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1. 外观设计

USD930770S1 Putter 有权
公开(公告)号：USD930770S1
公开(公告)日：2021-09-14
申请号：US29728321
申请日：2020-03-17
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho

2. 发明授权

US08405230B2 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof 有权
标题翻译：具有基本上不可折叠间隔物的半导体倒装芯片封装及其制造方法
公开(公告)号：US08405230B2
公开(公告)日：2013-03-26
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译：倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。此外，公开了制造包装的方法。

3. 发明授权

US07880313B2 Semiconductor flip chip package having substantially non-collapsible spacer 有权
标题翻译：具有基本上不可折叠间隔件的半导体倒装芯片封装
公开(公告)号：US07880313B2
公开(公告)日：2011-02-01
申请号：US11282293
申请日：2005-11-17
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译：倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。此外，公开了制造包装的方法。

4. 发明申请

US20100122842A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100122842A1
公开(公告)日：2010-05-20
申请号：US12428776
申请日：2009-04-23
申请人： Tae-Gui KIM , Young-Hwan Shin , Jae-Soo Lee , Tae-Gon Lee
发明人： Tae-Gui KIM , Young-Hwan Shin , Jae-Soo Lee , Tae-Gon Lee
IPC分类号： H01R12/06 , H05K3/00
CPC分类号： H05K3/0035 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H05K3/108 , H05K3/243 , H05K3/421 , H05K3/427 , H05K2201/0394 , H05K2201/09481 , H05K2201/09736 , H05K2203/0369 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board including a via, which is configured to electrically connect both sides of an insulator, and a pad part, which is formed in one side of the insulator to be directly in contact with the via, can include forming a seed layer part on one side of the insulator, a portion of the seed layer part being bulged, forming a via hole by processing the other side of the insulator, corresponding to the bulged portion of the seed layer part, forming the via inside the via hole, and forming a plating layer, corresponding to the pad part, on the seed layer part. With the present invention, it is possible to form a pattern having a finer pitch, maintaining a VOP structure and to prevent a lower side of a substrate from being penetrated through when a via hole is processed.
摘要翻译：公开了印刷电路板和印刷电路板的制造方法。制造包括通孔的印刷电路板的制造方法，该印刷电路板被配置为电连接绝缘体的两侧，并且形成在绝缘体的一个侧面中以与通孔直接接触的焊盘部分可以包括成形种子层部分在绝缘体的一侧上，种子层部分的一部分被凸出，通过处理绝缘体的另一侧形成通孔，对应于种子层部分的凸起部分，在该内部形成通孔并且在种子层部分上形成对应于焊盘部分的镀层。利用本发明，可以形成具有更细的间距的图案，保持VOP结构并且防止当加工通孔时衬底的下侧被穿透。

5. 发明授权

US07615851B2 Integrated circuit package system 有权
标题翻译：集成电路封装系统
公开(公告)号：US07615851B2
公开(公告)日：2009-11-10
申请号：US11307313
申请日：2006-01-31
申请人： Taesung Lee , Jae Soo Lee , Geun Sik Kim
发明人： Taesung Lee , Jae Soo Lee , Geun Sik Kim
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L2224/16 , H01L2924/01079 , H01L2924/1433
摘要： An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.
摘要翻译：一种集成电路封装系统，包括提供引线框架，该引线框架包括被配置为提供集成电路芯片和外部电源之间的电接触的引线。将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。将集成电路芯片电连接到下降的内部引线。沉积封装材料以防止下降的内部引线的暴露。

6. 发明授权

US07316023B2 Disc drive tray for holding discs of various shapes and sizes 有权
标题翻译：用于固定各种形状和尺寸的光盘的光盘驱动器托盘
公开(公告)号：US07316023B2
公开(公告)日：2008-01-01
申请号：US10812557
申请日：2004-03-30
申请人： Sang-Tae Kim , Jae-Soo Lee
发明人： Sang-Tae Kim , Jae-Soo Lee
IPC分类号： G11B33/02 , G11B17/04 , G11B17/03
CPC分类号： G11B17/0565
摘要： A disc drive such as an optical disc drive for securely holding discs of various sizes and shapes even in the vertical position. The disc drive includes a tray for holding a disc with a spindle motor installed thereon for rotating a turntable of the spindle motor. The disc is secured to the turntable for being rotated by the spindle motor. A fixing unit disposed by the turntable securely holds the disc to the turntable at locations of a perimeter of a clamping hole of the disc.
摘要翻译：诸如光盘驱动器的盘驱动器，即使在垂直位置也可以牢固地保持各种尺寸和形状的盘。盘驱动器包括用于保持其上安装有主轴电机的盘的盘，用于使主轴电动机的转台旋转。盘被固定到转台上，以便由主轴电机旋转。由转盘设置的固定单元在盘的夹紧孔的周边的位置处将盘牢固地保持在转台上。

7. 发明授权

US07220188B2 Golf glove for promoting swing accuracy 有权
标题翻译：高尔夫手套，以提高摆动精度
公开(公告)号：US07220188B2
公开(公告)日：2007-05-22
申请号：US11148099
申请日：2005-06-08
申请人： Jae Soo Lee
发明人： Jae Soo Lee
IPC分类号： A63B69/36
CPC分类号： A63B71/146 , A63B69/0059 , A63B69/3608 , A63B2209/10
摘要： A golf glove comprising outer and inner sections connected to each other by a thumb line and a little finger line to become worn from fingers to substantially above a wrist and toward a user's arm is disclosed. The outer section has a finger portion, a knuckle portion, a backhand portion, a wrist portion, and an arm portion. A support pad embedded along the arm portion, the wrist portion and the backhand portion includes a backhand shingle having a lower end, an arm shingle having a first edge, a second edge, and an upper end. The upper end of the arm shingle is pivotably engaged to the lower end of the backhand shingle so that the backhand shingle makes an angular rotation against the arm shingle. A first flex wing extends from the first edge to become perpendicular to the arm shingle and to approach the thumb line.
摘要翻译：公开了一种高尔夫手套，其包括通过拇指线相互连接的外部部分和内部部分，以及从手指到手腕的大致上方并朝向使用者的手臂的小指线。外部具有手指部分，转向节部分，反手部分，腕部部分和臂部分。沿着臂部嵌入的支撑垫，手腕部分和反手部分包括具有下端的反手木瓦，具有第一边缘，第二边缘和上端的臂板。臂板的上端可枢转地接合到反向木瓦的下端，使得反手木瓦对着臂板进行角度旋转。第一柔性翼从第一边缘延伸成垂直于臂木瓦并接近拇指线。

8. 发明授权

US5706147A Cassette loading device for tape recorder 失效
标题翻译：磁带录放机盒式装载装置
公开(公告)号：US5706147A
公开(公告)日：1998-01-06
申请号：US758002
申请日：1996-11-27
申请人： Jae-soo Lee
发明人： Jae-soo Lee
IPC分类号： G11B15/60 , G11B15/675 , G11B5/008
CPC分类号： G11B15/67549
摘要： A cassette loading device having a simple structure is provided to perform the operation of a motor and the opening of a tape shield of a video tape cassette. In the cassette loading device, an opener for opening the tape shield is interlocked with a slide member for interlocking a holder, and the opener opens and closes a light passing hole.
摘要翻译：提供具有简单结构的盒式磁带装载装置，以执行电动机的操作和磁带盒的磁带屏蔽的打开。在盒装载装置中，用于打开带屏蔽的开启器与用于联锁保持器的滑动构件互锁，并且开启器打开和关闭光通过孔。

9. 外观设计

USD1005427S1 Golf grip 有权
公开(公告)号：USD1005427S1
公开(公告)日：2023-11-21
申请号：US29892297
申请日：2023-05-16
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho
摘要： FIG. 1 is a perspective view of the golf grip;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a front view thereof;
FIG. 7 is a rear view thereof; and,
FIG. 8 is an enlarged break out view taken in circle 8 of FIG. 2.
The dash-dot dash broken line disclosed on FIG. 2 forms no part of the claimed design.
The broken lines in the drawings depict environmental subject matter of the golf grip only and form no part of the claimed design.

10. 外观设计

USD930771S1 Putter 有权
公开(公告)号：USD930771S1
公开(公告)日：2021-09-14
申请号：US29728322
申请日：2020-03-17
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho

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