专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08151446B2 Apparatus for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造装置
公开(公告)号：US08151446B2
公开(公告)日：2012-04-10
申请号：US12076223
申请日：2008-03-14
申请人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
发明人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
IPC分类号： B23P19/04
CPC分类号： H05K3/4647 , B29C43/28 , B29C43/46 , H05K3/4069 , H05K2203/0143 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/53126 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.
摘要翻译：用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

2. 发明申请

US20120034386A1 APPARATUS AND METHOD FOR COATING 审中-公开
标题翻译：装置和涂层方法
公开(公告)号：US20120034386A1
公开(公告)日：2012-02-09
申请号：US13196777
申请日：2011-08-02
申请人： Yoong Oh , Jong-Seok Bae
发明人： Yoong Oh , Jong-Seok Bae
IPC分类号： B05D3/12 , B05C11/04
CPC分类号： B05D1/28 , B05C1/08 , B05C11/044 , B05D1/42
摘要： An apparatus and a method for coating are disclosed. The coating apparatus of the present invention, which include: a transporting part configured to transport a substrate; a coating part configured to coat a coating material on the substrate; and a squeegee installed to remove an excessive coating material after the substrate passes through the coating part and being moveable along a transporting path of the substrate, can carry out the coating operation and the squeegeeing operation together, thereby reducing the lead time of the coating operation of the substrate and increasing the productivity. By integrating the conventional coating device and squeegeeing device, the space required for installation can be saved, and the quality of coating can be improved because conditions for coating can be adjusted.
摘要翻译：公开了一种涂布装置和方法。本发明的涂布装置，其特征在于，包括：输送部，其构造成输送基板; 被配置为涂覆所述基板上的涂层材料的涂层部分; 以及在基板通过涂布部分并且可沿着基板的传送路径移动之后安装用于去除过量涂层材料的刮板，可以一起执行涂布操作和刮涂操作，从而减少涂布操作的前置时间并提高生产率。通过集成传统的涂布装置和刮板装置，可以节省安装所需的空间，并且可以调节涂层的条件来改善涂层的质量。

3. 发明申请

US20090049683A1 Apparatus and method for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造装置及方法
公开(公告)号：US20090049683A1
公开(公告)日：2009-02-26
申请号：US12076223
申请日：2008-03-14
申请人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
发明人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
IPC分类号： H05K3/00 , B29C43/34 , H01L21/67
CPC分类号： H05K3/4647 , B29C43/28 , B29C43/46 , H05K3/4069 , H05K2203/0143 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/53126 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.
摘要翻译：公开了一种用于制造印刷电路板的装置和方法。用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

4. 发明申请

US20120043121A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120043121A1
公开(公告)日：2012-02-23
申请号：US13211795
申请日：2011-08-17
申请人： Jong Seok Bae
发明人： Jong Seok Bae
IPC分类号： H05K1/09 , H05K1/00 , H01B13/00 , H05K1/11 , C25D5/02 , C25D7/00
CPC分类号： H05K3/4069 , C25D5/02 , C25D5/10 , H05K1/113 , H05K3/108 , H05K3/4647
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one surface of the insulating layer; a second circuit layer including a second metal layer and a second plating layer provided on an outer side of the second metal layer and embedded in the other surface of the insulating layer; and a bump interconnecting the first circuit layer and the second circuit layer while penetrating through the insulating layer. The bump is used, such that there is no need to perform hole plating. Therefore, an increase in the surface plating thickness due to the hole plating is previously prevented.
摘要翻译：这里公开了一种印刷电路板及其制造方法。印刷电路板包括：绝缘层; 第一电路层，包括第一金属层和设置在第一金属层的外侧并嵌入在绝缘层的一个表面中的第一镀层; 第二电路层，包括设置在所述第二金属层的外侧并嵌入所述绝缘层的另一个表面中的第二金属层和第二镀层; 以及在穿透绝缘层的同时将第一电路层和第二电路层互连的凸块。使用凸块，使得不需要执行孔电镀。因此，预先防止由于镀孔而导致的表面电镀厚度的增加。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式