region, and a high-concentration impurity region including a silicide layer; a gate insulating film; a first gate electrode overlapping with the channel-formation region and the first low-concentration impurity region with the gate insulating film interposed therebetween; a second gate electrode overlapping with the channel-formation region with the gate insulating film and the first gate electrode interposed therebetween; and a sidewall formed on side surfaces of the first gate electrode and the second gate electrode. In the semiconductor device, a thickness of the gate insulating film is smaller in a region over the second low-concentration impurity region than in a region over the first low-concentration impurity region.
    • 本发明的目的是提高半导体器件的操作特性和可靠性。 一种半导体器件,包括具有沟道形成区域,第一低浓度杂质区域,第二低浓度杂质区域和包括硅化物层的高浓度杂质区域的岛状半导体膜; 栅极绝缘膜; 与所述沟道形成区域和所述第一低浓度杂质区域重叠的第一栅极电极,其间具有所述栅极绝缘膜; 与所述沟道形成区域重叠的栅极电极与所述栅极绝缘膜和所述第一栅极电极重叠; 以及形成在第一栅电极和第二栅电极的侧表面上的侧壁。 在半导体器件中,栅极绝缘膜的厚度在第二低浓度杂质区域以上比在第一低浓度杂质区域以上的区域小。