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    • 1. 发明申请
    • METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    • 制造半导体器件的方法
    • US20120052648A1
    • 2012-03-01
    • US13221099
    • 2011-08-30
    • Hyung-Shin KwonHyung-Dong Kim
    • Hyung-Shin KwonHyung-Dong Kim
    • H01L21/02
    • H01L28/60H01L27/10814H01L27/10894H01L27/10897H01L28/90
    • A semiconductor device may include lower electrodes having different heights depending on positions on a substrate. Supporting layer pattern making a contact with the lower electrodes having a relatively large height is provided. The supporting layer pattern is provided between the lower electrodes for supporting the lower electrodes. A dielectric layer is provided on the lower electrodes and the supporting layer pattern. An upper electrode is formed on the dielectric layer and has a planar upper surface. An inter-metal dielectric layer is provided on the upper electrode. A metal contact penetrating through the inter-metal dielectric layer and making a contact with the upper electrode is formed. A bottom portion of the metal contact faces a portion under where the lower electrode having a relatively small height is formed. The device has a higher reliability.
    • 半导体器件可以包括取决于衬底上的位置的具有不同高度的下电极。 提供了与具有相对较大高度的下电极接触的支撑层图案。 支撑层图案设置在用于支撑下电极的下电极之间。 电介质层设置在下电极和支撑层图案上。 在电介质层上形成上电极,具有平坦的上表面。 在上电极上设置金属间介电层。 形成穿过金属间介电层并与上电极接触的金属接触。 金属接触件的底部部分形成在具有较小高度的下部电极下方的部分。 该设备具有较高的可靠性。
    • 8. 发明授权
    • Semiconductor memory device for enhancing bitline precharge time
    • 用于增强位线预充电时间的半导体存储器件
    • US06856563B2
    • 2005-02-15
    • US10659249
    • 2003-09-11
    • Hyung-Dong KimChi-Sung Oh
    • Hyung-Dong KimChi-Sung Oh
    • G11C11/4091G11C7/12G11C8/02G11C11/4094G11C7/00
    • G11C11/4094G11C7/12
    • A semiconductor memory device for enhancing bitline precharge time and method for accelerating precharge time in the device is provided which may reduce overall precharging time, in an effort to guarantee proper high speed operations in the semiconductor memory device. In the method, an equalization enable signal may be applied to an equalizer of the device to precharge a bitline pair connected a memory cell, isolation part and sense amplifier of the device. Isolation control signals, to be applied to one or more of the isolation parts, may be delayed by a given time, so that a time of applying the isolation control signals is after a time of applying the equalization enable signal to the equalizer.
    • 提供一种用于增强位线预充电时间的半导体存储器件和用于加速器件中的预充电时间的方法,其可以减少总体预充电时间,以努力保证半导体存储器件中的适当的高速操作。 在该方法中,均衡使能信号可以被施加到器件的均衡器,以对连接存储器单元,器件的隔离部分和读出放大器的位线对进行预充电。 要施加到一个或多个隔离部分的隔离控制信号可以被延迟给定时间,使得施加隔离控制信号的时间是在将均衡使能信号施加到均衡器的时间之后。
    • 9. 发明授权
    • Semiconductor memory device and voltage level control method thereof
    • US06535447B2
    • 2003-03-18
    • US10000178
    • 2001-11-30
    • Hyung-Dong KimKwang-Hyun Kim
    • Hyung-Dong KimKwang-Hyun Kim
    • G11C700
    • G05F3/242
    • The present invention discloses a semiconductor memory device and a voltage level control method thereof. The semiconductor memory device comprises multiple sub high voltage generators, multiple control circuits, a high voltage level detecting circuit, and a mode setting circuit. The multiple sub high voltage generators boost the high voltage level. The multiple control circuits control operations of each of the corresponding multiple sub high voltage generators responsive to each of corresponding high voltage detecting signals and to each of corresponding multiple control signals in the test mode. The high voltage level detecting circuit enabled by an active signal, detects the level drop of a high voltage and generates the high voltage detecting signal. The mode setting circuit sets the state of the multiple control signals responsive to the signals from the out side in the test mode. Performing the test by regulating the number of the multiple sub high voltage generators can prevent the semiconductor memory device from over kill. In addition, the test of the package state can be performed by enabling a few of the voltage generators than necessary for the full operation of the test mode.
    • 10. 发明授权
    • Semiconductor memory device having redundancy circuit capable of improving redundancy efficiency
    • 具有能够提高冗余效率的冗余电路的半导体存储器件
    • US06426902B1
    • 2002-07-30
    • US09657318
    • 2000-09-07
    • Hi-choon LeeSeung-hoon LeeHyung-dong Kim
    • Hi-choon LeeSeung-hoon LeeHyung-dong Kim
    • G11C700
    • G11C29/787G11C29/808
    • A redundancy circuit is used to repair a normal column containing a defective normal memory cell. The redundancy circuit comprises a redundancy column containing redundancy memory cells and a plurality of programmable decoders. When any one of the plurality of programmable decoders enters a repair mode, a column pre-decoder for selecting a column containing a normal memory cell is disabled. Each of the programmable decoders can be configured to replace a column containing a defective normal memory cell in a single memory bank or a single memory bank group with a redundancy column. Since a defective column is replaced with a redundancy column in individual banks or bank groups, redundancy efficiency is greatly improved by allowing multiple normal columns containing defective cells to be replaced using a single redundancy column.
    • 冗余电路用于修复包含有缺陷的正常存储器单元的正常列。 冗余电路包括冗余列,其包含冗余存储单元和多个可编程解码器。 当多个可编程解码器中的任何一个进入修复模式时,用于选择包含正常存储器单元的列的列预解码器被禁用。 每个可编程解码器都可以被配置为用冗余列替换包含单个存储体或单个存储体组中的有缺陷的正常存储单元的列。 由于缺陷列被替换为单独存储体或存储体组中的冗余列,所以通过允许使用单个冗余列替换包含有缺陷单元的多个正常列,可大大提高冗余效率。