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1. 发明授权

US5123848A Computer signal interconnect apparatus 失效
标题翻译：计算机信号互连装置
公开(公告)号：US5123848A
公开(公告)日：1992-06-23
申请号：US556024
申请日：1990-07-20
申请人： Melvin C. August , Daniel Massopust , Mary Nebel , Eugene F. Neumann , Gregory Pautsch
发明人： Melvin C. August , Daniel Massopust , Mary Nebel , Eugene F. Neumann , Gregory Pautsch
IPC分类号： G06F13/40 , H01R13/33
CPC分类号： G06F13/409 , H01R12/523 , H01R13/33
摘要： An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.
摘要翻译：电气背板与计算机系统中的逻辑板进行高密度电连接。电背板由组装压力连接器和将逻辑板连接到外部接线的连接器互连板组成。组装压力连接器在其表面上具有电接触凸块，用于与逻辑板表面上的接触点进行电连接。组装压力连接器通过使用弹性凸块防止其电接触凸块的永久变形。弹性凸起由延伸穿过组件压力连接器的互连线的端部形成。互连线弯曲成板簧的形状。因此，电线在其组成材料的弹性范围内被压缩，并且不会由施加到组件压力连接器的力而永久变形。

2. 发明授权

US08232637B2 Insulated metal substrates incorporating advanced cooling 有权
标题翻译：采用先进冷却的绝缘金属基板
公开(公告)号：US08232637B2
公开(公告)日：2012-07-31
申请号：US12433301
申请日：2009-04-30
申请人： Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
发明人： Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
IPC分类号： H01L23/34
CPC分类号： H05K7/20927 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.
摘要翻译：功率模块包括结合到绝缘金属基板（IMS）的一个或多个半导体功率器件。多个冷却流体通道被集成到IMS中。

3. 发明授权

US08218320B2 Heat sinks with C-shaped manifolds and millichannel cooling 有权
标题翻译：散热器采用C形歧管和毫通冷却
公开(公告)号：US08218320B2
公开(公告)日：2012-07-10
申请号：US12826016
申请日：2010-06-29
申请人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
发明人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber. Millichannels are formed in the body or are formed in at least one of the lids and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels are disposed in a radial arrangement, and the millichannels and the inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. A lidless heat sink is also provided.
摘要翻译：用于冷却至少一个电子器件封装的散热器包括下盖，上盖和由至少一种导热材料形成的主体。主体设置在下盖和上盖之间并且密封到下盖和上盖之间并且限定了锥形入口分配室，其构造成容纳冷却剂，C形入口歧管被构造成从锥形入口分配室接收冷却剂，配置有倒置的C形出口歧管排出冷却液。入口歧管和出口歧管交错排列成圆形。出口歧管仅围绕主体的一部分延伸并且邻近入口室的相对侧终止。主体还限定锥形出口腔室，其构造成从出口歧管接收冷却剂，其中入口歧管仅围绕主体的一部分延伸并且邻近锥形出口腔室的相对侧终止。微通道形成在主体中或者形成在至少一个盖子中并且构造成从进气歧管接收冷却剂并将冷却剂输送到出口歧管。毫通道以径向布置设置，并且毫通道和入口和出口歧管进一步构造成冷却电子器件封装的上接触表面和下接触表面之一。还提供无盖散热器。

4. 发明申请

US20100277868A1 INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING 有权
标题翻译：包含高级冷却的绝缘金属基板
公开(公告)号：US20100277868A1
公开(公告)日：2010-11-04
申请号：US12433301
申请日：2009-04-30
申请人： Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
发明人： Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.
摘要翻译：功率模块包括结合到绝缘金属基板（IMS）的一个或多个半导体功率器件。多个冷却流体通道被集成到IMS中。

5. 发明申请

US20110317369A1 HEAT SINKS WITH MILLICHANNEL COOLING 审中-公开
标题翻译：用米勒冷凝器冷却的热量
公开(公告)号：US20110317369A1
公开(公告)日：2011-12-29
申请号：US12826128
申请日：2010-06-29
申请人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
发明人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/051 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided.
摘要翻译：用于冷却至少一个电子器件封装的散热器包括下盖，上盖和由至少一种导热材料形成的主体。主体设置在下盖和上盖之间并且被密封到下盖和上盖，并且限定入口歧管，其构造成接收被配置为排出冷却剂的冷却剂和出口歧管。入口歧管和出口歧管交错并且以圆形或螺旋形布置。微通道形成在体内或盖中，以径向布置设置，并且构造成从入口歧管接收冷却剂并将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被配置为冷却电子器件封装的上接触表面和下接触表面之一。还提供带有单个盖子的散热器。

6. 发明申请

US20110317368A1 HEAT SINKS WITH C-SHAPED MANIFOLDS AND MILLICHANNEL COOLING 有权
标题翻译：带有C型散热器和MILLICHANNEL冷却器的散热器
公开(公告)号：US20110317368A1
公开(公告)日：2011-12-29
申请号：US12826016
申请日：2010-06-29
申请人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
发明人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber. Millichannels are formed in the body or are formed in at least one of the lids and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels are disposed in a radial arrangement, and the millichannels and the inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. A lidless heat sink is also provided.
摘要翻译：用于冷却至少一个电子器件封装的散热器包括下盖，上盖和由至少一种导热材料形成的主体。主体设置在下盖和上盖之间并且密封到下盖和上盖之间并且限定了锥形入口分配室，其构造成容纳冷却剂，C形入口歧管被构造成从锥形入口分配室接收冷却剂，配置有倒置的C形出口歧管排出冷却液。入口歧管和出口歧管交错排列成圆形。出口歧管仅围绕主体的一部分延伸并且邻近入口室的相对侧终止。主体还限定锥形出口腔室，其构造成从出口歧管接收冷却剂，其中入口歧管仅围绕主体的一部分延伸并且邻近锥形出口腔室的相对侧终止。微通道形成在主体中或者形成在至少一个盖子中并且构造成从进气歧管接收冷却剂并将冷却剂输送到出口歧管。毫通道以径向布置设置，并且毫通道和入口和出口歧管进一步构造成冷却电子器件封装的上接触表面和下接触表面之一。还提供无盖散热器。

7. 发明授权

US07817422B2 Heat sink and cooling and packaging stack for press-packages 有权
标题翻译：散热器和冷却和包装堆叠用于压力包装
公开(公告)号：US07817422B2
公开(公告)日：2010-10-19
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

8. 发明授权

US08120915B2 Integral heat sink with spiral manifolds 有权
标题翻译：具有螺旋歧管的集成散热器
公开(公告)号：US08120915B2
公开(公告)日：2012-02-21
申请号：US12861181
申请日：2010-08-23
申请人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
发明人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , F28D7/04 , H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了一种用于直接冷却具有上接触表面和下接触表面的至少一个电子器件封装的散热器。散热器包括由至少一种导热材料形成的冷却片，其中所述冷却片限定构造成容纳冷却剂的至少一个入口歧管和构造成排出冷却剂的至少一个出口歧管。入口歧管和出口歧管交错并以螺旋形布置。冷却片还限定了以径向布置的多个毫通道，并且构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

9. 发明申请

US20100315782A1 INTEGRAL HEAT SINK WITH SPIRAL MANIFOLDS 有权
标题翻译：整体散热器与螺旋管
公开(公告)号：US20100315782A1
公开(公告)日：2010-12-16
申请号：US12861181
申请日：2010-08-23
申请人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
发明人： Adam Gregory Pautsch , Satish Sivarama Gunturi , Patrick Jose Lazatin
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , F28D7/04 , H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了一种用于直接冷却具有上接触表面和下接触表面的至少一个电子器件封装的散热器。散热器包括由至少一种导热材料形成的冷却片，其中所述冷却片限定构造成容纳冷却剂的至少一个入口歧管和构造成排出冷却剂的至少一个出口歧管。入口歧管和出口歧管交错并以螺旋形布置。冷却片还限定了以径向布置的多个毫通道，并且构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

10. 发明申请

US20100038058A1 HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES 有权
标题翻译：用于压缩包的热水槽和冷却和包装堆叠
公开(公告)号：US20100038058A1
公开(公告)日：2010-02-18
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

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