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1. 发明授权

US07955980B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07955980B2
公开(公告)日：2011-06-07
申请号：US12543128
申请日：2009-08-18
申请人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
发明人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
IPC分类号： H01L21/44
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

2. 发明申请

US20080160750A1 METHOD OF MANFACTURING SEMICONCUDTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20080160750A1
公开(公告)日：2008-07-03
申请号：US11953127
申请日：2007-12-10
申请人： Toshiyuki TAKEWAKI , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takahara Kunugi
发明人： Toshiyuki TAKEWAKI , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takahara Kunugi
IPC分类号： H01L21/302 , H01L21/44
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

3. 发明授权

US5177528A Aligning apparatus for substrate 失效
标题翻译：基板对准装置
公开(公告)号：US5177528A
公开(公告)日：1993-01-05
申请号：US887789
申请日：1992-05-26
申请人： Isao Koromegawa , Terumi Ogawa , Masashi Takagaki , Hironori Toyoshima
发明人： Isao Koromegawa , Terumi Ogawa , Masashi Takagaki , Hironori Toyoshima
IPC分类号： H05K13/04 , B23P21/00 , H01L21/00 , H05K13/08
CPC分类号： H01L21/67259 , H05K13/08
摘要： The present invention provides an aligning apparatus which is capable of aligning auxiliary connecting plates such as a testing fixture plate so as to fit to both sides of a substrate. A camera 13a monitors aligning marks provided on a substrate 6 and a first auxiliary connecting plate (i.e. a lower surface testing fixture plate) 8 to carry out an aligning operation by moving the substrate 6 by means of an XY.THETA. table 5. A first plate-fitting member (a vacuum suction member) 32 fixes the substrate 6 and the first auxiliary connecting plate 8. On the other hand, a camera 13b monitors aligning marks provided on the substrate 6 and a second auxiliary connecting plate (i.e. an upper surface testing fixture plate) 11 to carry out an aligning operation by moving the second auxiliary connecting plate 11 by means of the XY.THETA. table 5. A second plate-fitting member (a vacuum suction member) 33 fixes the substrate 6 and the second auxiliary connecting plate 11. Thus, the auxiliary connecting plates can be accurately aligned on both sides of the substrate through one table.
摘要翻译：本发明提供一种对准装置，其能够将诸如测试夹具板的辅助连接板对准以适合于基板的两侧。相机13a监视设置在基板6上的对准标记和第一辅助连接板（即，下表面测试固定板）8，以通过借助XY THETA表5移动基板6来执行对准操作。第一板固定构件（真空抽吸构件）32固定基板6和第一辅助连接板8.另一方面，相机13b监视设置在基板6上的对准标记和第二辅助连接板（即，上表面测试固定板）11通过XY THETA台5移动第二辅助连接板11进行对准操作。第二板件（真空抽吸构件）33将基板6和第二辅助连接板因此，可以通过一个工作台将辅助连接板精确对准在基板的两侧。

4. 发明授权

US08329584B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08329584B2
公开(公告)日：2012-12-11
申请号：US13151867
申请日：2011-06-02
申请人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
发明人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
IPC分类号： H01L21/44
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

5. 发明申请

US20090305496A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20090305496A1
公开(公告)日：2009-12-10
申请号：US12543128
申请日：2009-08-18
申请人： Toshiyuki TAKEWAKI , Manabu IGUCHI , Daisuke OSHIDA , Hironori TOYOSHIMA , Masayuki HIROI , Takuji ONUMA , Hiroaki NANBA , Ichiro HONMA , Mieko HASEGAWA , Yasuaki TSUCHIYA , Toshiji TAIJI , Takaharu KUNUGI
发明人： Toshiyuki TAKEWAKI , Manabu IGUCHI , Daisuke OSHIDA , Hironori TOYOSHIMA , Masayuki HIROI , Takuji ONUMA , Hiroaki NANBA , Ichiro HONMA , Mieko HASEGAWA , Yasuaki TSUCHIYA , Toshiji TAIJI , Takaharu KUNUGI
IPC分类号： H01L21/768
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

6. 发明申请

US20110230051A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20110230051A1
公开(公告)日：2011-09-22
申请号：US13151867
申请日：2011-06-02
申请人： Toshiyuki TAKEWAKI , Manabu IGUCHI , Daisuke OSHIDA , Hironori TOYOSHIMA , Masayuki HIROI , Takuji ONUMA , Hiroaki NANBA , Ichiro HONMA , Mieko HASEGAWA , Yasuaki TSUCHIYA , Toshiji TAIJI , Takaharu KUNUGI
发明人： Toshiyuki TAKEWAKI , Manabu IGUCHI , Daisuke OSHIDA , Hironori TOYOSHIMA , Masayuki HIROI , Takuji ONUMA , Hiroaki NANBA , Ichiro HONMA , Mieko HASEGAWA , Yasuaki TSUCHIYA , Toshiji TAIJI , Takaharu KUNUGI
IPC分类号： H01L21/306
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

7. 发明授权

US07601640B2 Method of manfacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07601640B2
公开(公告)日：2009-10-13
申请号：US11953127
申请日：2007-12-10
申请人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
发明人： Toshiyuki Takewaki , Manabu Iguchi , Daisuke Oshida , Hironori Toyoshima , Masayuki Hiroi , Takuji Onuma , Hiroaki Nanba , Ichiro Honma , Mieko Hasegawa , Yasuaki Tsuchiya , Toshiji Taiji , Takaharu Kunugi
IPC分类号： H01L21/44
CPC分类号： H01L21/02074 , H01L21/76883
摘要： A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
摘要翻译：如下进行铜层的CMP后清洗工序。依次使碱性水溶液，多元羧酸，BTA和碱性水溶液与设置有铜层的硅基板的主面接触。

8. 发明授权

US06991324B2 Solution injector head, functional layer forming apparatus and liquid crystal display 失效
公开(公告)号：US06991324B2
公开(公告)日：2006-01-31
申请号：US10386557
申请日：2003-03-13
申请人： Naoki Watase , Hironori Toyoshima , Tsuneyoshi Shimizu , Makoto Nakahara , Daisuke Ikesugi , Takatoshi Kira , Yoshihisa Ohta
发明人： Naoki Watase , Hironori Toyoshima , Tsuneyoshi Shimizu , Makoto Nakahara , Daisuke Ikesugi , Takatoshi Kira , Yoshihisa Ohta
IPC分类号： B41J2/045
CPC分类号： B41J2/1623 , B41J2/1612
摘要： In a solution emitting head for emitting a solution through an outlet, having a main body including a cavity, a cover attached to the main body in such a manner that the cover covers the cavity to form a chamber so that the solution is stored in the chamber temporarily before being emitted from the outlet, and a solution pressurizing device for pressurizing the solution in the chamber, the cover is fixedly attached to the main body by one of metal-to-metal bonding and an adhesive dissolution-resistant against the solution between the cover and the main body.

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