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1. 发明申请

US20150075844A1 ARRAY PRINTED CIRCUIT BOARD, METHOD OF REPLACING DEFECTIVE SINGLE PRINTED CIRCUIT BOARD OF THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME 有权
标题翻译：阵列印刷电路板，替代其有缺陷的单列印刷电路板的方法以及使用其制造电子设备的方法
公开(公告)号：US20150075844A1
公开(公告)日：2015-03-19
申请号：US14458249
申请日：2014-08-12
申请人： Young-hoon KIM , Hyun-seok CHOI , Joo-han LEE , Da-hye CHOE
发明人： Young-hoon KIM , Hyun-seok CHOI , Joo-han LEE , Da-hye CHOE
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14
CPC分类号： H05K1/0268 , H05K1/0292 , H05K3/0052 , H05K3/0097 , H05K3/225
摘要： An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.
摘要翻译：提供阵列印刷电路板（PCB），其中可以容易地更换有缺陷的单个PCB。还提供了更换有缺陷的单个PCB的方法和制造电子设备的方法。阵列PCB可以包括多个单个PCB。轨道部分可以围绕单个PCB。多个翼片路线部分将单个PCB连接到轨道部分，每个翼片路线部分包括至少一对通孔电极。测试端子部分可以形成在轨道部分的一侧，并且可以包括多个测试端子。所述至少一对通孔电极可以包括邻近所述轨道部分设置并电连接到相应测试端子的第一通孔电极，以及邻近并电连接到相应的单个PCB布置的第二通孔电极。

2. 发明申请

US20130314887A1 Slot-Mounted Printed Circuit Board Having Small Insertion Force 有权
标题翻译：具有小插入力的插槽式印刷电路板
公开(公告)号：US20130314887A1
公开(公告)日：2013-11-28
申请号：US13759504
申请日：2013-02-05
申请人： Jin-San Jung , Joo-Han Lee , Hyun-Seok Choi
发明人： Jin-San Jung , Joo-Han Lee , Hyun-Seok Choi
IPC分类号： H05K1/14 , H05K3/02 , H05K3/22
CPC分类号： H05K1/141 , H05K1/117 , H05K3/0052 , H05K3/02 , H05K3/22 , H05K2201/09154 , H05K2201/09172 , H05K2201/10159 , H05K2203/0228 , Y10T29/49155 , Y10T29/49156
摘要： A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.
摘要翻译：印刷电路板（PCB）通过减少PCB插入插槽中时的插入力，防止PCB和插针的插针损坏。 PCB包括主体部分，其包括形成在第一表面和第二表面中的至少一个上的第一表面和第二表面以及金属互连层。金属互连层包括沿主体部分的第一边缘形成的突出部。在第一边缘中形成其中去除主体部分的至少一部分的插入力减轻部分，以减小将PCB安置在槽内所需的插入力。

3. 发明申请

US20110250826A1 PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有减少摩擦力的PAD调节器及其制造方法
公开(公告)号：US20110250826A1
公开(公告)日：2011-10-13
申请号：US13081981
申请日：2011-04-07
申请人： So Young YOON , Joo Han LEE , Jong Jae LEE
发明人： So Young YOON , Joo Han LEE , Jong Jae LEE
IPC分类号： B24B53/12 , B24D18/00 , B24D3/00
CPC分类号： B24B53/017 , B24B53/12 , B24D2203/00
摘要： This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.
摘要翻译：本发明涉及一种用于化学机械平面化焊盘的调节器，其是为了提高半导体器件的集成度而对于晶片的全局平面化所必需的，更具体地涉及具有能够降低与衬垫，以解决在调节时产生的大量摩擦所引起的问题，以及其制造方法。

4. 发明授权

US06357188B1 Connector for connecting cable-protecting pipe 有权
标题翻译：连接电缆保护管的连接器
公开(公告)号：US06357188B1
公开(公告)日：2002-03-19
申请号：US09602750
申请日：2000-06-23
申请人： Hyang Jae Lee , Kum Ok Hyun , Chung Ho Jeon , Joo Han Lee
发明人： Hyang Jae Lee , Kum Ok Hyun , Chung Ho Jeon , Joo Han Lee
IPC分类号： E04C252
CPC分类号： E02D29/125 , E02D29/12 , E04G15/061 , H02G9/06
摘要： According to the present invention, there is provided a connector laid within a manhole wall for connecting cable-protecting pipes, including a body formed with a passage which said pipes can be inserted into, and a fixing member and a coupling member formed on both ends of said body, respectively, to be coupled and fixed each other, wherein said fixing member includes a first fixing protrusion and a first fixing groove formed on an outer surface of said body, respectively, to be located at the same surface as an end surface of said body and a second fixing protrusion and a second fixing groove formed on the outer surface of said body, respectively, to be located apart from the end surface of said body by a thickness of said first fixing protrusion and said first fixing groove. The end of said body formed with said fixing member is provided with a cover for preventing extraneous substance from invading inside of said body. An inner surface of said body is formed with a fixing sill to be inclined outward so that said fixing sill should engage with a slope of an end of said pipe inclined inward.
摘要翻译：根据本发明，提供了一种用于连接电缆保护管的人孔壁内的连接器，包括形成有所述管可以插入的通道的主体和形成在两端的连接构件分别固定在所述本体上，其中所述固定件包括分别形成在所述主体的外表面上的第一固定突起和第一固定槽，所述第一固定突起和第一固定槽位于与端面相同的表面上以及分别形成在所述主体的外表面上的第二固定突起和第二固定槽，以便通过所述第一固定突起和所述第一固定槽的厚度与所述主体的端面分开。由所述固定构件形成的所述主体的端部设置有用于防止外来物质侵入所述主体内部的盖。所述主体的内表面形成有固定框架以向外倾斜，使得所述固定框架应与向内倾斜的所述管道的端部的斜面接合。

5. 发明授权

US09421668B2 CMP apparatus 有权
标题翻译： CMP装置
公开(公告)号：US09421668B2
公开(公告)日：2016-08-23
申请号：US14405116
申请日：2012-06-07
申请人： Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
发明人： Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
IPC分类号： B24B37/00 , B24B49/18 , B24B37/005 , B24B53/017
CPC分类号： B24B49/186 , B24B37/005 , B24B49/18 , B24B53/017
摘要： Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
摘要翻译：提供了一种化学机械抛光（CMP）装置，其包括摆动单元，该摆动单元以预定间隔安装在其上放置待调理的CMP垫的压板上，安装在摆动单元的上端的连接器在摆动单元的垂直方向上的端部，并且围绕摆放单元围绕CMP垫旋转，可旋转地安装在连接器的另一端上的旋转器，耦合到旋转体并在旋转时调节CMP垫的CMP垫调节器，以及安装在连接器上并检测振动以测量CMP垫调节器的振动加速度的振动计，从而基于振动加速度和CMP垫调节器的安装或使用状态来预测CMP垫的磨损率。

6. 发明授权

US09314901B2 CMP pad conditioner, and method for producing the CMP pad conditioner 有权
标题翻译： CMP垫调节剂及其制造方法
公开(公告)号：US09314901B2
公开(公告)日：2016-04-19
申请号：US14117936
申请日：2012-05-15
申请人： Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
发明人： Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
IPC分类号： B24B53/017 , B24B53/02 , B24D18/00
CPC分类号： B24B53/017 , B24D18/00
摘要： This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
摘要翻译：本发明涉及一种用于CMP（化学机械抛光）焊盘的调节器，其用于作为半导体器件的制造的一部分的CMP工艺中，更具体地，涉及一种CMP焊盘调节器，其中切割结构即使使用不同种类的浆料和调节剂的压力变化时，抛光垫的磨损变化也不是很大，而且制造方法也是如此。

7. 发明授权

US08765776B2 Antihypertensive pharmaceutical composition 有权
标题翻译：抗高血压药物组成
公开(公告)号：US08765776B2
公开(公告)日：2014-07-01
申请号：US13205545
申请日：2011-08-08
申请人： Seung Ho Kim , Ji Han Kim , Je Hak Kim , Kyung Wan Nam , Yong Ha Chi , Joo Han Lee , Soo Heui Paik , So Jeong Yi , Tae Eun Kim , Seo Hyun Yoon , Joo Youn Cho , Sang Goo Shin , In Jin Jang , Kyung Sang Yu
发明人： Seung Ho Kim , Ji Han Kim , Je Hak Kim , Kyung Wan Nam , Yong Ha Chi , Joo Han Lee , Soo Heui Paik , So Jeong Yi , Tae Eun Kim , Seo Hyun Yoon , Joo Youn Cho , Sang Goo Shin , In Jin Jang , Kyung Sang Yu
IPC分类号： A01N43/54 , A61K31/505 , A01N43/40 , A61K31/44 , C07D239/02 , C07D211/72 , C07D211/84 , C07D213/62 , C07D213/78
CPC分类号： A61K31/513 , A61K31/4422 , A61K2300/00
摘要： Provided is an antihypertensive pharmaceutical composition containing Fimasartan, a pharmaceutically acceptable salt thereof, a solvate thereof or a hydrate thereof as an angiotensin II receptor blocker, and Amlodipine, an isomer thereof, a pharmaceutically acceptable salt thereof, a solvate thereof or a hydrate thereof as a calcium channel blocker.
摘要翻译：本发明提供含有作为血管紧张素II受体阻断剂的Fimasartan，其药学上可接受的盐，其溶剂化物或其水合物，以及氨氯地平，其异构体，其药学上可接受的盐，其溶剂化物或其水合物作为抗高血压药物组合物，钙通道阻滞剂。

8. 发明申请

US20120264772A1 ANTIHYPERTENSIVE PHARMACEUTICAL COMPOSITION 有权
标题翻译：抗精神病药物组合物
公开(公告)号：US20120264772A1
公开(公告)日：2012-10-18
申请号：US13205545
申请日：2011-08-08
申请人： Seung Ho Kim , Ji Han Kim , Je Hak Kim , Kyung Wan Nam , Yong Ha Chi , Joo Han Lee , Soo Heui Paik , So Jeong Yi , Tae Eun Kim , Seo Hyun Yoon , Joo Youn Cho , Sang Goo Shin , In Jin Jang , Kyung Sang Yu
发明人： Seung Ho Kim , Ji Han Kim , Je Hak Kim , Kyung Wan Nam , Yong Ha Chi , Joo Han Lee , Soo Heui Paik , So Jeong Yi , Tae Eun Kim , Seo Hyun Yoon , Joo Youn Cho , Sang Goo Shin , In Jin Jang , Kyung Sang Yu
IPC分类号： A61K31/513 , A61P13/12 , A61P9/04 , A61P9/12 , A61P9/10
CPC分类号： A61K31/513 , A61K31/4422 , A61K2300/00
摘要： Provided is an antihypertensive pharmaceutical composition containing Fimasartan, a pharmaceutically acceptable salt thereof, a solvate thereof or a hydrate thereof as an angiotensin II receptor blocker, and Amlodipine, an isomer thereof, a pharmaceutically acceptable salt thereof, a solvate thereof or a hydrate thereof as a calcium channel blocker.
摘要翻译：本发明提供含有作为血管紧张素II受体阻断剂的Fimasartan，其药学上可接受的盐，其溶剂化物或其水合物，以及氨氯地平，其异构体，其药学上可接受的盐，其溶剂化物或其水合物作为抗高血压药物组合物，钙通道阻滞剂。

9. 发明授权

US10166653B2 CMP pad conditioner 有权
公开(公告)号：US10166653B2
公开(公告)日：2019-01-01
申请号：US14233489
申请日：2012-07-16
申请人： Seh Kwang Lee , Joo Han Lee
发明人： Seh Kwang Lee , Joo Han Lee
IPC分类号： B24B53/017 , B24B53/12
摘要： The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

10. 发明授权

US09451691B2 Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same 有权
标题翻译：阵列印刷电路板，其替代有缺陷的单一印刷电路板的方法，以及使用其制造电子设备的方法
公开(公告)号：US09451691B2
公开(公告)日：2016-09-20
申请号：US14458249
申请日：2014-08-12
申请人： Young-hoon Kim , Hyun-seok Choi , Joo-han Lee , Da-hye Choe
发明人： Young-hoon Kim , Hyun-seok Choi , Joo-han Lee , Da-hye Choe
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14 , H05K3/22 , H05K3/00
CPC分类号： H05K1/0268 , H05K1/0292 , H05K3/0052 , H05K3/0097 , H05K3/225
摘要： An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.
摘要翻译：提供阵列印刷电路板（PCB），其中可以容易地更换有缺陷的单个PCB。还提供了更换有缺陷的单个PCB的方法和制造电子设备的方法。阵列PCB可以包括多个单个PCB。轨道部分可以围绕单个PCB。多个翼片路线部分将单个PCB连接到轨道部分，每个翼片路线部分包括至少一对通孔电极。测试端子部分可以形成在轨道部分的一侧，并且可以包括多个测试端子。所述至少一对通孔电极可以包括邻近所述轨道部分设置并电连接到相应测试端子的第一通孔电极，以及邻近并电连接到相应的单个PCB布置的第二通孔电极。

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