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    • 1. 发明授权
    • High voltage distribution for a radiographic sensor device
    • 射线照相传感器装置的高电压分布
    • US06965110B2
    • 2005-11-15
    • US09985901
    • 2001-11-06
    • James F. CarubaFred E. MacciocchiGeorge W. DaileyJohn P. Valenta
    • James F. CarubaFred E. MacciocchiGeorge W. DaileyJohn P. Valenta
    • G01T1/20G01T1/24
    • G01T1/244
    • A high voltage distribution system and method for use with a cathode of a radiographic sensor device of a radiographic imaging apparatus are provided. The distribution system includes an insulated conductor formed on a first detector portion of the radiographic sensor device and communicating a high voltage to the cathode. The distribution system further includes an intermediate conduction portion communicating with the insulated conductor. The intermediate conduction portion includes a contact surface. The distribution system further includes a interconnect extending from a second portion of the radiographic sensor device. The separable interconnect communicates with an electrical voltage source and is positioned to come into contact with the intermediate conduction portion when the first detector portion of the radiographic sensor device is assembled to the second signal processing portion.
    • 提供了一种用于放射线照相成像装置的射线照相传感器装置的阴极的高压分配系统和方法。 分配系统包括形成在射线照相传感器装置的第一检测器部分上并将高电压传送到阴极的绝缘导体。 分配系统还包括与绝缘导体连通的中间导电部分。 中间传导部分包括接触表面。 分配系统还包括从射线照相传感器装置的第二部分延伸的互连。 可分离互连件与电压源通信,并且当放射线照相传感器装置的第一检测器部分组装到第二信号处理部分时被定位成与中间传导部分接触。
    • 2. 发明授权
    • Solid state gamma camera module and integrated thermal management method thereof
    • 固态伽马相机模块及其集成热管理方法
    • US06921904B2
    • 2005-07-26
    • US10131253
    • 2002-04-25
    • James F. CarubaGeorge W. Dailey
    • James F. CarubaGeorge W. Dailey
    • G01T1/24G01T1/29
    • G01T1/2928
    • A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like. Accordingly, heat generated by the integrated circuits is removed while heat flow to the temperature sensitive material is reduced.
    • 固态γ相机模块及其集成热管理方法包括具有第一热层和第二热层的印刷电路板。 第一热层热和/或电接合到第二热层。 具有温度敏感材料的半导体检测器模块与第二热层电连通。 每个具有底部金属层和引线接合的多个集成电路电连接到第一热层。 盖与第一热层电接合并覆盖多个集成电路。 第一热层通过与底部金属层(或第二热层)的直接接口从集成电路提取热量,第二热层从集成电路(IC)互连提取热量。 IC互连可以通过引线接合,管芯接合,直接焊接倒装芯片附接等。 因此,去除了对感温材料的热流的集成电路产生的热量。
    • 3. 发明授权
    • Heat sink for a radiographic sensor device
    • 散热片用于射线照相传感器装置
    • US06751098B2
    • 2004-06-15
    • US09986380
    • 2001-11-08
    • George W. DaileyJames F. Caruba
    • George W. DaileyJames F. Caruba
    • H05K720
    • H05K7/20445
    • A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.
    • 用于射线照相传感器装置的散热器系统和方法包括由具有预定导热性的第一材料形成的散热器。 散热器系统还包括由具有预定导热性的第二材料形成的热通道装置。 热通道装置包括适于接触射线照相传感器装置的至少一个接触部分和远离该至少一个接触部分并与散热器接触的延伸部件。 热通道装置被设计成当散热器系统组装时在散热器和射线照相传感器装置之间延伸并基本接触散热器。 热通道装置将热量从射线照相传感器装置传导到散热器。
    • 4. 发明授权
    • Embedded piezoelectric resonator
    • 嵌入式压电谐振器
    • US6093997A
    • 2000-07-25
    • US128124
    • 1998-08-03
    • Charles ZimnickiJames F. Caruba
    • Charles ZimnickiJames F. Caruba
    • H01L41/053H03H9/10H03H9/17H05K1/18H01L41/04
    • H03H9/1014H01L41/053H03H9/0533H03H9/0547H05K1/182
    • A piezoelectric resonator (12) is embedded within an electrically insulating substrate assembly (36), such as a multilayer printed circuit board. Electrical conductors (22,24) extend from electrodes of the resonator (12) through holes (32) in upper and lower layers (26,29) of the substrate assembly (36) and connect to electrical traces (34). The lower layer (29) has a pocket which forms a cavity (38) within the substrate assembly (36) adapted to contain the piezoelectric resonator (12). The conductors (22,24) support the resonator (12) such that the resonator (12) does not contact the assembly (36). As the resonator is substantially larger than associated electrical components, embedding it within a substrate eliminates the size penalty that is normally required to mount a large piezoelectric resonator.
    • 压电谐振器(12)嵌入电绝缘基板组件(36)内,例如多层印刷电路板。 电导体(22,24)从谐振器(12)的电极通过衬底组件(36)的上层和下层(26,29)中的孔(32)延伸并连接到电迹线(34)。 下层(29)具有在适于容纳压电谐振器(12)的衬底组件(36)内形成空腔(38)的口袋。 导体(22,24)支撑谐振器(12),使得谐振器(12)不接触组件(36)。 由于谐振器基本上大于相关联的电气部件,将其嵌入衬底中消除了安装大压电谐振器通常需要的尺寸损失。
    • 6. 发明授权
    • Piezoelectric resonator using sacrificial layer and method of tuning same
    • 使用牺牲层的压电谐振器及其调谐方法
    • US06249074B1
    • 2001-06-19
    • US08918616
    • 1997-08-22
    • Charles ZimnickiJames F. CarubaPiyush ChaudhariTheodore Lind
    • Charles ZimnickiJames F. CarubaPiyush ChaudhariTheodore Lind
    • H01L4108
    • H03H3/04H03H2003/0428
    • A piezoelectric resonator (10) having a sacrificial mass-loading layer (16). Material is removed from the mass-loading layer (16) to raise a resonator frequency to a desired target. The sacrificial layer (16) is of a dense material, such as silver or gold, but is of such a relative thin layer that it can be used on high frequency aluminum electrodes (14) of a resonator (10) without increasing adverse spurious frequency problems. It is not necessary that the mass-loading layer (16) be conductive. In addition, the silver or gold sacrificial layer (16) can be removed by ion milling at practical and economical rates, unlike aluminum or aluminum oxide. Preferably, a diffusion barrier (18) is interposed between the electrodes (14) and the mass-loading layer (16).
    • 一种具有牺牲质量加载层(16)的压电谐振器(10)。 将材料从质量加载层(16)移除,以将谐振器频率提高到期望的目标。 牺牲层(16)具有诸如银或金的致密材料,但是具有这样的相对薄的层,其可以在谐振器(10)的高频铝电极(14)上使用,而不增加不利的杂散频率 问题。 质量加载层(16)不必导电。 此外,与铝或氧化铝不同,银或金牺牲层(16)可以通过离子铣削以实际和经济的速率除去。 优选地,在电极(14)和质量加载层(16)之间插入扩散阻挡层(18)。
    • 7. 发明授权
    • Electrode edge wave patterns for piezoelectric resonator
    • 压电谐振器的电极边缘波形图
    • US5903087A
    • 1999-05-11
    • US920442
    • 1997-08-29
    • John E. MattsonJames F. CarubaCharles ZimnickiBeverly A. Carroll
    • John E. MattsonJames F. CarubaCharles ZimnickiBeverly A. Carroll
    • H01L41/09H03H9/13H03H9/19H01L41/08
    • H03H9/132
    • A resonator (104) including a piezoelectric plate (102) with an electrode (108) having a random pattern (100) along a portion of an edge of the electrode (108). The random pattern (100) dampens or destructively interferes with undesirable and inharmonic vibrational modes. For example, a rectangular AT-cut quartz resonator, which vibrates in a thickness-shear mode may also possess undesirable flexure and face-shear modes. These modes not only present undesirable spurious frequencies, they also change over temperature, disturbing a frequency-ternperature response of the resonator. The random pattern (100) causes diffuse and/or specular scattering to reduce these undesirable modes, providing a more uniform frequency-temperature response which is beneficial in temperature compensated crystal oscillator applications.
    • 一种谐振器(104),包括具有电极(108)的压电板(102),所述电极具有沿所述电极(108)的边缘部分的随机图案(100)。 随机图案(100)抑制或破坏性地干扰不期望的和不协调的振动模式。 例如,以厚度剪切模式振动的矩形AT切割石英谐振器也可能具有不期望的弯曲和面剪切模式。 这些模式不仅存在不期望的杂散频率,它们也随温度变化,从而扰乱谐振器的频率 - 温度响应。 随机图案(100)引起扩散和/或镜面散射以减少这些不期望的模式,提供更均匀的频率 - 温度响应,这在温度补偿晶体振荡器应用中是有益的。
    • 8. 发明授权
    • Temperature compensation circuit for a crystal oscillator and associated
circuitry
    • 晶体振荡器和相关电路的温度补偿电路
    • US5777524A
    • 1998-07-07
    • US901892
    • 1997-07-29
    • Carl E. WojewodaJames F. CarubaRichard N. Sutliff
    • Carl E. WojewodaJames F. CarubaRichard N. Sutliff
    • H03B5/36H03J7/12H03L1/02H04B1/40H03L5/00
    • H03J7/12H03B5/368H03L1/025H04B1/40H03L1/028
    • A temperature compensation circuit (10) for a crystal oscillator module (12) used in a communication device (200). An existing microcontroller (210) of the communication device (200) is used to provide temperature compensating digital data (30) for a crystal oscillator (18). The temperature compensating digital data (30) is converted to a temperature compensation signal (22) in a digital-to-analog converter (32) which controls the crystal oscillator frequency. The crystal oscillator module (12) includes an onboard voltage regulator (34) which supplies a characterized regulated voltage (36) to the digital-to-analog converter (32) such that the temperature compensation signal (22) from the digital-to-analog converter (32) is inherently corrected for voltage variations in the voltage regulator (34). Changes in the temperature compensation of the crystal oscillator (18) are allowed only when the communication device (200) is not transmitting or receiving.
    • 一种在通信设备(200)中使用的用于晶体振荡器模块(12)的温度补偿电路(10)。 通信设备(200)的现有微控制器(210)用于为晶体振荡器(18)提供温度补偿数字数据(30)。 温度补偿数字数据(30)被转换成控制晶体振荡器频率的数/模转换器(32)中的温度补偿信号(22)。 晶体振荡器模块(12)包括一个板载电压调节器(34),其向数模转换器(32)提供表征的调节电压(36),使得来自数模转换器(32)的温度补偿信号(22) 模拟转换器(32)固有地被校正为电压调节器(34)中的电压变化。 仅当通信装置(200)不发送或接收时,允许晶体振荡器(18)的温度补偿的变化。