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1. 发明申请

US20170317062A1 METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20170317062A1
公开(公告)日：2017-11-02
申请号：US15423611
申请日：2017-02-03
申请人： HONGBIN SHI , JUNHO LEE
发明人： HONGBIN SHI , JUNHO LEE
IPC分类号： H01L25/10 , H01L23/00 , H01L25/00
CPC分类号： H01L25/105 , H01L24/81 , H01L25/50 , H01L2224/81143 , H01L2224/81815 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082
摘要： A method of fabricating a semiconductor package includes providing a lower semiconductor package including a lower package substrate, and a lower dummy ball and a lower solder ball on a top surface of the lower package substrate, providing an upper semiconductor package including an upper package substrate, and an upper dummy ball and an upper solder ball on a bottom surface of the upper package substrate, joining the upper dummy ball to the lower dummy ball at a first temperature to form a solder joint, and joining the upper solder ball to the lower solder ball at a second temperature to form a connection terminal.

2. 发明申请

US20170294413A1 STACK-TYPE SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：US20170294413A1
公开(公告)日：2017-10-12
申请号：US15418077
申请日：2017-01-27
申请人： HONGBIN SHI , JUNHO LEE
发明人： HONGBIN SHI , JUNHO LEE
IPC分类号： H01L25/065 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/3178 , H01L25/105 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L2924/181 , H01L2924/18161 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor package includes a lower package including a lower package substrate, a lower semiconductor chip disposed on the lower package substrate, and a lower mold layer disposed on the lower package substrate, and an upper package disposed on the lower package. The upper package includes an upper package substrate and an upper semiconductor chip disposed on the upper package substrate. The semiconductor package additionally includes connection terminals disposed between the lower and upper package substrates. The connection terminals comprise outermost connection terminals and inner connection terminals. The inner connection terminals are disposed between the lower semiconductor chip and outermost connection terminals. The semiconductor package further includes a first under-fill layer disposed between the lower package substrate and the upper package substrate. At least one of the outermost connection terminals is disposed outside of the lower mold layer.

3. 发明申请

US20120083230A1 SIGNAL ACQUISITION APPARATUS AND METHOD FOR DISTRIBUTED COMPRESSIVE SENSING AND JOINT SIGNAL RECOVERY 有权
标题翻译：用于分布式压缩感测和联合信号恢复的信号采集装置和方法
公开(公告)号：US20120083230A1
公开(公告)日：2012-04-05
申请号：US13250082
申请日：2011-09-30
申请人： Heung-No LEE , Junho LEE , Sangjun PARK
发明人： Heung-No LEE , Junho LEE , Sangjun PARK
IPC分类号： H04B1/06
CPC分类号： H04L25/03891 , H04J11/0046 , H04L1/06 , H04L2025/03426 , H04W52/0251 , H04W72/00 , H04W84/18 , Y02D70/00
摘要： Disclosed is a multiple sensor system including a plurality of different sensor devices to acquire respective signals sensed from a single signal source, and a signal acquisition apparatus to recover an original signal generated from the signal source. The signal acquisition apparatus recovers the original signal by applying joint recovery, based on characteristics and correlations between the respective sensor devices, to compressive sensing signals independently compressively sensed and transmitted from the respective sensor devices. At this time, a sensing matrix F prearranged with the respective sensor devices and channel information C between the original signal and each sensor device are used for joint recovery.
摘要翻译：公开了一种多传感器系统，包括多个不同的传感器装置，以获取从单个信号源感测的各个信号，以及信号采集装置，用于恢复从信号源产生的原始信号。信号采集装置通过基于相应传感器装置之间的特性和相关性，将压缩感测信号独立地压缩感测并从相应的传感器装置发送来应用联合恢复来恢复原始信号。此时，使用预先布置有各个传感器装置的感测矩阵F和原始信号与每个传感器装置之间的通道信息C用于联合恢复。

4. 发明申请

US20110152379A1 COMPOSITION FOR CONTROL OF AGING AND/OR EXTENSION OF LIFE, CONTAINING DAPSONE AS ACTIVE INGREDIENT 审中-公开
标题翻译：用于控制老化和/或延长生命的组合物，含有DAPSONE作为活性成分
公开(公告)号：US20110152379A1
公开(公告)日：2011-06-23
申请号：US12737553
申请日：2009-07-24
申请人： Sang Chul Park , Junho Lee , Sung Chun Cho , Moon Cheol Park , Yun Je Cho
发明人： Sang Chul Park , Junho Lee , Sung Chun Cho , Moon Cheol Park , Yun Je Cho
IPC分类号： A61K31/145 , A61K8/46 , A61P31/04 , A61P17/00 , A61Q19/08
CPC分类号： A61K31/63 , Y02A50/411
摘要： The present invention relates to a composition for controlling aging and/or extending lifespan. More specifically, the present invention relates to a composition containing dapsone as an effective component for controlling aging and/or extending lifespan, in which when applying the composition according to the present invention to an object, the effect of controlling aging or extending lifespan is excellent. Specifically, the treatment of dapsone (DDS) increases the lifespan of C. elegans not depending upon daf-16 and delays aging process, and reduces the activity of cytoplasmic dual oxidase 1 (Duox1) and mitochondria complex V protein. In addition, dapsone can maintain the low oxygen uptake rate in C. elegans thereby reducing ROS formation. In addition, ROS production by paraquat that is an inducing material of oxidative stress is reduced by treating dapsone and the sensitivity of paraquat is reduced. Moreover, it can be known that pyruvate kinase is a target material of dapsone through the structural prediction, molecular and biochemical analysis. In addition, there is an effect that the recovery of mitochondria function that is reduced and the decrease of NOX expression in a cell are obtained by dapsone in the human diploid fibroblast. From the comprehensive results, it can be known that dapsone has an excellent effect for extending lifespan in a cell level and object level.
摘要翻译：本发明涉及一种用于控制老化和/或延长寿命的组合物。更具体地，本发明涉及含有氨苯砜作为控制老化和/或延长寿命的有效成分的组合物，其中当将根据本发明的组合物施用于物体时，控制老化或延长寿命的效果是优异的。具体来说，氨苯砜（DDS）的治疗增加了不依赖于daf-16的线虫的寿命，延缓衰老过程，降低细胞质双氧化酶1（Duox1）和线粒体复合物V蛋白的活性。此外，氨苯砜可维持秀丽隐杆线虫的低氧摄取率，从而降低ROS的形成。另外，通过治疗氨苯砜来减少百草枯作为氧化应激诱导物质的ROS产生，百草枯的敏感性降低。此外，可以知道丙酮酸激酶是通过结构预测，分子和生物化学分析的氨苯砜的靶材料。另外，通过人二倍体成纤维细胞中的氨苯砜可以获得降低的线粒体功能的恢复和细胞中NOX表达的降低的作用。从综合结果可以看出，氨苯砜具有延长细胞水平和对象水平的寿命的极好效果。

5. 发明申请

US20170077074A1 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US20170077074A1
公开(公告)日：2017-03-16
申请号：US15240183
申请日：2016-08-18
申请人： Hongbin SHI , Soonbum KIM , Junho LEE
发明人： Hongbin SHI , Soonbum KIM , Junho LEE
IPC分类号： H01L25/10 , H01L25/00
CPC分类号： H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/48227 , H01L2225/1058 , H01L2225/1082 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012
摘要： A method for manufacturing a semiconductor package including providing a first semiconductor package including a first package substrate and a first solder ball, the first package substrate having a first surface and a second surface opposite to the first surface, the first solder ball on the first surface, providing a second semiconductor package including a second package substrate and a second solder ball, the second package substrate having a third surface and a fourth surface opposite to the third surface, the second solder ball on the third surface, forming a depression in the first solder ball, applying flux to the first solder ball to fill the depression, aligning the first semiconductor package and the second semiconductor package with each other such that the second solder ball is inserted into the depression, and performing a reflow process to combine the first solder ball with the second solder ball may be provided.
摘要翻译：一种制造半导体封装的方法，包括提供包括第一封装衬底和第一焊球的第一半导体封装，所述第一封装衬底具有第一表面和与所述第一表面相对的第二表面，所述第一焊球在所述第一表面上提供包括第二封装衬底和第二焊球的第二半导体封装，所述第二封装衬底具有与所述第三表面相对的第三表面和第四表面，所述第三焊盘在所述第三表面上形成第一焊盘焊球，将焊剂施加到第一焊球以填充凹陷，使第一半导体封装和第二半导体封装彼此对准，使得第二焊球插入凹陷中，并且执行回流工艺以组合第一焊料可以提供具有第二焊球的球。

6. 发明申请

US20070199206A1 Drying system for image forming machine 审中-公开
标题翻译：成像机干燥系统
公开(公告)号：US20070199206A1
公开(公告)日：2007-08-30
申请号：US11362299
申请日：2006-02-24
申请人： NamJeon Park , YunJoo Moon , DongMin Kim , JungMi Oh , ByungChul Kyun , SoonJae Moon , JunHo Lee
发明人： NamJeon Park , YunJoo Moon , DongMin Kim , JungMi Oh , ByungChul Kyun , SoonJae Moon , JunHo Lee
IPC分类号： F26B3/00 , F26B13/00 , F26B19/00
CPC分类号： B41J29/377 , B41J3/4078 , B41J11/001 , B41J11/002 , B41J15/04
摘要： There is provided a drying system for an image forming machine which has a plenum and nozzle to supply drying air to impinge upon a moving substrate, where the air impinges upon the substrate in substantially the same direction in which the substrate is moving, and where the air impinges upon the substrate immediately after a colorant has been deposited upon the substrate and before it touches another object.
摘要翻译：提供了一种用于图像形成机的干燥系统，其具有通风室和喷嘴，以供应干燥空气以冲击移动的基板，其中空气以基本相同的方向撞击到基板上，其中基板移动在着色剂沉积在基材上之后并且在其接触另一物体之前，空气立即撞击在基板上。

7. 发明申请

US20210280328A1 SYSTEM FOR SENSING UF6 GAS LEAK IN NUCLEAR FUEL MANUFACTURING PROCESS 有权
公开(公告)号：US20210280328A1
公开(公告)日：2021-09-09
申请号：US17132680
申请日：2020-12-23
申请人： Youngmoon Bae , Seungchul Yang , Dongyong Kwak , Byungkuk Lee , Hyunkwang Cho , Junho Lee
发明人： Youngmoon Bae , Seungchul Yang , Dongyong Kwak , Byungkuk Lee , Hyunkwang Cho , Junho Lee
IPC分类号： G21C17/00 , G01M3/38 , G01M3/20 , G21C21/00 , C01G43/06
摘要： A system for sensing a UF6 gas leak in a nuclear fuel manufacturing process is proposed. The system is configured to sense whether or not there is a UF6 gas leak by optically detecting UO2F2 in a solid state generated due to a reaction with outside air, and thus to allow prevention of damage to a detection apparatus by means of sensing in a non-contact manner whether or not there is a UF6 gas leak, and to realize extension of mechanical life and reduction of the maintenance and repair cost for the detection apparatus.

8. 发明授权

US09953964B2 Method for manufacturing semiconductor package 有权
公开(公告)号：US09953964B2
公开(公告)日：2018-04-24
申请号：US15240183
申请日：2016-08-18
申请人： Hongbin Shi , Soonbum Kim , Junho Lee
发明人： Hongbin Shi , Soonbum Kim , Junho Lee
IPC分类号： H01L21/00 , H01L25/10 , H01L25/00
CPC分类号： H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/48227 , H01L2225/1058 , H01L2225/1082 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012
摘要： A method for manufacturing a semiconductor package including providing a first semiconductor package including a first package substrate and a first solder ball, the first package substrate having a first surface and a second surface opposite to the first surface, the first solder ball on the first surface, providing a second semiconductor package including a second package substrate and a second solder ball, the second package substrate having a third surface and a fourth surface opposite to the third surface, the second solder ball on the third surface, forming a depression in the first solder ball, applying flux to the first solder ball to fill the depression, aligning the first semiconductor package and the second semiconductor package with each other such that the second solder ball is inserted into the depression, and performing a reflow process to combine the first solder ball with the second solder ball may be provided.

9. 发明申请

US20070201933A1 Feeding system for image forming machine 审中-公开
标题翻译：成像机送料系统
公开(公告)号：US20070201933A1
公开(公告)日：2007-08-30
申请号：US11362300
申请日：2006-02-24
申请人： NamJeon Park , YunJoo Moon , DongMin Kim , JungMi Oh , ByungChul Kyun , SoonJae Moon , JunHo Lee
发明人： NamJeon Park , YunJoo Moon , DongMin Kim , JungMi Oh , ByungChul Kyun , SoonJae Moon , JunHo Lee
IPC分类号： B41J15/00
CPC分类号： B41J29/02 , B41J3/4078 , B41J11/42 , B41J15/046
摘要： There is provided a feeding system for an image forming machine using a first feeder roll and a press roll that form a nip between them though which a substrate is passed, and a second feeder roll located after a printing zone, where the first and second feeder roll surfaces move at the same speed.
摘要翻译：提供了一种用于图像形成机的进给系统，所述进给系统使用第一进料辊和压辊，所述第一进料辊和压辊在它们之间形成通过基底的辊隙，以及位于印刷区之后的第二进料辊，其中第一和第二进料器滚动面以相同的速度移动。

10. 发明申请

US20200095133A1 Treatment Method and Treatment Apparatus for Uranium Hexaflouride Residue Within Cylinder, Using Gas Phase Reaction 审中-公开
公开(公告)号：US20200095133A1
公开(公告)日：2020-03-26
申请号：US16695979
申请日：2019-11-26
申请人： Youngmoon Bae , Yudon Moon , In-Kyu Hwang , Hyundong Shin , Seungchul Yang , Dongyong Kwak , Byungkook Lee , Hyunkwang Cho , Junho Lee
发明人： Youngmoon Bae , Yudon Moon , In-Kyu Hwang , Hyundong Shin , Seungchul Yang , Dongyong Kwak , Byungkook Lee , Hyunkwang Cho , Junho Lee
IPC分类号： C01G43/025 , C01G43/06 , G21C3/62
摘要： Embodiments of the disclosure relate to a treatment method and a treatment apparatus for a UF6 heel, using a gas phase reaction. A specific treatment method includes (1) vaporizing the UF6 heel, (2) manufacturing solid phase UO2F2 by using UF6 gas vaporized at step (1), (3) separating the solid phase UO2F2 and by-product gas from each other, and (4) separating hydrogen fluoride from the by-product gas. According to the disclosure, stabilization of a reconversion process and the quality of UO2 powder may be improved by manufacturing the solid phase UO2F2, which is an intermediate of the UO2 powder, through the UF6 heel treatment, and the high cost of radioactive waste disposal is reduced by minimizing the UF6 heel to be less than 0.5 kg.

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