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    • 6. 发明授权
    • Thermoelectric device and thermoelectric module
    • 热电装置和热电模块
    • US6043423A
    • 2000-03-28
    • US63357
    • 1998-04-21
    • Masafumi SatomuraIchiro YamasakiRyousuke Yamanaka
    • Masafumi SatomuraIchiro YamasakiRyousuke Yamanaka
    • H01L35/08H01L35/32H02N11/00H01L35/28
    • H01L35/32H01L35/08
    • On a top surface of a substrate, a first and a second electrode are formed. A p-type semiconductor film is formed over substantially the entire exposed area on the top surface of the substrate and over the first electrode. An n-type semiconductor film is also formed over substantially the entire surface, but does not cover the first electrode, the p-type semiconductor film and the second electrode. A junction surface between the p-type and n-type semiconductor films extends over substantially the entire substrate, thereby providing a thermoelectric device which can cool or heat a wide surface area. The inclusion of the junction surface between p-type and n-type films, which extends over substantially the entire surface of the substrate, provides a unit whose top surface serves as a heat-absorbing portion and whose bottom surface serves as a heat-releasing portion. Further, by laying a plurality of such units one over the other with insulating material between them, a cascade-type thermoelectric module is obtained.
    • 在基板的顶表面上形成第一和第二电极。 p型半导体膜形成在基板顶表面的基本上整个暴露区域上并且在第一电极上。 在大致整个表面上也形成n型半导体膜,但不覆盖第一电极,p型半导体膜和第二电极。 p型和n型半导体膜之间的接合面在基本上整个基板上延伸,从而提供可以冷却或加热宽表面积的热电装置。 在基片的整个表面上延伸的p型和n型膜之间的连接表面的包含提供了一个单元,其顶面用作吸热部分,其底面用作放热 一部分。 此外,通过在它们之间用绝缘材料将多个这样的单元彼此叠置,获得级联型热电模块。