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1. 外观设计

USD1005427S1 Golf grip 有权
公开(公告)号：USD1005427S1
公开(公告)日：2023-11-21
申请号：US29892297
申请日：2023-05-16
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho
摘要： FIG. 1 is a perspective view of the golf grip;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a front view thereof;
FIG. 7 is a rear view thereof; and,
FIG. 8 is an enlarged break out view taken in circle 8 of FIG. 2.
The dash-dot dash broken line disclosed on FIG. 2 forms no part of the claimed design.
The broken lines in the drawings depict environmental subject matter of the golf grip only and form no part of the claimed design.

2. 外观设计

USD930771S1 Putter 有权
公开(公告)号：USD930771S1
公开(公告)日：2021-09-14
申请号：US29728322
申请日：2020-03-17
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho

3. 发明授权

US11745076B1 Golf mat that induces a down blow impact zone swing 有权
公开(公告)号：US11745076B1
公开(公告)日：2023-09-05
申请号：US18108244
申请日：2023-02-10
申请人： Jae Soo Lee , Sarah Cho
发明人： Jae Soo Lee , Sarah Cho
IPC分类号： A63B69/36 , A63B71/06
CPC分类号： A63B69/3661 , A63B69/3667 , A63B2071/0694
摘要： A golf mat has a down-blow impact mat removably placed in a cutout formed in a base. The upper surface of the down-blow impact mat has a hitting section that slopes down gradually from the high point to a target point. The down-blow impact mat also has a lower portion having a sloping section and a flat section. The golf mat disclosed helps to improve the golfer's takeaway swing and the downswing so the golfer may practice his or her swing, including but not limited to, better mastering the elusive two-plane golf swing, with the guidance of the sloped hitting surface.

4. 发明申请

US20070108605A1 BUMP CHIP CARRIER SEMICONDUCTOR PACKAGE SYSTEM 有权
标题翻译： BUMP芯片载体半导体封装系统
公开(公告)号：US20070108605A1
公开(公告)日：2007-05-17
申请号：US11306806
申请日：2006-01-11
申请人： In Sang Yoon , Han Shin Youn , Jae Soo Lee
发明人： In Sang Yoon , Han Shin Youn , Jae Soo Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , H01L21/4832 , H01L21/568 , H01L21/6835 , H01L23/49541 , H01L24/81 , H01L2221/68345 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/16237 , H01L2224/81141 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/30105 , H01L2924/00 , H01L2224/05599
摘要： A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.
摘要翻译：提供了一种凸块芯片载体半导体封装系统，包括提供引线框架，在引线框架中形成电路插座，将半导体管芯安装在引线框架上，其中半导体管芯具有连接到电路插座的电互连，并封装成型复合以覆盖半导体管芯和电互连。

5. 外观设计

USD930769S1 Putter 有权
公开(公告)号：USD930769S1
公开(公告)日：2021-09-14
申请号：US29728318
申请日：2020-03-17
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho

6. 发明申请

US20090309198A1 INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
标题翻译：集成电路封装系统
公开(公告)号：US20090309198A1
公开(公告)日：2009-12-17
申请号：US12544578
申请日：2009-08-20
申请人： Taesung Lee , Jae Soo Lee , Geun Sik Kim
发明人： Taesung Lee , Jae Soo Lee , Geun Sik Kim
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L2224/16 , H01L2924/01079 , H01L2924/1433
摘要： An integrated circuit package system includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.
摘要翻译：集成电路封装系统包括引线框架，其引线被配置为提供集成电路芯片和外部电源之间的电接触。将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。将集成电路芯片电连接到下降的内部引线。沉积封装材料以防止下降的内部引线的暴露。

7. 发明申请

US20080283530A1 Medicine Container 审中-公开
标题翻译：医药容器
公开(公告)号：US20080283530A1
公开(公告)日：2008-11-20
申请号：US11918384
申请日：2005-10-26
申请人： Jae Soo Lee
发明人： Jae Soo Lee
IPC分类号： B65D25/26 , B65D43/02
CPC分类号： A61F9/0008
摘要： A disposable medicine container for containing a medicine, particularly a viscous artificial tear. The disposable medicine container includes a main body (5), and a lid (4) connected to the main body (5) for sealing the main body (5), wherein a space portion (6) is formed in a bottom portion of the lid (4) so that the lid (4) can repeatedly open and close an opening (8) of the main body (5) even after the lid (4) is separated from the main body (5). The medicine container is contained in an airtight state in a portable case including an upper body (11) provided with protrusions (14) and a lower body (12) provided with grooves (15). The disposable medicine container contains a medicine, which is used several times over a short period of time, and allows the medicine to be repeatedly reused, thus being economical.
摘要翻译：一种用于容纳药物，特别是粘性人造泪液的一次性药物容器。一次性医药容器包括主体（5）和连接到主体（5）的用于密封主体（5）的盖（4），其中，空间部分（6）形成在主体（4），使得即使在盖（4）与主体（5）分离之后，盖（4）也可以重复地打开和关闭主体（5）的开口（8）。药盒在包括具有突起（14）的上体（11）和设置有凹槽（15）的下体（12）的便携式外壳中的气密状态下容纳。一次性药物容器含有在短时间内多次使用的药物，能够重复使用药物，因此是经济的。

8. 外观设计

USD930770S1 Putter 有权
公开(公告)号：USD930770S1
公开(公告)日：2021-09-14
申请号：US29728321
申请日：2020-03-17
申请人： Jae Soo Lee , Sarah Cho
设计人： Jae Soo Lee , Sarah Cho

9. 发明授权

US08405230B2 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof 有权
标题翻译：具有基本上不可折叠间隔物的半导体倒装芯片封装及其制造方法
公开(公告)号：US08405230B2
公开(公告)日：2013-03-26
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译：倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。此外，公开了制造包装的方法。

10. 发明授权

US07880313B2 Semiconductor flip chip package having substantially non-collapsible spacer 有权
标题翻译：具有基本上不可折叠间隔件的半导体倒装芯片封装
公开(公告)号：US07880313B2
公开(公告)日：2011-02-01
申请号：US11282293
申请日：2005-11-17
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译：倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。此外，公开了制造包装的方法。

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