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    • 1. 发明授权
    • Conductive via hole and method for forming conductive via hole
    • 导电通孔和形成导电通孔的方法
    • US08927433B2
    • 2015-01-06
    • US12969469
    • 2010-12-15
    • Jin-Yeong Kang
    • Jin-Yeong Kang
    • H01L21/311H01L21/768H01L21/288H01L23/48
    • H01L21/76898H01L21/288H01L23/481H01L2924/0002H01L2924/00
    • Provided is a technology for forming a conductive via hole to implement a three dimensional stacked structure of an integrated circuit. A method for forming a conductive via hole according to an embodiment of the present invention comprises: filling inside of a via hole structure that is formed in one or more of an upper portion and a lower portion of a substrate with silver by using a reduction and precipitation of silver in order to connect a plurality of stacked substrates by a conductor; filling a portion that is not filled with silver inside of the via hole structure by flowing silver thereinto; and sublimating residual material of silver oxide series, which is generated during the flowing, on an upper layer inside of the via hole structure filled with silver.
    • 提供一种用于形成导电通孔以实现集成电路的三维堆叠结构的技术。 根据本发明的实施例的形成导电通孔的方法包括:通过使用还原将银填充在形成在基板的上部和下部的一个或多个中的通孔结构的内部,以及 为了通过导体连接多个堆叠的衬底,银的沉淀; 通过使银流入其中而填充通孔结构中未填充银的部分; 以及在流动过程中产生的氧化银系列的残留材料升华到填充有银的通孔结构的上层。
    • 2. 发明申请
    • CONDUCTIVE VIA HOLE AND METHOD FOR FORMING CONDUCTIVE VIA HOLE
    • 导电通孔和形成通孔的导电方法
    • US20110147938A1
    • 2011-06-23
    • US12969469
    • 2010-12-15
    • Jin-Yeong KANG
    • Jin-Yeong KANG
    • H01L23/532H01L21/768
    • H01L21/76898H01L21/288H01L23/481H01L2924/0002H01L2924/00
    • Provided is a technology for forming a conductive via hole to implement a three dimensional stacked structure of an integrated circuit. A method for forming a conductive via hole according to an embodiment of the present invention comprises: filling inside of a via hole structure that is formed in one or more of an upper portion and a lower portion of a substrate with silver by using a reduction and precipitation of silver in order to connect a plurality of stacked substrates by a conductor; filling a portion that is not filled with silver inside of the via hole structure by flowing silver thereinto; and sublimating residual material of silver oxide series, which is generated during the flowing, on an upper layer inside of the via hole structure filled with silver.
    • 提供一种用于形成导电通孔以实现集成电路的三维堆叠结构的技术。 根据本发明的实施例的形成导电通孔的方法包括:通过使用还原将银填充在形成在基板的上部和下部的一个或多个中的通孔结构的内部,以及 为了通过导体连接多个堆叠的衬底,银的沉淀; 通过使银流入其中而填充通孔结构中未填充银的部分; 以及在流动过程中产生的氧化银系列的残留材料升华到填充有银的通孔结构的上层。
    • 5. 发明申请
    • IMAGE SENSOR HAVING HETEROJUNCTION BIPOLAR TRANSISTOR AND METHOD OF FABRICATING THE SAME
    • 具有异相双极晶体管的图像传感器及其制造方法
    • US20080099806A1
    • 2008-05-01
    • US11872308
    • 2007-10-15
    • Jin Yeong KANGSang Heung LEEJin Gun KOO
    • Jin Yeong KANGSang Heung LEEJin Gun KOO
    • H01L27/146H01L21/00
    • H01L27/14689H01L27/14609H01L27/14681
    • Provided are image sensor having a heterojunction bipolar transistor (HBT) and a method of fabricating the same. The image sensor is fabricated by use of silicon-germanium bipolar junction transistor complementary metal oxide semiconductor (SiGe BiCMOS) technology. In the image sensor, a PD employs a floating-base-type SiGe HBT unlike a pn-junction-based CMOS image sensor (CIS). A floating base of the SiGe HBT produces a positive (+) voltage with respect to a collector during an exposure process, and the HBT performs a reverse bipolar operation due to the positive voltage so that the collector and an emitter exchange functions. In particular, since the SiGe HBT obtains a current gain ten times as high as that of a typical bipolar device even during the reverse operation, the SiGe HBT cannot only sense an optical (image) current signal but also amplify the optical current signal. Thus, the image sensor requires only three transistors in a pixel so that the degree of integration can increase. Also, the floating base of the HBT is a SiGe or SiGeC epitaxial layer with a very small thickness of 150 Å or less, and even heavily doped B ions are barely thermally diffused due to the properties of the SiGe or SiGeC layer. As a result, the sensitivity of signals can improve in the short wavelength region, thus easily balancing three colors. Furthermore, since the image sensor is a direct signal current amplification type mechanism and senses an optical signal current in a steady mode, a sensing signal has excellent linearity, and thus both a sensing mechanism and control circuit are very simple.
    • 提供了具有异质结双极晶体管(HBT)的图像传感器及其制造方法。 图像传感器通过使用硅 - 锗双极结型晶体管互补金属氧化物半导体(SiGe BiCMOS)技术制造。 在图像传感器中,PD采用基于pn结的CMOS图像传感器(CIS)的浮置型SiGe HBT。 SiGe HBT的浮动基极在曝光过程中产生相对于集电极的正(+)电压,并且HBT由于正电压而执行反向双极性操作,使得集电极和发射极交换功能起作用。 特别是,由于SiGe HBT即使在反向工作时也能获得比典型双极型器件高十倍的电流增益,所以SiGe HBT不仅可以检测光学(图像)电流信号,还可以放大光电流信号。 因此,图像传感器仅需要像素中的三个晶体管,使得集成度可以增加。 此外,HBT的浮动基底是具有150或更小厚度的非常小的SiGe或SiGeC外延层,并且由于SiGe或SiGeC层的性质,甚至重掺杂的B离子几乎没有热扩散。 结果,信号的灵敏度可以在短波长区域内改善,从而容易平衡三种颜色。 此外,由于图像传感器是直接信号电流放大型机构,并且在稳定模式下感测光信号电流,所以感测信号具有优异的线性度,因此感测机构和控制电路都非常简单。
    • 7. 发明授权
    • Phase locked loop with high-speed locking characteristic
    • 锁相环具有高速锁定特性
    • US06346861B2
    • 2002-02-12
    • US09733837
    • 2000-12-07
    • Young-Ho KimSang-Heung LeeHeung-Soo RheeJin-Yeong Kang
    • Young-Ho KimSang-Heung LeeHeung-Soo RheeJin-Yeong Kang
    • H03L7089
    • H03L7/107H03D13/004H03L7/0891H03L7/095H03L7/18
    • A phase locked loop (PLL) is use in a radio communication system such as a frequency mixer, a carrier frequency and the like. The phase locked loop (PLL) includes a phase/frequency detector for comparing a phase/frequency of a reference signal and a feedback signal. The phase/frequency detector includes: a NAND gate logic circuit for NANDing a first signal and a second signal to output a NANDed signal; a first latch unit for latching the NANDed signal and outputting the first signal in response to a reference frequency; and a second latch unit for latching the NANDed signal and outputting the second signal in response to a feedback frequency. The phase locked loop (PLL) further includes a filter controller for changing a bandwidth of a low pass filter in response to an output signal of the phase/frequency detector.
    • 锁相环(PLL)在诸如混频器,载波频率等的无线电通信系统中使用。 锁相环(PLL)包括用于比较参考信号的相位/频率和反馈信号的相位/频率检测器。 相位/频率检测器包括:与非门逻辑电路,用于对第一信号进行NAND和第二信号以输出NAND信号; 第一锁存单元,用于锁存所述NAND信号并响应于参考频率输出所述第一信号; 以及第二锁存单元,用于锁存所述NAND信号并响应于反馈频率输出所述第二信号。 锁相环(PLL)还包括滤波器控制器,用于响应于相位/频率检测器的输出信号来改变低通滤波器的带宽。
    • 10. 发明授权
    • High-quality CMOS image sensor and photo diode
    • 高质量CMOS图像传感器和光电二极管
    • US07741665B2
    • 2010-06-22
    • US11872922
    • 2007-10-16
    • Jin Yeong KangJin Gun KooSang Heung Lee
    • Jin Yeong KangJin Gun KooSang Heung Lee
    • H01L31/062H01L31/113
    • H01L27/14689H01L27/14609
    • Provided are a high-quality CMOS image sensor and a photo diode, which can be fabricated in sub-90 nm regime using nanoscale CMOS technology. The photo diode includes: a p-type well; an internal n-type region formed under a surface of the p-type well; and a surface p-type region including a highly doped p-type SiGeC epitaxial layer or a polysilicon layer deposited on a top surface of the p-type well over the internal n-type region. The image sensor includes: a photo diode including an internal n-type region and a surface p-type region; a transfer transistor for transmitting photo-charges generated in the photo diode to a floating diffusion node; and a driving transistor for amplifying a variation in an electric potential of the floating diffusion node due to the photo-charges. The image sensor further includes a floating metal layer for functioning as the floating diffusion node and applying an electric potential from a drain of the transfer transistor to a gate of the driving transistor.
    • 提供了一种高质量CMOS图像传感器和光电二极管,其可以使用纳米级CMOS技术在亚90nm范围内制造。 光电二极管包括:p型阱; 形成在p型阱的表面下的内部n型区域; 以及表面p型区域,其包括在内部n型区域上沉积在p型阱的顶表面上的高掺杂p型SiGeC外延层或多晶硅层。 图像传感器包括:包含内部n型区域和表面p型区域的光电二极管; 用于将在光电二极管中产生的光电荷传输到浮动扩散节点的传输晶体管; 以及用于放大由于光电荷引起的浮动扩散节点的电位变化的驱动晶体管。 图像传感器还包括浮动金属层,用作浮动扩散节点并将电势从传输晶体管的漏极施加到驱动晶体管的栅极。