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    • 4. 发明申请
    • SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    • 半导体器件及其制造方法
    • US20120052674A1
    • 2012-03-01
    • US13214462
    • 2011-08-22
    • Jaegoo LEEYoungwoo ParkJungdal Choi
    • Jaegoo LEEYoungwoo ParkJungdal Choi
    • H01L21/8239
    • H01L27/11578H01L27/11582H01L29/4234H01L29/7827H01L29/7926
    • A method of fabricating a semiconductor memory device includes forming a mold stack on a substrate and the mold stack including first sacrificial layers and second sacrificial layers alternately stacked on the substrate. The method also includes forming a plurality of vertical channels that penetrate the mold stack and that contact the substrate, patterning the mold stack to form word line cuts between the vertical channels, the word line cuts exposing the substrate, removing one of the first and second sacrificial layers to form recessed regions in the mold stack, forming a data storage layer, at least a portion of the data storage layer being formed between the vertical channels and the gates, forming gates in the recessed regions, forming air gaps between the gates by removing the other of the first and second sacrificial layers, and forming an insulation layer pattern in the word line cuts.
    • 一种制造半导体存储器件的方法包括在衬底上形成模具堆叠,并且模具叠层包括交替层叠在衬底上的第一牺牲层和第二牺牲层。 该方法还包括形成多个垂直通道,其穿过模具叠层并与衬底接触,图案化模具叠层以形成垂直通道之间的字线切口,字线切割暴露衬底,去除第一和第二 牺牲层,以在模具堆叠中形成凹陷区域,形成数据存储层,数据存储层的至少一部分形成在垂直沟道和栅极之间,在凹陷区域中形成栅极,在栅极之间形成气隙,通过 去除第一和第二牺牲层中的另一个,并且在字线切割中形成绝缘层图案。