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1. 发明授权

US07504839B2 Flexible circuit with micro-sized probe tips and a method of making the same 有权
标题翻译：具有微型探头尖端的柔性电路及其制作方法
公开(公告)号：US07504839B2
公开(公告)日：2009-03-17
申请号：US10956318
申请日：2004-10-01
申请人： Haim Feigenbaum , Bao Q. Le , Long T. Hoang , Robert K. Betz
发明人： Haim Feigenbaum , Bao Q. Le , Long T. Hoang , Robert K. Betz
IPC分类号： G01R31/26
CPC分类号： H05K3/4092 , G01R1/06711 , G01R1/07342 , G01R3/00 , H05K1/0393 , H05K1/09 , H05K3/205 , H05K2201/0391
摘要： A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.
摘要翻译：柔性电路包括多个电迹线和直接形成于其上的多个探针尖。电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

2. 发明授权

US06614659B2 De-mountable, solderless in-line lead module package with interface 失效
标题翻译：可拆卸，无焊接在线引线模块封装带接口
公开(公告)号：US06614659B2
公开(公告)日：2003-09-02
申请号：US10013897
申请日：2001-12-07
申请人： Haim Feigenbaum , Blake F. Woith , John Szalay , Terry Wang
发明人： Haim Feigenbaum , Blake F. Woith , John Szalay , Terry Wang
IPC分类号： H05K720
CPC分类号： H05K7/1023 , H05K1/141 , H05K3/325 , H05K3/365
摘要： Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.
摘要翻译：用于将电气模块，IC或其他电子部件保持并固定到易于使用和操纵的PCB的装置。该装置利用过渡元件来保持电气模块或IC，然后使用紧固件等将其自身固定在PCB上。公开了组装和使用该装置的优选方法。

3. 发明授权

US6007669A Layer to layer interconnect 失效
标题翻译：层间互连
公开(公告)号：US6007669A
公开(公告)日：1999-12-28
申请号：US003651
申请日：1998-01-07
申请人： William R. Crumly , Haim Feigenbaum , Eric Dean Jensen , Pete Henry Hudson , John De Nuto
发明人： William R. Crumly , Haim Feigenbaum , Eric Dean Jensen , Pete Henry Hudson , John De Nuto
IPC分类号： H01L23/498 , H01L23/538 , H05K3/20 , H05K3/46 , H05K3/36
CPC分类号： H05K3/4617 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L2924/0002 , H05K2201/0195 , H05K2203/1189 , H05K3/205 , H05K3/4647 , Y10T29/49126 , Y10T29/49139
摘要： The present invention includes stack flexible circuit layers having raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. An intermediate or adhesive layer separates each circuit layer. The multiple layers are stacked with the raised features from one layer aligning with pads of an overlying or underlying layer and are laminated so that the raised features pierce the intermediate or adhesive layer and make electrical contact with the corresponding pad of the adjacent circuit layer. The raised features may have a shape sufficient to penetrate the intermediate and/or the adhesive layer allowing blind vias to be made without pre-drilling the intermediate or adhesive layers. The intermediate layer of film can have a function other than or in addition to that of an adhesive. For example, in a connector application where the raised feature is used to make contact to corresponding pads, a film that has a low permeability to water could be placed between the raised features and corresponding pads on the next layer. The low water permeability film would act as a sealant to prevent environmental attack on the connection. The raised feature would penetrate the sealant to make electrical contact to a corresponding pad. This would allow the connector to be disassembled and reconnected.
摘要翻译：本发明包括具有凸起特征或凸块的堆叠柔性电路层，用于与另一个电路层或电气部件的Z轴互连。中间层或粘合剂层分隔每个电路层。多个层层叠有来自与覆盖层或下层的衬垫对准的一层的凸起特征，并且层叠，使得凸起特征刺穿中间层或粘合剂层，并与相邻电路层的相应焊盘电接触。升高的特征可以具有足以穿透中间体和/或粘合剂层的形状，允许在不预先钻孔中间层或粘合剂层的情况下制造盲孔。膜的中间层可以具有除了粘合剂以外的功能或附加的功能。例如，在使用凸起特征与相应的焊盘接触的连接器应用中，具有低渗透性的膜可以放置在凸起的特征和下一层的相应焊盘之间。低透水性膜将用作密封剂，以防止连接处的环境破坏。凸起的特征将穿透密封剂以使电接触到相应的垫。这将允许连接器被拆卸并重新连接。

4. 发明授权

US5946555A Wafer level decal for minimal packaging of chips 失效
标题翻译：晶圆级贴花，最小包装芯片
公开(公告)号：US5946555A
公开(公告)日：1999-08-31
申请号：US743608
申请日：1996-11-04
申请人： William R. Crumly , Haim Feigenbaum
发明人： William R. Crumly , Haim Feigenbaum
IPC分类号： H01L23/31 , H01L23/485 , H01L23/498 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L23/3164 , H01L23/4985 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14
摘要： The invention includes the use of a decal to produce a packaged chip either at the chip level or wafer level. The decal includes a substrate containing circuitry that routes the chip output pads to bumps prepared for package attachment to another substrate such as a printed circuit board. The decal can be applied either to the wafer or to a single chip. The decal protects the chip and if necessary changes the interconnection density so that the chip can be interfaced with a printed circuit board or other electronic device. This configuration also may allow the packaged integrated circuit to be tested utilizing the bumps on the decal as temporary electrical contact features.
摘要翻译：本发明包括使用贴花来在芯片级或晶片级产生封装芯片。贴花包括一个包含基板的电路，其将芯片输出焊盘路由到准备用于封装附接到诸如印刷电路板的另一基板的凸块。贴花可以应用于晶片或单芯片。贴花保护芯片，并且如果需要，改变互连密度，使得芯片可以与印刷电路板或其他电子设备接口。该配置还可以允许使用贴花上的凸块来测试封装的集成电路作为临时电接触特征。

5. 发明授权

US4728533A Process for forming integral edge seals in porous gas distribution plates utilizing a vibratory means 失效
标题翻译：使用振动装置在多孔气体分配板中形成整体边缘密封的方法
公开(公告)号：US4728533A
公开(公告)日：1988-03-01
申请号：US430291
申请日：1982-09-30
申请人： Haim Feigenbaum , Sheldon Pudick
发明人： Haim Feigenbaum , Sheldon Pudick
IPC分类号： H01M8/02 , H01M2/08
CPC分类号： H01M8/0271
摘要： A process for forming an integral edge seal in a gas distribution plate for use in a fuel cell. A seal layer is formed along an edge of a porous gas distribution plate by impregnating the pores in the layer with a material adapted to provide a seal which is operative dry or when wetted by an electrolyte of a fuel cell. Vibratory energy is supplied to the sealing material during the step of impregnating the pores to provide a more uniform seal throughout the cross section of the plate.
摘要翻译：一种用于在用于燃料电池的气体分布板中形成整体边缘密封的方法。通过用适于提供干燥的或当被燃料电池的电解液润湿的密封材料浸渍该层中的孔时，沿着多孔气体分配板的边缘形成密封层。在浸渍孔隙的步骤期间将振动能量提供给密封材料，以在板的整个横截面上提供更均匀的密封。

6. 发明授权

US4463067A Fuel cell and system for supplying electrolyte thereto utilizing cascade feed 失效
标题翻译：燃料电池和使用级联进料供应电解质的系统
公开(公告)号：US4463067A
公开(公告)日：1984-07-31
申请号：US430145
申请日：1982-09-30
申请人： Haim Feigenbaum
发明人： Haim Feigenbaum
IPC分类号： H01M2/38 , H01M8/04 , H01M8/24
CPC分类号： H01M2/38 , H01M8/04283 , H01M8/2415
摘要： An electrolyte distribution supply system for use with a fuel cell having a wicking medium for drawing electrolyte therein is formed by a set of containers of electrolyte joined to respective fuel cells or groups thereof in a stack of such cells. The electrolyte is separately stored so as to provide for electrical isolation between electrolytes of the individual cells or groups of cells of the stack. Individual storage compartments are coupled by individual tubes, the ends of the respective tubes terminating on the wicking medium in each of the respective fuel cells. The individual compartments are filled with electrolyte by allowing the compartments to overflow such as in a cascading fashion thereby maintaining the requisite depth of electrolyte in each of the storage compartments. The individual compartments can also contain packed carbon fibers to provide a three stage electrolyte distribution system.
摘要翻译：一种与具有用于吸收电解液的芯吸介质的燃料电池一起使用的电解质分配供给系统是通过一组电解液形成的，该组电容器连接到这样的电池堆中的各个燃料电池或其组合。电解液分开存储，以提供单个电池的电解质或电池组的电池之间的电隔离。单独的储存室通过单独的管连接，各个管的端部终止于各个燃料电池中的芯吸介质上。通过允许隔室例如以级联方式使隔室溢出，从而将电解液的所需深度保持在每个储存隔间中，从而使单个隔间填充有电解质。单个隔室还可以包含填充碳纤维以提供三级电解质分配系统。

7. 发明申请

US20060071677A1 Flexible circuit with micro-sized probe tips and a method of making the same 有权
标题翻译：具有微型探头尖端的柔性电路及其制作方法
公开(公告)号：US20060071677A1
公开(公告)日：2006-04-06
申请号：US10956318
申请日：2004-10-01
申请人： Haim Feigenbaum , Bao Le , Long Hoang , Robert Betz
发明人： Haim Feigenbaum , Bao Le , Long Hoang , Robert Betz
IPC分类号： G01R31/02
CPC分类号： H05K3/4092 , G01R1/06711 , G01R1/07342 , G01R3/00 , H05K1/0393 , H05K1/09 , H05K3/205 , H05K2201/0391
摘要： A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second matieral is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.
摘要翻译：柔性电路包括多个电迹线和直接形成于其上的多个探针尖。电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

8. 发明授权

US06434817B1 Method for joining an integrated circuit 失效
标题翻译：用于连接集成电路的方法
公开(公告)号：US06434817B1
公开(公告)日：2002-08-20
申请号：US09454789
申请日：1999-12-03
申请人： Haim Feigenbaum , Chris M. Schreiber
发明人： Haim Feigenbaum , Chris M. Schreiber
IPC分类号： H05K334
CPC分类号： H01L24/10 , H01L21/563 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13 , H01L2224/13099 , H01L2224/73203 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H05K1/189 , H05K3/4007 , H05K2201/0347 , H05K2201/0367 , H05K2201/10674 , Y10T29/4913 , Y10T29/49144 , Y10T29/49156 , H01L2924/00 , H01L2924/00014
摘要： A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.
摘要翻译：一种用于将集成电路附接到柔性电路的方法，该柔性电路包括提供集成电路的动作，所述集成电路具有形成在其表面上的多个接触焊盘; 提供具有与表面积一体形成的多个接触凸块的柔性电路; 以及通过将所述柔性电路的至少一些所述接触凸块融合到所述集成电路的至少一些接触焊盘来将所述集成电路附接到所述柔性电路。接触凸点具有减小接触凸块附接到接触垫之后的接触凸块内的局部应力积累的形状，从而增强电连接的可靠性。

9. 发明授权

US6166333A Bumps with plural under-bump dielectric layers 失效
标题翻译：具有多个凸起下电介质层的凸起
公开(公告)号：US6166333A
公开(公告)日：2000-12-26
申请号：US6805
申请日：1998-01-14
申请人： William R. Crumly , Haim Feigenbaum
发明人： William R. Crumly , Haim Feigenbaum
IPC分类号： H01L21/48 , H01L21/60 , H01L23/13 , H01L23/14 , H01L23/15 , H01L23/498 , H05K3/00 , H05K3/20 , H05K3/40 , H05K1/03
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/49811 , H01L2224/05001 , H01L2224/05023 , H01L2224/05572 , H01L2224/16225 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/205 , H05K3/4007 , H05K3/4691 , H05K2201/0133 , H05K2201/015 , H05K2201/0154 , H05K2201/0187 , H05K2201/0367 , H05K2201/068 , H05K2203/0113 , Y10T29/49144 , Y10T29/49155 , H01L2224/05005 , H01L2224/05541 , H01L2224/05599 , H01L2224/05099
摘要： The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.
摘要翻译：本发明包括用于柔性和刚性电路板电路应用的复合支撑基板及其制造方法。复合衬底由在电路下形成的至少两种材料组成。第一种材料是常规的基质，例如聚酰亚胺/丙烯酸粘合剂，以及具有独特性质的第二种材料，其在局部在隔离的位置是有用的。例如，第二种材料可以是无孔的，透湿的和/或导热的。第二材料在特定的局部区域集成到电路矩阵中，其中期望的是与第一材料共面的部分，使得电路迹线在从第一材料通过到第二材料时保持连续。例如，集成电路芯片可以与聚酰亚胺基体隔离，该聚酰亚胺基体在湿气中是多孔的，通过使用在要连接集成电路芯片的位置处无孔的第二种材料，从而将集成电路芯片与聚酰亚胺并防止水分流入芯片。

10. 发明授权

US5896271A Integrated circuit with a chip on dot and a heat sink 失效
标题翻译：集成电路，带有点和散热片上的芯片
公开(公告)号：US5896271A
公开(公告)日：1999-04-20
申请号：US897584
申请日：1997-07-21
申请人： Eric Dean Jensen , William R. Crumly , Haim Feigenbaum , Chris M. Schreiber
发明人： Eric Dean Jensen , William R. Crumly , Haim Feigenbaum , Chris M. Schreiber
IPC分类号： H01L23/367 , H01L23/498 , H05K1/02 , H05K1/05 , H05K1/11 , H05K1/18 , H05K3/20 , H05K3/40 , H05K7/20
CPC分类号： H05K1/0206 , H01L23/3677 , H01L23/4985 , H01L24/17 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15787 , H05K1/056 , H05K1/112 , H05K1/189 , H05K2201/0367 , H05K2201/10636 , H05K2201/10674 , H05K3/205 , H05K3/4007 , H05K3/4084 , Y02P70/611
摘要： Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.
摘要翻译：公开了具有热接触的柔性基板，其提供从发热部件到散热器的连续高导热路径。在一个实施例中，热接触包括包括导热材料的凸起特征的金属迹线。可以使用焊球或圆角来在升高的特征和发热部件之间或在凸起的特征和下面的散热器之间或两者之间形成连接。

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