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2. 发明授权

US5070041A Method of removing flash from a semiconductor leadframe using coated leadframe and solvent 失效
标题翻译：使用涂覆的铅笔和溶剂从半导体引线去除闪光的方法
公开(公告)号：US5070041A
公开(公告)日：1991-12-03
申请号：US391986
申请日：1989-08-10
申请人： Shigeru Katayama , Kaoru Tominaga , Toshio Suetsugu , Kazumi Matsumoto
发明人： Shigeru Katayama , Kaoru Tominaga , Toshio Suetsugu , Kazumi Matsumoto
IPC分类号： H01L21/48 , H01L21/50 , H01L23/10
CPC分类号： H01L21/50 , H01L21/4835 , H01L23/10 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , Y10T29/49121
摘要： In accordance with the present invention, semiconductor devices are produced by the process involving the steps of obtaining a core-box resin molded item integrated with a lead frame by coating said lead frame on its portions expected to be in non-contact with said core-box resin molded item with an organic high molecular substance having a melting or softening point higher than the molding temperature of the resin constituting said core-box resin molded item and soluble in a solvent which does not dissolve said core-box resin molded item, placing the thus coated lead frame in position within a mold and injecting the resin into the mold thereby carrying out injection or transfer molding and immersing the lead frame bearing core-box resin molded item obtained in the foregoing step in said solvent to remove by dissolving said organic high molecular substance. On that account, flashes of the resin formed on the lead frame can be removed with facility or the formation of said flashes can be suppressed without damaging the resin molded portion, whereby a good electrical connection between the lead frame and the semiconductor element can be accomplished.
摘要翻译：半导体器件通过以下方法制造，该方法包括以下步骤：通过在预期与所述芯盒树脂模制品不接触的部分上涂覆所述引线框架以获得与引线框架一体化的芯盒树脂模塑件，熔点或软化点高于构成所述芯盒树脂成型品的树脂的成型温度并溶解在不溶解所述芯盒树脂成型品的溶剂中的高分子物质，将这样涂覆的引线框架放置在位在模具内并将树脂注入模具中，从而进行注射或转印成型，并将在上述步骤中获得的引线框架轴承芯盒树脂模制品浸入所述溶剂中，以通过溶解所述有机高分子物质除去。因此，可以抑制在引线框架上形成的树脂闪光，同时可以抑制闪光形成的设备，而不会损坏树脂模制部分，从而可以实现引线框架和半导体元件之间良好的电连接。本发明的另外的方法涉及使用超声波帮助消除闪光，并且还可以选择引线框架和树脂盒的材料，其线性膨胀系数相差小于所选择的量，以便实现良好的相互粘合和耐湿性。

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