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1. 发明授权

US08710654B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08710654B2
公开(公告)日：2014-04-29
申请号：US13477387
申请日：2012-05-22
申请人： Satoshi Tsukiyama , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
发明人： Satoshi Tsukiyama , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译：在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。第一和第二半导体芯片通过第一凸块连接部电连接。止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。接合突起接合到第一和第二半导体芯片。

2. 发明授权

US08710653B2 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent 有权
标题翻译：片上半导体器件包括具有含有胺系固化剂的树脂的底层填充层
公开(公告)号：US08710653B2
公开(公告)日：2014-04-29
申请号：US13397098
申请日：2012-02-15
申请人： Masatoshi Fukuda , Hiroshi Watabe
发明人： Masatoshi Fukuda , Hiroshi Watabe
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1412 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81444 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.
摘要翻译：一种半导体器件，包括：布线基板，安装在布线基板上的层叠体，填充在层叠体的各半导体芯片之间的间隙中的底部填充层; 以及由在层叠体的外部被覆盖并形成的成型树脂等构成的成型体。底部填充层由含有胺类固化剂的树脂材料的固化物构成，固化物的Tg为65℃以上且100℃以下。

3. 发明申请

US20120001324A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120001324A1
公开(公告)日：2012-01-05
申请号：US13175247
申请日：2011-07-01
申请人： Hideo AOKI , Hideko Mukaida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Watabe
发明人： Hideo AOKI , Hideko Mukaida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Watabe
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L23/562 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/85375 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06572 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/0105 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T1 of the first semiconductor chip and a thickness T2 of the second semiconductor chip satisfy a relationship of T1/(T1+T2)≦0.6.
摘要翻译：在一个实施例中，半导体器件包括电路基板，以及安装在其上的第一和第二半导体芯片。第一半导体芯片和第二半导体芯片被倒装连接，并且在它们之间填充底部填充树脂。底部填充树脂具有圆角部分。第一半导体芯片的厚度T1和第二半导体芯片的厚度T2满足T1 /（T1 + T2）＆nlE; 0.6的关系。

4. 发明申请

US20060228956A1 Outboard motor 有权
标题翻译：舷外马达
公开(公告)号：US20060228956A1
公开(公告)日：2006-10-12
申请号：US11402116
申请日：2006-04-11
申请人： Hiroshi Watabe , Yoshio Ohtomo , Yoshihisa Hirose
发明人： Hiroshi Watabe , Yoshio Ohtomo , Yoshihisa Hirose
IPC分类号： B63H21/17
CPC分类号： B63H20/007
摘要： In an outboard motor adapted for mounting on a boat and equipped with an internal combustion engine, an electric motor, a battery for supplying voltage to the engine and electric motor, and a controller for controlling the operation of the electric motor, the controller is disposed near the battery. In other words, the controller is not installed on the outboard motor side where the engine and the like are present but on the boat side where the battery is installed. As a result, the effect of the vibration and heat of the engine on the controller is minimized so that the controller can utilize simpler structural features for vibration and heat resistance and is also advantageous in terms of cost.
摘要翻译：在适于安装在船上并配备有内燃机的电动马达，用于向发动机和电动机提供电压的电池以及用于控制电动机的操作的控制器的舷外马达中，设置控制器靠近电池。换句话说，控制器不安装在发动机等存在的舷外马达侧，而是安装在电池安装的船侧。结果，发动机的振动和热量对控制器的影响被最小化，使得控制器可以利用更简单的结构特征来实现振动和耐热性，并且在成本方面也是有利的。

5. 发明申请

US20060052015A1 Engine speed control system for outboard motor 失效
标题翻译：舷外马达发动机转速控制系统
公开(公告)号：US20060052015A1
公开(公告)日：2006-03-09
申请号：US11218452
申请日：2005-09-02
申请人： Taiichi Otobe , Hiroshi Watabe , Hideaki Takada
发明人： Taiichi Otobe , Hiroshi Watabe , Hideaki Takada
IPC分类号： B63H21/21 , B60W10/04
CPC分类号： F02D31/002 , B63H21/22 , F01P2050/12 , F02D31/009 , F02D41/0205
摘要： In an engine speed control system for an outboard motor, overrev prevention control is implemented which determines whether the engine overrevs by comparing the detected engine speed and a desired speed and responds to a determination that the engine overrevs (in which case the cause of the engine speed increase is probably reduced load caused by sucking in of air and/or exhaust gas by the propeller) by driving an electric throttle motor in the direction of reducing the throttle opening, thereby lowering the engine speed to the desired speed. Owing to this configuration, the problem of decline in thrust owing to intake of air and/or exhaust gas by the propeller can be quickly overcome irrespective of operator skill, thereby improving power performance and steerability.
摘要翻译：在用于舷外马达的发动机速度控制系统中，实现了过度防止控制，其通过比较检测到的发动机速度和期望速度来确定发动机是否超载，并且响应于发动机过度恢复的确定（在这种情况下是引擎的原因）通过在减小节气门开度的方向上驱动电动节气门马达，从而将发动机转速降低到期望的速度，速度的提高可能是通过由螺旋桨吸入空气和/或废气而引起的负载减少。由于这种构造，无论操作人员的技术如何，都可以快速克服由于螺旋桨的空气和/或废气的吸入引起的推力下降的问题，从而提高动力性能和操纵性。

6. 发明授权

US06899577B2 Outboard motor shift mechanism 失效
标题翻译：舷外马达换挡机构
公开(公告)号：US06899577B2
公开(公告)日：2005-05-31
申请号：US10797043
申请日：2004-03-11
申请人： Toyoshi Yasuda , Hiroshi Watabe , Hideaki Takada
发明人： Toyoshi Yasuda , Hiroshi Watabe , Hideaki Takada
IPC分类号： B63H23/30 , F02B61/04 , B60K41/00 , B63H21/21
CPC分类号： F02B61/045 , B63H23/30
摘要： In a shift mechanism for an outboard motor mounted on a stern of a boat and having an internal combustion engine and a propeller connected by a propeller shaft to the engine to propel the boat, a vertical shaft connected to the engine and transmitting an output of the engine to the propeller shaft is divided into two shaft halves and an electromagnetic clutch is provided to connect/disconnect the shaft halves. An electronic controller is provided to operate the electromagnetic clutch to disconnect the vertical shaft halves until one of the forward and reverse gears corresponding to the instruction to shift has been engaged with the propeller shaft, and then operate it to connect the shaft halves after the one of the forward gear and the reverse gear has been engaged with the propeller shaft. Alternatively, two electromagnetic clutches are provided to engage the forward or reverse gear with the propeller shaft, and the controller controls operation of the electromagnetic clutches in response to the instruction to shift such that corresponding one of the forward and reverse gears is engaged with the propeller shaft. With this, it becomes possible to decrease an impact occurring at the beginning of shift, thereby enabling to prevent the outboard motor from vibrating, while enabling to improve the operation feeling and facilitate maintenance, and to avoid a problem regarding space utilization.
摘要翻译：在安装在船尾上的舷外马达的变速机构中，具有内燃机和螺旋桨，由推进器轴连接到发动机以推进船，垂直轴与发动机连接并传递发动机到传动轴被分成两个轴半部，并且提供电磁离合器以连接/断开轴的两半。提供电子控制器以操作电磁离合器以断开垂直轴半部，直到对应于换档指令的前进和后退档中的一个已经与传动轴接合，然后在其之后操作以将轴半部连接前进齿轮和倒档齿轮已经与传动轴接合。或者，设置两个电磁离合器以将前进或后退齿轮与推进器轴接合，并且控制器响应于转向的指令控制电磁离合器的操作，使得前进和后退齿轮中的相应一个与螺旋桨接合轴。由此，能够减少在变速开始时的冲击，能够防止舷外马达振动，同时能够提高操作感觉，便于维护，避免空间利用的问题。

7. 发明申请

US20060009096A1 Outboard motor control system 有权
标题翻译：舷外马达控制系统
公开(公告)号：US20060009096A1
公开(公告)日：2006-01-12
申请号：US11174749
申请日：2005-07-05
申请人： Hideaki Takada , Hiroshi Watabe , Hiroshi Mizuguchi
发明人： Hideaki Takada , Hiroshi Watabe , Hiroshi Mizuguchi
IPC分类号： B63H21/22
CPC分类号： B63H21/213 , B63H20/007 , B63H20/14
摘要： In an outboard motor control system equipped with an electric throttle motor for moving the throttle valve of the engine mounted on the outboard motor, an electric shift motor for operating the shift mechanism to establish one from the in-gear, neutral and reverse shift positions, and a low-speed cruising switch for inputting the instruction to implement a low-speed cruising for causing the boat to cruise at a low speed, when the instruction is inputted, a throttle control is effected by controlling the operation of the motor to a set throttle opening and shift control is effected by controlling the operation of the motor to establish the in-gear position and neutral position alternatively, thereby enabling to cruise over a wide range of speeds including very slow, without requiring troublesome manual operations.
摘要翻译：在配备有用于移动安装在舷外马达上的发动机的节气门的电动节气门马达的舷外马达控制系统中，一个用于操作换挡机构以从齿轮，中间和倒档位置建立起动机构的电动换档马达，以及低速巡航开关，用于输入指令以实现用于使船在低速下巡航的低速巡航指令，当输入指令时，通过将电动机的操作控制为一组来实现节气门控制通过控制马达的操作来交替地建立齿轮位置和中立位置来实现节气门开启和换档控制，从而使得能够在包括非常慢的宽的速度范围内巡航，而不需要麻烦的手动操作。

8. 发明授权

US06926568B2 Outboard motor steering system 失效
标题翻译：舷外马达转向系统
公开(公告)号：US06926568B2
公开(公告)日：2005-08-09
申请号：US10732464
申请日：2003-12-11
申请人： Hiroshi Mizuguchi , Hideaki Takada , Hiroshi Watabe , Taiichi Otobe , Yoshinori Masubuchi
发明人： Hiroshi Mizuguchi , Hideaki Takada , Hiroshi Watabe , Taiichi Otobe , Yoshinori Masubuchi
IPC分类号： B63H20/12 , B63H5/125
CPC分类号： B63H20/12
摘要： An outboard motor steering system for an outboard motor mounted on a stern of a boat and having an internal combustion engine at its upper portion and a propeller with a rudder at its lower portion that is powered by the engine to propel and steer the boat, having a swivel shaft connected to the propeller to turn the propeller relative to the boat and housed in a swivel case, a hydraulic actuator such as a double-acting cylinder connected to the swivel shaft to rotate the swivel shaft, a hydraulic pressure supplier connected to the hydraulic actuator to supply hydraulic pressure, and a controller that controls supply of the hydraulic pressure to the hydraulic actuator in response to a steering signal inputted by an operator such that the outboard motor is steered relative to the boat. In the system, the hydraulic actuator and the hydraulic pressure supplier are housed in the swivel case. The system is thus simply configured to avoid increase in number of components and weight, and does not cause a problem regarding space utilization and operation efficiency, while improving steering feel.
摘要翻译：一种用于舷外马达的舷外马达转向系统，其安装在船尾上，在其上部具有内燃机，在其下部具有舵的推进器，该发动机由发动机提供动力以推动和转向船，具有旋转轴，连接到螺旋桨，以相对于船只旋转螺旋桨并容纳在旋转壳体中;液压致动器，例如连接到旋转轴的双作用气缸以旋转旋转轴;液压供应器，连接到旋转轴; 液压致动器以提供液压;以及控制器，其响应于由操作者输入的转向信号来控制对液压致动器的液压供应，使得舷外马达相对于船转向。在系统中，液压致动器和液压供应器容纳在旋转外壳中。因此，该系统被简单地配置为避免部件数量和重量的增加，并且在改善转向感的同时不会引起空间利用和操作效率的问题。

9. 发明授权

US6147758A Projection measuring instrument 有权
标题翻译：投影测量仪
公开(公告)号：US6147758A
公开(公告)日：2000-11-14
申请号：US490780
申请日：2000-01-24
申请人： Kenji Okabe , Hiroshi Watabe , Taizo Nakamura
发明人： Kenji Okabe , Hiroshi Watabe , Taizo Nakamura
IPC分类号： G01B9/08 , G01B11/24 , G01B11/30
CPC分类号： G01B11/2433 , G01B9/08
摘要： A projection measuring instrument requiring no exchange work of overlay chart for comparatively observing a workpiece image and a template is provided. For the object, a table (56) for a workpiece (55) to be put on, an observation optical system having a screen (1) and a projection lens (53) for projecting an image of the workpiece (55) onto the screen (1), a relative movement unit (57) for relatively moving the table (56) and the observation optical system, and a displacement sensor (61) for detecting relative movement displacement by the relative movement unit (57) are provided, the screen (1) being a liquid crystal display, the liquid crystal display having a display controller (2) for displaying a line drawing for measuring a profile of the workpiece (55) onto the liquid crystal display at a predetermined magnification.
摘要翻译：提供了一种不需要交换工作的投影测量仪器，用于比较观察工件图像和模板的重叠图。对于该目的，要放置的工件（55）的工作台（56），具有屏幕（1）的观察光学系统和用于将工件（55）的图像投影到屏幕上的投影透镜（53）（1），用于相对移动台（56）和观察光学系统的相对运动单元（57）和用于检测相对运动单元（57）的相对运动位移的位移传感器（61），屏幕（1）是液晶显示器，液晶显示器具有显示控制器（2），用于以预定的倍率显示用于将工件（55）的轮廓测量到轮廓上的线条图。

10. 发明申请

US20130134583A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130134583A1
公开(公告)日：2013-05-30
申请号：US13477387
申请日：2012-05-22
申请人： Satoshi TSUKIYAMA , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
发明人： Satoshi TSUKIYAMA , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译：在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。第一和第二半导体芯片通过第一凸块连接部电连接。止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。接合突起接合到第一和第二半导体芯片。

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