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1. 发明授权

US5378982A Test probe for panel having an overlying protective member adjacent panel contacts 失效
标题翻译：用于面板的测试探针具有相邻面板触点的上覆保护构件
公开(公告)号：US5378982A
公开(公告)日：1995-01-03
申请号：US23019
申请日：1993-02-25
申请人： Haim Feigenbaum , John S. Szalay , Blake F. Woith
发明人： Haim Feigenbaum , John S. Szalay , Blake F. Woith
IPC分类号： G01M11/00 , G01R1/073 , G02F1/13 , G09G3/00 , G01R1/04
CPC分类号： G09G3/006 , G01R1/0735
摘要： A test probe for use in testing a liquid crystal display device includes a rigid carrier block (20) having a lower surface to which is secured a flexible circuit (44) having a free end (50) aligned with the free end (26) of the carrier block. A plurality of projecting probe contact features (54) are integrally formed on traces (56) of the flexible circuit (44) and project from the plane of the flexible circuit adjacent the free end. An elastomeric back-up pad (40) is interposed between the carrier block (20) and the projecting contact features (54). The lower side of the carrier block is recessed (30) and the flexible circuit is pre-formed to the configuration of the recess in which it is mechanically secured by a rigid clamp or pressure bar (60). Conductive traces (56) of the flexible circuit have inner ends (58) bearing electrical contacts (68) for connection to test circuitry. The rigid carrier block (20) is mounted to enable the projecting probe contact features to be pressed against a line of contacts (16) on a display device panel (12) while maintaining a clearance between the aligned free ends of the carrier block (26), elastomer (42) and flexible circuit (50) and the edge (70) of a member (18) that overlies the display panel (12) and extends closely adjacent to and parallel to the row of display panel contacts (16).
摘要翻译：用于测试液晶显示装置的测试探针包括具有下表面的刚性载体块（20），固定有柔性电路（44），柔性电路（44）具有与自由端（26）对准的自由端（50）载体块。多个突出的探针接触特征（54）一体地形成在柔性电路（44）的迹线（56）上并且从邻近自由端的柔性电路的平面突出。弹性体支撑垫（40）插入在承载块（20）和突出接触特征（54）之间。承载块的下侧凹入（30），并且柔性电路预先形成为通过刚性夹具或压力杆（60）机械固定的凹部的构型。柔性电路的导电迹线（56）具有用于连接到测试电路的具有电触头（68）的内端（58）。安装刚性承载块（20）以使得突出的探针接触特征能够压靠在显示装置面板（12）上的一线触点（16）上，同时保持载体块（26）的对准的自由端之间的间隙），弹性体（42）和柔性电路（50）以及覆盖在显示面板（12）上并且与行显示面板触点（16）紧密相邻并平行延伸的构件（18）的边缘（70）。

2. 发明授权

US5307561A Method for making 3-D electrical circuitry 失效
标题翻译：制造三维电路的方法
公开(公告)号：US5307561A
公开(公告)日：1994-05-03
申请号：US991735
申请日：1992-11-27
申请人： Haim Feigenbaum , William R. Crumly , Christopher M. Schreiber
发明人： Haim Feigenbaum , William R. Crumly , Christopher M. Schreiber
IPC分类号： G01R1/073 , G01R31/02 , H01H1/14 , H01L21/66 , H01R12/00 , H05K1/11 , H05K3/20 , H05K3/32 , H05K3/36 , H05K3/40 , H05K3/02
CPC分类号： G01R1/073 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167 , H05K3/365 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56, 58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82, 84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.
摘要翻译：用于互连电路或用于集成电路测试探针的成形触点（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的整体部件进行电镀。成形的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12））或光致抗蚀剂。包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到该表面，以确保良好的接触而不需要擦拭动作。突出的触点也可以被压入诸如印刷电路板的基板中的电镀孔（82,84）中，以便进行可配对/可分离的电连接。

3. 发明授权

US5306546A Multi chip module substrate 失效
标题翻译：多芯片模块基板
公开(公告)号：US5306546A
公开(公告)日：1994-04-26
申请号：US994802
申请日：1992-12-22
申请人： Christopher M. Schreiber , Haim Feigenbaum , Harold C. Bowers
发明人： Christopher M. Schreiber , Haim Feigenbaum , Harold C. Bowers
IPC分类号： H01L21/48 , H01L23/538 , H05K3/20 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4617 , H01L21/4857 , H01L23/5383 , H05K3/4038 , H01L2224/16 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H05K2201/0394 , H05K2203/0113 , H05K2203/0338 , H05K2203/063 , H05K3/20 , H05K3/205 , H05K3/4647 , Y10T428/24917 , Y10T428/24926
摘要： A multi-level substrate (24) for mounting and interconnecting a number of integrated circuit chips (10) is formed of a stack of laminated sheets each comprising a conductive circuit layer (30,34,38,42,46) is laminated to a dielectric film (32,36,40,44,48). The sheets are formed by fully additive or semi-additive processes on a reusable mandrel and are interconnected to one another by raised features (78) on the circuit layer of one sheet that project through a hole (86) in the dielectric film of an adjacent sheet to contact a receiving area (88) of the circuit layer of the adjacent sheet. Integrated circuit chips (10) and other electrical components are mounted to the uppermost sheet and electrically connected thereto by means of wiring bonding (16) or a f lip-chip arrangement (150) in which chip pads (148) rest upon and contact raised features (146) of the circuit layer (140) of the uppermost sheet.
摘要翻译：用于安装和互连多个集成电路芯片（10）的多层基板（24）由层压片材堆叠形成，每个层压片材包括导电电路层（30,34,38,42,46）层压到电介质膜（32,36,40,44,48）。片材通过在可重复使用的心轴上的完全添加或半添加工艺形成，并且通过在相邻的电介质膜中的孔（86）突出的一片的电路层上的凸起特征（78）彼此互连。片材接触相邻片材的电路层的接收区域（88）。集成电路芯片（10）和其他电气部件安装到最上面的片材并且通过布线接合（16）或者其中芯片焊盘（148）搁置在其上并且接触凸起特征（140）的最上层片材（146）。

4. 发明授权

US4605602A Corrosion protected, multi-layer fuel cell interface 失效
标题翻译：腐蚀保护，多层燃料电池接口
公开(公告)号：US4605602A
公开(公告)日：1986-08-12
申请号：US644822
申请日：1984-08-27
申请人： Haim Feigenbaum , Sheldon Pudick , Chiu L. Wang
发明人： Haim Feigenbaum , Sheldon Pudick , Chiu L. Wang
IPC分类号： H01M8/02 , H01M8/24
CPC分类号： H01M8/2415 , H01M8/0297 , Y10T29/49108 , Y10T29/4911
摘要： An improved interface configuration for use between adjacent elements of a fuel cell stack. The interface is impervious to gas and liquid and provides resistance to corrosion by the electrolyte of the fuel cell. The multi-layer configuration for the interface comprises a non-cupreous metal-coated metallic element to which is film-bonded a conductive layer by hot pressing a resin therebetween. The multi-layer arrangement provides bridging electrical contact.
摘要翻译：用于在燃料电池堆的相邻元件之间使用的改进的接口配置。界面对气体和液体是不透水的，并且提供抵抗燃料电池的电解质的腐蚀。用于界面的多层结构包括非铜金属涂覆的金属元件，通过热压其间的树脂将导电层膜结合到其上。多层布置提供桥接电接触。

5. 发明申请

US20060071677A1 Flexible circuit with micro-sized probe tips and a method of making the same 有权
标题翻译：具有微型探头尖端的柔性电路及其制作方法
公开(公告)号：US20060071677A1
公开(公告)日：2006-04-06
申请号：US10956318
申请日：2004-10-01
申请人： Haim Feigenbaum , Bao Le , Long Hoang , Robert Betz
发明人： Haim Feigenbaum , Bao Le , Long Hoang , Robert Betz
IPC分类号： G01R31/02
CPC分类号： H05K3/4092 , G01R1/06711 , G01R1/07342 , G01R3/00 , H05K1/0393 , H05K1/09 , H05K3/205 , H05K2201/0391
摘要： A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second matieral is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.
摘要翻译：柔性电路包括多个电迹线和直接形成于其上的多个探针尖。电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

6. 发明授权

US06434817B1 Method for joining an integrated circuit 失效
标题翻译：用于连接集成电路的方法
公开(公告)号：US06434817B1
公开(公告)日：2002-08-20
申请号：US09454789
申请日：1999-12-03
申请人： Haim Feigenbaum , Chris M. Schreiber
发明人： Haim Feigenbaum , Chris M. Schreiber
IPC分类号： H05K334
CPC分类号： H01L24/10 , H01L21/563 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13 , H01L2224/13099 , H01L2224/73203 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H05K1/189 , H05K3/4007 , H05K2201/0347 , H05K2201/0367 , H05K2201/10674 , Y10T29/4913 , Y10T29/49144 , Y10T29/49156 , H01L2924/00 , H01L2924/00014
摘要： A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.
摘要翻译：一种用于将集成电路附接到柔性电路的方法，该柔性电路包括提供集成电路的动作，所述集成电路具有形成在其表面上的多个接触焊盘; 提供具有与表面积一体形成的多个接触凸块的柔性电路; 以及通过将所述柔性电路的至少一些所述接触凸块融合到所述集成电路的至少一些接触焊盘来将所述集成电路附接到所述柔性电路。接触凸点具有减小接触凸块附接到接触垫之后的接触凸块内的局部应力积累的形状，从而增强电连接的可靠性。

7. 发明授权

US6166333A Bumps with plural under-bump dielectric layers 失效
标题翻译：具有多个凸起下电介质层的凸起
公开(公告)号：US6166333A
公开(公告)日：2000-12-26
申请号：US6805
申请日：1998-01-14
申请人： William R. Crumly , Haim Feigenbaum
发明人： William R. Crumly , Haim Feigenbaum
IPC分类号： H01L21/48 , H01L21/60 , H01L23/13 , H01L23/14 , H01L23/15 , H01L23/498 , H05K3/00 , H05K3/20 , H05K3/40 , H05K1/03
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/49811 , H01L2224/05001 , H01L2224/05023 , H01L2224/05572 , H01L2224/16225 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/205 , H05K3/4007 , H05K3/4691 , H05K2201/0133 , H05K2201/015 , H05K2201/0154 , H05K2201/0187 , H05K2201/0367 , H05K2201/068 , H05K2203/0113 , Y10T29/49144 , Y10T29/49155 , H01L2224/05005 , H01L2224/05541 , H01L2224/05599 , H01L2224/05099
摘要： The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.
摘要翻译：本发明包括用于柔性和刚性电路板电路应用的复合支撑基板及其制造方法。复合衬底由在电路下形成的至少两种材料组成。第一种材料是常规的基质，例如聚酰亚胺/丙烯酸粘合剂，以及具有独特性质的第二种材料，其在局部在隔离的位置是有用的。例如，第二种材料可以是无孔的，透湿的和/或导热的。第二材料在特定的局部区域集成到电路矩阵中，其中期望的是与第一材料共面的部分，使得电路迹线在从第一材料通过到第二材料时保持连续。例如，集成电路芯片可以与聚酰亚胺基体隔离，该聚酰亚胺基体在湿气中是多孔的，通过使用在要连接集成电路芯片的位置处无孔的第二种材料，从而将集成电路芯片与聚酰亚胺并防止水分流入芯片。

8. 发明授权

US5896271A Integrated circuit with a chip on dot and a heat sink 失效
标题翻译：集成电路，带有点和散热片上的芯片
公开(公告)号：US5896271A
公开(公告)日：1999-04-20
申请号：US897584
申请日：1997-07-21
申请人： Eric Dean Jensen , William R. Crumly , Haim Feigenbaum , Chris M. Schreiber
发明人： Eric Dean Jensen , William R. Crumly , Haim Feigenbaum , Chris M. Schreiber
IPC分类号： H01L23/367 , H01L23/498 , H05K1/02 , H05K1/05 , H05K1/11 , H05K1/18 , H05K3/20 , H05K3/40 , H05K7/20
CPC分类号： H05K1/0206 , H01L23/3677 , H01L23/4985 , H01L24/17 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15787 , H05K1/056 , H05K1/112 , H05K1/189 , H05K2201/0367 , H05K2201/10636 , H05K2201/10674 , H05K3/205 , H05K3/4007 , H05K3/4084 , Y02P70/611
摘要： Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.
摘要翻译：公开了具有热接触的柔性基板，其提供从发热部件到散热器的连续高导热路径。在一个实施例中，热接触包括包括导热材料的凸起特征的金属迹线。可以使用焊球或圆角来在升高的特征和发热部件之间或在凸起的特征和下面的散热器之间或两者之间形成连接。

9. 发明授权

US5354205A Electrical connections with shaped contacts 失效
标题翻译：与成型触点的电气连接
公开(公告)号：US5354205A
公开(公告)日：1994-10-11
申请号：US51598
申请日：1993-04-23
申请人： Haim Feigenbaum , William R. Crumly , Christopher M. Schreiber
发明人： Haim Feigenbaum , William R. Crumly , Christopher M. Schreiber
IPC分类号： G01R1/073 , G01R31/02 , H01H1/14 , H01L21/66 , H01R12/00 , H05K1/11 , H05K3/20 , H05K3/32 , H05K3/36 , H05K3/40 , H01R9/09
CPC分类号： G01R1/073 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167 , H05K3/365 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： Shaped contacts (40,42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16,18,26,28) makes indentations (24a,24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34,36,38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56,58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82,84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.
摘要翻译：用于互连电路或用于集成电路测试探针的成形触头（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的一部分进行电镀。成型的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12））或光致抗蚀剂。包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到其上，以确保良好的接触而不需要擦拭动作。突出的触点也可以被压入到将要制造可配对/可分离的电连接的基板（例如印刷电路板）中的电镀孔（82,84）中。

10. 发明授权

US5158466A Metallically encapsulated elevated interconnection feature 失效
标题翻译：金属封装提升互联特性
公开(公告)号：US5158466A
公开(公告)日：1992-10-27
申请号：US663972
申请日：1991-03-04
申请人： Christopher M. Schreiber , David B. Swarbrick , Haim Feigenbaum
发明人： Christopher M. Schreiber , David B. Swarbrick , Haim Feigenbaum
IPC分类号： H01R4/04 , H01R12/00 , H05K1/00 , H05K1/09 , H05K3/24 , H05K3/40
CPC分类号： H05K3/4007 , H01R12/65 , H01R4/04 , H05K1/0393 , H05K1/095 , H05K2201/0347 , H05K2201/035 , H05K2201/0367 , H05K2201/09909 , H05K3/246 , H05K3/247 , Y10T29/49155
摘要： A pressure type contact (10) for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers in which one wafer is plated with a raised conductive interconnection feature. The raised feature is formed by placing a small lump (44) of electrically conductive resin on a substrate (12) and then electrolytically forming on the substrate a trace (18) having an enlarged connector pad (20) that completely covers the cured projecting resin lump.
摘要翻译：用于柔性或常规电缆电缆终端的压力型接触器（10）由电铸薄金属晶片制造，其中一个晶片被电镀有升高的导电互连特征。升高的特征是通过将小块（44）导电树脂放置在基底（12）上，然后在基底上电解形成具有扩大的连接器垫（20）的痕迹（18），该连接器垫完全覆盖固化的突出树脂块。

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