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    • 3. 发明申请
    • Methods and systems to mitigate etch stop clipping for shallow trench isolation fabrication
    • 用于减轻浅沟槽隔离制造的蚀刻停止限幅的方法和系统
    • US20070134886A1
    • 2007-06-14
    • US11678107
    • 2007-02-23
    • Manuel Quevedo-LopezJames ChambersLeif Olsen
    • Manuel Quevedo-LopezJames ChambersLeif Olsen
    • H01L21/76
    • H01L29/7842H01L21/76224H01L21/823807H01L21/823878
    • The present invention facilitates semiconductor fabrication by maintaining shape and density of an etch stop layer (206) during trench fill operations. The shape and density of the etch stop layer (206) is maintained by forming a protective alloy liner layer (310) on the etch stop layer (206) prior to trench fill operations. The protective alloy liner (310) is comprised of an alloy that is resistant to materials employed in the trench fill operations. As a result, clipping and/or damage to the etch stop layer (206) is mitigated thereby facilitating a subsequent planarization process that employs the etch stop layer (206). Additionally, selection of thickness and composition (1706) of the formed protective alloy (310) yields a stress amount and type (1704) that is applied to channel regions of unformed transistor devices, ultimately providing for an improvement in channel mobility.
    • 本发明通过在沟槽填充操作期间保持蚀刻停止层(206)的形状和密度来促进半导体制造。 通过在沟槽填充操作之前在蚀刻停止层(206)上形成保护合金衬垫层(310)来保持蚀刻停止层(206)的形状和密度。 保护合金衬套(310)由对沟槽填充操作中使用的材料具有耐受性的合金构成。 结果,减轻了对蚀刻停止层(206)的削波和/或损伤,从而有利于采用蚀刻停止层(206)的随后的平坦化工艺。 此外,形成的保护合金(310)的厚度和组成(1706)的选择产生施加到未成形晶体管器件的沟道区域的应力量和类型(1704),最终提供了沟道迁移率的改善。
    • 5. 发明申请
    • Work function separation for fully silicided gates
    • 完全硅化栅的工作功能分离
    • US20070037333A1
    • 2007-02-15
    • US11203716
    • 2005-08-15
    • Luigi ColomboJames ChambersMark Visokay
    • Luigi ColomboJames ChambersMark Visokay
    • H01L21/8234
    • H01L21/823835H01L21/823842
    • Forming metal gate transistors that have different work functions is disclosed. In one example, a first metal is added to a first region of polysilicon overlying a dielectric that is on a substrate, and a second metal is added to a second region of the polysilicon. A third metal is formed over the first and second regions and a silicidation process if performed to form a first alloy in the first region and a second alloy in the second region. First and second segregated regions are also established adjacent to the dielectric in the first and second regions, respectively. The first and second metals serve to shift or adjust respective values of first and second work functions in the first and second regions.
    • 公开了具有不同功函数的金属栅极晶体管。 在一个示例中,将第一金属添加到覆盖在衬底上的电介质上的多晶硅的第一区域中,并且将第二金属添加到多晶硅的第二区域。 在第一和第二区域上形成第三金属,如果在第一区域中形成第一合金并且在第二区域中形成第二合金,则形成硅化工艺。 第一和第二分离区域也分别在第一和第二区域中的电介质附近建立。 第一和第二金属用于移动或调整第一和第二区域中的第一和第二功函数的相应值。
    • 9. 发明授权
    • Pyrimidine carboxamides useful as inhibitors of PDE4 isozymes
    • 可用作PDE4同功酶抑制剂的嘧啶甲酰胺
    • US06740655B2
    • 2004-05-25
    • US10181417
    • 2002-07-24
    • Thomas Victor MageeAnthony MarfatRobert James Chambers
    • Thomas Victor MageeAnthony MarfatRobert James Chambers
    • A61K3138
    • C07D239/34A61K45/06C07D405/12C07D405/14C07D409/12C07D409/14C07D417/14
    • This invention is directed to compounds of the formula: wherein j is 0 or 1; k is 0 or 1; m is 0 or 1; n is 0 or 1; W is —O—; —S(═O)t—, where t is 0, 1, or 2; or —N(R3)—; where R3 is —H, —(C1-C3) alkyl, —OR12, phenyl, or benzyl; RC and RD have the same meaning as RA and RB, except that at least one of RC and RD must be —H; and the other variables are defined as set forth in the specification. The invention is also directed to pharmaceutical compositions comprising the above compounds and to methods of treating a subject suffering from a disease, disorder or condition mediated by the PDE4 isozyme, the method comprising administering a therapeutically effective amount of a compound as described above. The invention is particularly directed to methods of treating inflammatory, respiratory and allergic diseases and conditions, especially asthma; chronic obstructive pulmonary disease (COPD) including chronic bronchitis, emphysema, and bronchiectasis; chronic rhinitis; and chronic sinusitis.
    • 本发明涉及下式的化合物:其中j是0或1; k为0或1; m为0或1; n为0或1; W是-O-; -S(= O)t-,其中t为0,1或2; 或-N(R 3) - ; 其中R 3是-H, - (C 1 -C 3)烷基,-OR 12,苯基或苄基; R C和R D具有与R A和R B相同的含义,除了R C和R D中的至少一个必须为-H; 并且其他变量被定义为说明书中阐述的。 本发明还涉及包含上述化合物的药物组合物和治疗患有由PDE4同功酶介导的疾病,病症或病况的受试者的方法,所述方法包括施用治疗有效量的如上所述的化合物。 本发明特别涉及治疗炎性,呼吸和过敏性疾病和病症,特别是哮喘的方法; 慢性阻塞性肺疾病(COPD),包括慢性支气管炎,肺气肿和支气管扩张; 慢性鼻炎 和慢性鼻窦炎。