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1. 外观设计

USD1039950S1 Carabiner clip 有权
公开(公告)号：USD1039950S1
公开(公告)日：2024-08-27
申请号：US29935276
申请日：2024-04-01
申请人： Kai Lin
设计人： Kai Lin
摘要： FIG. 1 is a perspective view of a carabiner clip showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a front view of the carabiner clip in an open configuration of use.

2. 发明授权

US10043653B2 Maranagoni dry with low spin speed for charging release 有权
公开(公告)号：US10043653B2
公开(公告)日：2018-08-07
申请号：US13595787
申请日：2012-08-27
申请人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
发明人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
IPC分类号： B08B3/02 , H01L21/02 , H01L21/67 , C11D11/00 , C11D7/26
CPC分类号： H01L21/02052 , C11D7/261 , C11D11/0047 , H01L21/67028
摘要： A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

3. 发明申请

US20160031985A1 CHARGE-ENGINEERED ANTIBODIES OR COMPOSITIONS OF PENETRATION-ENHANCED TARGETING PROTEINS AND METHODS OF USE 审中-公开
标题翻译：充电工程抗体或渗透增强的靶向蛋白的组合物及其使用方法
公开(公告)号：US20160031985A1
公开(公告)日：2016-02-04
申请号：US14776157
申请日：2014-03-14
申请人： Katherine S. BOWDISH , James S. HUSTON , Erik M. VOGAN , Heather COOKE , John ROSS , Kai LIN , PERMEON BIOLOGICS, INC.
发明人： Katherine S. Bowdish , James S. Huston , Erik M. Vogan , Heather Cooke , John Ross , Kai Lin
IPC分类号： C07K16/28 , C07K19/00 , C07K16/30 , C12N9/86
CPC分类号： C07K16/28 , A61K47/6801 , A61K47/6849 , A61K47/6855 , A61K2039/505 , C07K16/00 , C07K16/2887 , C07K16/30 , C07K16/3015 , C07K16/3023 , C07K16/303 , C07K16/3038 , C07K16/3069 , C07K16/32 , C07K19/00 , C07K2317/14 , C07K2317/20 , C07K2317/21 , C07K2317/24 , C07K2317/31 , C07K2317/52 , C07K2317/522 , C07K2317/524 , C07K2317/526 , C07K2317/53 , C07K2317/565 , C07K2317/622 , C07K2317/73 , C07K2317/77 , C07K2317/92 , C07K2317/94 , C07K2318/10 , C07K2319/01 , C07K2319/30 , C07K2319/60 , C12N9/86 , C12Y305/02006
摘要： The disclosure relates to charge-engineered antibodies and penetration-enhanced targeted proteins and their uses for therapeutic treatment or therapeutics delivery.
摘要翻译：本公开涉及电荷工程化抗体和渗透增强靶向蛋白及其用于治疗性治疗或治疗递送的用途。

4. 发明申请

US20150163908A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20150163908A1
公开(公告)日：2015-06-11
申请号：US14181739
申请日：2014-02-17
申请人： Chin-Sheng Wang , Ching-Sheng Chen , Chun-Kai Lin , Chao-Min Wang
发明人： Chin-Sheng Wang , Ching-Sheng Chen , Chun-Kai Lin , Chao-Min Wang
IPC分类号： H05K1/11 , H05K3/42 , H05K3/40 , H05K1/09
CPC分类号： H05K1/113 , H05K1/115 , H05K3/0097 , H05K3/4007 , H05K2201/0376 , H05K2201/09509 , H05K2201/0959 , H05K2203/0152 , H05K2203/0156 , H05K2203/1536 , H05K2203/1563 , Y10T29/49165
摘要： A circuit board includes a circuit layer, a first solder resist layer, a second solder resist layer and at least one conductive bump. The first solder resist layer is disposed on a lower surface of the circuit layer and has at least one first opening exposing a portion of the lower surface of the circuit layer. The second solder resist layer is disposed on an upper surface of the circuit layer and has at least one second opening exposing a portion of the upper surface of the circuit layer. The conductive bump is disposed inside the second opening of the second solder resist layer and directly connects to the upper surface of the circuit layer exposed by the second opening. A top surface of the conductive bump is higher than a second surface of the second solder resist layer.
摘要翻译：电路板包括电路层，第一阻焊层，第二阻焊层和至少一个导电凸块。第一阻焊层设置在电路层的下表面上，并且具有暴露电路层的下表面的一部分的至少一个第一开口。第二阻焊层设置在电路层的上表面上，并且具有暴露电路层的上表面的一部分的至少一个第二开口。导电凸块设置在第二阻焊层的第二开口内，并且直接连接到由第二开口暴露的电路层的上表面。导电凸块的顶表面高于第二阻焊层的第二表面。

5. 发明申请

US20140339291A1 Method for Enhancing the Yield Rate of Ball Implanting of a Substrate of an Integrated Circuit 有权
标题翻译：提高集成电路基体的球体植入率的方法
公开(公告)号：US20140339291A1
公开(公告)日：2014-11-20
申请号：US13896393
申请日：2013-05-17
申请人： Chao-Shang Chen , Yu-Kai Lin
发明人： Chao-Shang Chen , Yu-Kai Lin
IPC分类号： B23K3/06
CPC分类号： B23K3/0623
摘要： A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.
摘要翻译：一种用于通过操作球注入机器来植入集成电路的焊球的方法。球体植入机包括抽吸夹具，排气装置，两个枢转和翻转装置，导向板，球载体和基底。抽吸夹具具有多个球槽。引导板具有多个引导孔，每个引导孔与抽吸夹具的相应的一个球槽对准。球载体包含多个焊球。因此，每个焊球通过引导板的相应引导孔延伸到吸引夹具的相应球槽中，使得焊球不会从引导板向外突出，并且不会相互干扰或堵塞在球载体运动期间。

6. 发明授权

US08824139B2 Handheld electronic device 有权
标题翻译：手持电子设备
公开(公告)号：US08824139B2
公开(公告)日：2014-09-02
申请号：US13181531
申请日：2011-07-13
申请人： Chih-Wei Chen , Hsi-Hsing Hsu , Che-Kai Lin
发明人： Chih-Wei Chen , Hsi-Hsing Hsu , Che-Kai Lin
IPC分类号： H05K5/00 , H05K7/00 , G11B33/02 , A47G1/10 , E04G3/00 , A47B96/06 , E05C5/02 , H04M1/02
CPC分类号： H04M1/0237 , Y10T74/1555
摘要： A handheld electronic device includes a first body, a second body, and a locating member. The second body is slidably connected to the first body, and has a slide surface and a locating opening. The locating opening is located at an end of the slide surface. The locating member has an elastic portion and a sliding portion, the elastic portion is disposed between the first body and the sliding portion, and the sliding portion is capable of leaning against the slide surface or being inserted in the locating opening under an elastic prestress of the elastic portion.
摘要翻译：手持电子设备包括第一主体，第二主体和定位构件。第二主体可滑动地连接到第一主体，并且具有滑动面和定位开口。定位开口位于滑动表面的一端。定位构件具有弹性部分和滑动部分，弹性部分设置在第一主体和滑动部分之间，并且滑动部分能够抵靠滑动表面倾斜或者在弹性预定位置处插入到定位开口中弹性部分。

7. 发明申请

US20140171363A1 BICYCLIC ACETYL-COA CARBOXYLASE INHIBITORS AND USES THEREOF 审中-公开
标题翻译：双酚A乙酰羧化酶抑制剂及其用途
公开(公告)号：US20140171363A1
公开(公告)日：2014-06-19
申请号：US14188647
申请日：2014-02-24
申请人： David Weninger BARNES , Gregory Raymond BEBERNITZ , Kevin CLAIRMONT , Scott Louis COHEN , Robert Edson DAMON, II , Robert Francis DAY , Stephanie Kay DODD , Christoph GAUL , Hatice Belgin GULGEZE EFTHYMIOU , Monish JAIN , Rajeshri Ganesh KARKI , Louise Clare KIRMAN , Kai LIN , Justin Yik Ching MAO , Tajesh Jayprakash PATEL , Brian Kenneth RAYMER , SU Liansheng
发明人： David Weninger BARNES , Gregory Raymond BEBERNITZ , Kevin CLAIRMONT , Scott Louis COHEN , Robert Edson DAMON, II , Robert Francis DAY , Stephanie Kay DODD , Christoph GAUL , Hatice Belgin GULGEZE EFTHYMIOU , Monish JAIN , Rajeshri Ganesh KARKI , Louise Clare KIRMAN , Kai LIN , Justin Yik Ching MAO , Tajesh Jayprakash PATEL , Brian Kenneth RAYMER , SU Liansheng
IPC分类号： A61K31/542 , A61K31/4184 , C07D235/12 , C07D403/04 , C07D405/04 , C07D235/30 , C07D235/16 , C07D405/14 , A61K31/496 , C07D263/57 , A61K31/423 , C07D209/24 , A61K31/404 , C07D413/12 , A61K31/5377 , C07D513/04 , A61K45/06 , C07D235/08
CPC分类号： A61K31/542 , A61K9/0014 , A61K9/0019 , A61K9/0095 , A61K9/08 , A61K9/1075 , A61K31/404 , A61K31/4184 , A61K31/423 , A61K31/496 , A61K31/5377 , A61K45/06 , C07D209/24 , C07D215/36 , C07D235/08 , C07D235/12 , C07D235/16 , C07D235/18 , C07D235/30 , C07D263/57 , C07D401/04 , C07D401/12 , C07D403/04 , C07D405/04 , C07D405/14 , C07D413/12 , C07D471/04 , C07D513/04 , C12N9/93 , C12Y604/01002
摘要： The present invention provides compounds of formula (I); or pharmaceutically acceptable salts thereof, wherein the variables are defined as herein. The present invention provides a method for manufacturing the compounds of formula (I), their therapeutic uses, combinations with other of pharmacologically active agents, and a pharmaceutical compositions.
摘要翻译：本发明提供式（I）化合物; 或其药学上可接受的盐，其中变量如本文所定义。本发明提供了制备式（I）化合物，其治疗用途，与其他药理学活性剂的组合以及药物组合物的方法。

8. 发明授权

US08745552B2 EDA tool and method, and integrated circuit formed by the method 有权
标题翻译： EDA工具和方法，并通过该方法形成集成电路
公开(公告)号：US08745552B2
公开(公告)日：2014-06-03
申请号：US13484488
申请日：2012-05-31
申请人： Hsien-Yu Tseng , Shih-Kai Lin , Chin-Shen Lin , Yu-Sian Jiang , Heng-Kai Liu , Mu-Jen Huang , Chien-Wen Chen
发明人： Hsien-Yu Tseng , Shih-Kai Lin , Chin-Shen Lin , Yu-Sian Jiang , Heng-Kai Liu , Mu-Jen Huang , Chien-Wen Chen
IPC分类号： G06F17/50
CPC分类号： H01L23/528 , G06F17/5068 , G06F17/5081 , G06F2217/12 , H01L21/76816 , H01L23/53228 , H01L27/0207
摘要： A method comprises: accessing data representing a layout of a layer of an integrated circuit (IC) comprising a plurality of polygons defining circuit patterns to be divided among a number (N) of photomasks for multi-patterning a single layer of a semiconductor substrate, where N is greater than one. For each set of N parallel polygons in the layout closer to each other than a minimum separation for patterning with a single photomask, at least N−1 stitches are inserted in each polygon within that set to divide each polygon into at least N parts, such that adjacent parts of different polygons are assigned to different photomasks from each other. Data representing assignment of each of the parts in each set to respective photomasks are stored in a non-transitory, computer readable storage medium that is accessible for use in a process to fabricate the N photomasks.
摘要翻译：一种方法包括：访问表示集成电路（IC）的层的布局的数据，所述集成电路的层包括多个多边形，所述多边形限定电路图案，以划分数个（N）个光掩模，用于多个图案化半导体衬底的单层; 其中N大于1。对于布局中的每个N个平行多边形组合，彼此比用用于单一光掩模进行图案化的最小间隔更靠近，至少N-1个针脚被插入到该组内的每个多边形中以将每个多边形分成至少N个部分，例如不同多边形的相邻部分被分配给彼此不同的光掩模。表示将每个组中的每个部分分配给相应光掩模的数据被存储在非瞬时的计算机可读存储介质中，该介质可访问以用于制造N个光掩模的过程。

9. 发明授权

US08697739B2 Bicyclic acetyl-CoA carboxylase inhibitors and uses thereof 有权
标题翻译：双环乙酰辅酶A羧化酶抑制剂及其用途
公开(公告)号：US08697739B2
公开(公告)日：2014-04-15
申请号：US13189760
申请日：2011-07-25
申请人： David Weninger Barnes , Gregory Raymond Bebernitz , Kevin Clairmont , Scott Louis Cohen , Robert Edson Damon , Robert Francis Day , Stephanie Kay Dodd , Christoph Gaul , Hatice Belgin Gulgeze Efthymiou , Monish Jain , Rajeshri Ganesh Karki , Louise Clare Kirman , Kai Lin , Justin Yik Ching Mao , Tajesh Jayprakash Patel , Brian Kenneth Raymer , Liansheng Su
发明人： David Weninger Barnes , Gregory Raymond Bebernitz , Kevin Clairmont , Scott Louis Cohen , Robert Edson Damon , Robert Francis Day , Stephanie Kay Dodd , Christoph Gaul , Hatice Belgin Gulgeze Efthymiou , Monish Jain , Rajeshri Ganesh Karki , Louise Clare Kirman , Kai Lin , Justin Yik Ching Mao , Tajesh Jayprakash Patel , Brian Kenneth Raymer , Liansheng Su
IPC分类号： C07D215/00 , C07D235/04 , A61K31/4985 , A61K31/47
CPC分类号： A61K31/542 , A61K9/0014 , A61K9/0019 , A61K9/0095 , A61K9/08 , A61K9/1075 , A61K31/404 , A61K31/4184 , A61K31/423 , A61K31/496 , A61K31/5377 , A61K45/06 , C07D209/24 , C07D215/36 , C07D235/08 , C07D235/12 , C07D235/16 , C07D235/18 , C07D235/30 , C07D263/57 , C07D401/04 , C07D401/12 , C07D403/04 , C07D405/04 , C07D405/14 , C07D413/12 , C07D471/04 , C07D513/04 , C12N9/93 , C12Y604/01002
摘要： The present invention provides compounds of formula (I); or pharmaceutically acceptable salts thereof, wherein the variables are defined as herein. The present invention provides a method for manufacturing the compounds of formula (I), their therapeutic uses, combinations with other of pharmacologically active agents, and a pharmaceutical compositions.
摘要翻译：本发明提供式（I）化合物; 或其药学上可接受的盐，其中变量如本文所定义。本发明提供了制备式（I）化合物，其治疗用途，与其他药理学活性剂的组合以及药物组合物的方法。

10. 发明申请

US20140053869A1 Maranagoni Dry with Low Spin Speed for Charging Release 审中-公开
标题翻译： Maranagoni干燥与低旋转速度充电释放
公开(公告)号：US20140053869A1
公开(公告)日：2014-02-27
申请号：US13595787
申请日：2012-08-27
申请人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
发明人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
IPC分类号： B08B3/02 , H01L21/02
CPC分类号： H01L21/02052 , C11D7/261 , C11D11/0047 , H01L21/67028
摘要： A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.
摘要翻译：一种清洁和干燥半导体晶片的方法，包括将半导体晶片插入清洁工具的腔室中，将半导体晶片在约300转/分钟至约1600转/分钟的范围内旋转，同时用de 去离子水和异丙醇和氮气的混合物。

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