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1. 发明授权

US09303976B2 Substrate processing system and substrate processing program 有权
标题翻译：基板加工系统和基板加工程序
公开(公告)号：US09303976B2
公开(公告)日：2016-04-05
申请号：US13456458
申请日：2012-04-26
申请人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
发明人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
IPC分类号： G06F19/00 , G06F15/00 , G01B11/06 , G01N21/64 , G01N21/66
CPC分类号： G01B11/06 , G01N21/64 , G01N21/66 , G01N2021/6421 , H01L2933/0041
摘要： According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要翻译：根据一个实施例，基板处理系统包括测量单元，数据处理单元和处理单元。测量单元被配置为测量与衬底的厚度尺寸有关的信息。基板包括发光单元和波长转换单元。波长转换单元包括荧光体。数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息，并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。

2. 发明授权

US09099619B2 Semiconductor light emitting device and method for manufacturing the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US09099619B2
公开(公告)日：2015-08-04
申请号：US13419684
申请日：2012-03-14
申请人： Hiroshi Koizumi , Naoaki Sakurai , Yoshiaki Sugizaki , Yasuhide Okada , Tomomichi Naka , Masahiro Uekita , Akihiro Kojima , Yosuke Akimoto
发明人： Hiroshi Koizumi , Naoaki Sakurai , Yoshiaki Sugizaki , Yasuhide Okada , Tomomichi Naka , Masahiro Uekita , Akihiro Kojima , Yosuke Akimoto
IPC分类号： H01L29/20 , H01L21/00 , H01L33/50 , H01L33/00
CPC分类号： H01L33/508 , H01L33/0079 , H01L33/504 , H01L33/505 , H01L2933/0016 , H01L2933/0041
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.
摘要翻译：根据一个实施例，半导体发光器件包括发光部分和波长转换部分。发光部被配置为发光。波长转换部设置在发光部的一个主表面侧。波长转换部分包含磷光体。波长转换部分具有基于从发光部分发射的光的波长分布的荧光体的量的分布。

3. 发明授权

US08740535B2 Delivery position aligning method for use in vacuum processing apparatus, vacuum processing apparatus and computer storage medium 有权
标题翻译：用于真空处理装置，真空处理装置和计算机存储介质的输送位置对准方法
公开(公告)号：US08740535B2
公开(公告)日：2014-06-03
申请号：US13079356
申请日：2011-04-04
申请人： Keisuke Kondoh , Hiroshi Koizumi
发明人： Keisuke Kondoh , Hiroshi Koizumi
IPC分类号： H01L21/677
CPC分类号： H01L21/68 , H01L21/67196 , H01L21/67259
摘要： In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.
摘要翻译：在真空传送室中，布置有用于检测半导体晶片的位置的位置检测机构。设置在负载锁定室和真空处理室中的预定位置的半导体晶片通过真空传递机构传送到位置检测机构，并且检测晶片的位置。然后，基于检测结果，进行负载锁定室与真空处理室的对准。

4. 发明申请

US20130222782A1 SUBSTRATE HOLDING APPARATUS, PATTERN TRANSFER APPARATUS, AND PATTERN TRANSFER METHOD 有权
标题翻译：基板保持装置，图案转印装置和图案转印方法
公开(公告)号：US20130222782A1
公开(公告)日：2013-08-29
申请号：US13600123
申请日：2012-08-30
申请人： Kentaro KASA , Manabu Takakuwa , Ryoichi Inanami , Kazuto Matsuki , Tetsuro Nakasugi , Hiroshi Koizumi , Minoru Inomoto
发明人： Kentaro KASA , Manabu Takakuwa , Ryoichi Inanami , Kazuto Matsuki , Tetsuro Nakasugi , Hiroshi Koizumi , Minoru Inomoto
IPC分类号： G03B27/58
CPC分类号： G03F7/70783 , G03F7/707
摘要： According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on the major surface. Each of the first support units includes a suction-holding unit capable of holding a substrate by suction. The suction-holding unit is movable along a first direction perpendicular to the major surface and a second direction parallel to the major surface.
摘要翻译：根据一个实施例，一种基板保持装置包括主单元和多个第一支撑单元。主机具有主要表面。主机具有板配置。第一支撑单元设置在主表面上。每个第一支撑单元包括能够通过抽吸来保持基板的吸持保持单元。抽吸保持单元可沿垂直于主表面的第一方向和平行于主表面的第二方向移动。

5. 发明授权

US08399275B2 Method for manufacturing semiconductor light emitting device 有权
标题翻译：半导体发光元件的制造方法
公开(公告)号：US08399275B2
公开(公告)日：2013-03-19
申请号：US13153554
申请日：2011-06-06
申请人： Yosuke Akimoto , Akihiro Kojima , Miyuki Izuka , Yoshiaki Sugizaki , Hiroshi Koizumi , Tomomichi Naka , Yasuhide Okada
发明人： Yosuke Akimoto , Akihiro Kojima , Miyuki Izuka , Yoshiaki Sugizaki , Hiroshi Koizumi , Tomomichi Naka , Yasuhide Okada
IPC分类号： H01L21/00
CPC分类号： H01L33/508 , H01L25/0753 , H01L33/0079 , H01L33/486 , H01L33/502 , H01L33/58 , H01L2924/0002 , H01L2933/0041 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a method for manufacturing a semiconductor light emitting device is disclosed. The method can include forming a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, a second insulating layer, a transparent material and a phosphor layer. The transparent material is formed on the first major surface of a semiconductor layer selected from the plurality of semiconductor layers on the basis of an emission spectrum of a light obtained from the first major surface side. The transparent material transmits the light. The phosphor layer is formed on the transparent material and the first major surface of the plurality of the semiconductor layers.
摘要翻译：根据一个实施例，公开了一种制造半导体发光器件的方法。该方法可以包括形成第一互连层，第二互连层，第一金属柱，第二金属柱，第二绝缘层，透明材料和磷光体层。基于从第一主面侧获得的光的发射光谱，在从多个半导体层中选择的半导体层的第一主表面上形成透明材料。透明材料透光。荧光体层形成在透明材料和多个半导体层的第一主表面上。

6. 发明授权

US08368089B2 Semiconductor light emitting device 失效
标题翻译：半导体发光器件
公开(公告)号：US08368089B2
公开(公告)日：2013-02-05
申请号：US12885777
申请日：2010-09-20
申请人： Akihiro Kojima , Hiroshi Koizumi , Yoshiaki Sugizaki , Tomomichi Naka , Yasuhide Okada
发明人： Akihiro Kojima , Hiroshi Koizumi , Yoshiaki Sugizaki , Tomomichi Naka , Yasuhide Okada
IPC分类号： H01L29/18 , H01L33/00
CPC分类号： H01L33/50 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle.
摘要翻译：根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，透明层和荧光材料层。透明层设置在半导体层的第一主表面上。透明层相对于由发光层发射的光是透明的，并且具有设置在发光层的外周外的沟槽。荧光材料层设置在沟槽和透明层上。荧光材料层包括设置在沟槽中的第一荧光材料颗粒和设置在透明层上的第二荧光材料颗粒。第一荧光体粒子的粒径小于沟槽的宽度。第二荧光体粒子的粒径大于沟槽的宽度，大于第一荧光体粒子的粒径。

7. 发明申请

US20120277896A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING PROGRAM 有权
标题翻译：基板处理系统和基板处理程序
公开(公告)号：US20120277896A1
公开(公告)日：2012-11-01
申请号：US13456458
申请日：2012-04-26
申请人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
发明人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
IPC分类号： G06F19/00 , G06F15/00 , G01B11/06
CPC分类号： G01B11/06 , G01N21/64 , G01N21/66 , G01N2021/6421 , H01L2933/0041
摘要： According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要翻译：根据一个实施例，基板处理系统包括测量单元，数据处理单元和处理单元。测量单元被配置为测量与衬底的厚度尺寸有关的信息。基板包括发光单元和波长转换单元。波长转换单元包括荧光体。数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息，并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。

8. 发明授权

US08297743B2 Droplet ejection head and method of manufacturing coated body 有权
标题翻译：液滴喷头及制造涂层体的方法
公开(公告)号：US08297743B2
公开(公告)日：2012-10-30
申请号：US12873605
申请日：2010-09-01
申请人： Hiroshi Koizumi , Shizuo Kinoshita
发明人： Hiroshi Koizumi , Shizuo Kinoshita
IPC分类号： B41J2/045
CPC分类号： B41J2/055 , B41J2/14274
摘要： According to one embodiment, a droplet ejection head includes a liquid room, chambers, piezo elements, restrictors, movable pieces, and actuators. The liquid room stores a liquid. The chambers are supplied with the liquid from the liquid room and include nozzles for ejecting the supplied liquid in a droplet state. The piezo elements can be displaced in directions so as to change contents of the chambers. The restrictors bring the liquid room and the chambers in communication with each other. The movable pieces are movable in directions so as to change flow-path areas of the restrictors. The actuators move the movable pieces in the directions so as to change the plow-path areas of the restrictors.
摘要翻译：根据一个实施例，液滴喷射头包括液体室，室，压电元件，限流器，可动件和致动器。液体储存液体。这些室从液体室供应液体，并且包括用于以液滴状态喷射所提供的液体的喷嘴。压电元件可以在方向上移位，以便改变腔室的内容物。限流器使液体室和室彼此连通。活动件可沿方向移动，以便改变限流器的流路面积。致动器沿可移动的方向移动以便改变限制器的犁道区域。

9. 发明申请

US20120033181A1 FUNDUS OBSERVATION APPARATUS 有权
标题翻译：基金观察设备
公开(公告)号：US20120033181A1
公开(公告)日：2012-02-09
申请号：US13264117
申请日：2010-04-02
申请人： Hiroshi Koizumi , Koki Harumoto , Tsutomu Kikawa , Takefumi Hayashi
发明人： Hiroshi Koizumi , Koki Harumoto , Tsutomu Kikawa , Takefumi Hayashi
IPC分类号： A61B3/12 , A61B3/15
CPC分类号： A61B3/152 , A61B3/102 , A61B3/113 , A61B3/12 , A61B3/1225 , A61B3/14 , G06T7/73 , G06T2207/10101 , G06T2207/20068 , G06T2207/30041
摘要： The fundus observation apparatus 1 has a function to form tomographic images and 3-dimensional images of a fundus Ef by scanning signal light LS as well as a function to form a moving image (observation image K) of a fundus Ef during OCT measurement. Furthermore, the fundus observation apparatus 1 includes an x-correction part 231 and a y-correction part 232 for correcting a position in the fundus surface direction of the 3-dimensional image based on the observation image K, and a z-correction part 233 for correcting the position in the fundus depth direction of a 3-dimensional image, based on a tomographic image Gi of the fundus Ef based on the detection results of interference light LC of separately scanned signal light LS and reference light LR.
摘要翻译：眼底观察装置1具有通过扫描信号光LS形成截面图像和眼底Ef的3维图像以及在OCT测量期间形成眼底Ef的运动图像（观察图像K）的功能的功能。此外，眼底观察装置1包括基于观察图像K来校正三维图像的眼底表面方向的位置的x校正部231和y校正部232，以及z校正部233 基于分开扫描的信号光LS和参考光LR的干涉光LC的检测结果，基于眼底Ef的断层图像Gi来校正三维图像的眼底深度方向的位置。

10. 发明申请

US20110300644A1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：制造半导体发光器件的方法
公开(公告)号：US20110300644A1
公开(公告)日：2011-12-08
申请号：US13153554
申请日：2011-06-06
申请人： Yosuke Akimoto , Akihiro Kojima , Miyuki Izuka , Yoshiaki Sugizaki , Hiroshi Koizumi , Tomomichi Naka , Yasuhide Okada
发明人： Yosuke Akimoto , Akihiro Kojima , Miyuki Izuka , Yoshiaki Sugizaki , Hiroshi Koizumi , Tomomichi Naka , Yasuhide Okada
IPC分类号： H01L21/66
CPC分类号： H01L33/508 , H01L25/0753 , H01L33/0079 , H01L33/486 , H01L33/502 , H01L33/58 , H01L2924/0002 , H01L2933/0041 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a method for manufacturing a semiconductor light emitting device is disclosed. The method can include forming a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, a second insulating layer, a transparent material and a phosphor layer. The transparent material is formed on the first major surface of a semiconductor layer selected from the plurality of semiconductor layers on the basis of an emission spectrum of a light obtained from the first major surface side. The transparent material transmits the light. The phosphor layer is formed on the transparent material and the first major surface of the plurality of the semiconductor layers.
摘要翻译：根据一个实施例，公开了一种制造半导体发光器件的方法。该方法可以包括形成第一互连层，第二互连层，第一金属柱，第二金属柱，第二绝缘层，透明材料和磷光体层。基于从第一主面侧获得的光的发射光谱，在从多个半导体层中选择的半导体层的第一主表面上形成透明材料。透明材料透光。荧光体层形成在透明材料和多个半导体层的第一主表面上。

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