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1. 发明授权

US08193619B2 Lead frame and semiconductor package having the same 有权
标题翻译：引线框架和半导体封装相同
公开(公告)号：US08193619B2
公开(公告)日：2012-06-05
申请号：US12659472
申请日：2010-03-10
申请人： Geun-Woo Kim , Ho-Geon Song , Man-Hee Han
发明人： Geun-Woo Kim , Ho-Geon Song , Man-Hee Han
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/4951 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2924/01079 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.
摘要翻译：提供了一种引线框架，其可以包括框架，引线结构和坝条。框架可以包括被配置为接收半导体芯片的多个开口。引线结构可以在开口中。引线结构还可以包括内引线和外引线。内引线可以被配置为电连接到半导体芯片，并且外引线可以从内引线延伸。在示例性实施例中，引线结构可沿第一方向延伸。阻挡杆可以布置在内引线和外引线之间。根据示例性实施例，阻挡杆可以沿着基本上垂直于第一方向的第二方向延伸。在示例性实施例中，阻挡杆可以具有沿第二方向延伸的第一强度增强部分。还提供了具有引线框架的半导体封装。

2. 发明申请

US20100285759A1 MOBILE DEVICE HAVING AT LEAST TWO ANTENNAS AND OPERATION CONTROL METHOD THEREOF 有权
标题翻译：具有至少两个天线的移动设备及其操作控制方法
公开(公告)号：US20100285759A1
公开(公告)日：2010-11-11
申请号：US12773060
申请日：2010-05-04
申请人： Chang Gwon Chung , Hyun Kim , Myeong Hwa Kim , Geun Woo Kim , Kyung Hwan Jo , Doo Na Kim
发明人： Chang Gwon Chung , Hyun Kim , Myeong Hwa Kim , Geun Woo Kim , Kyung Hwan Jo , Doo Na Kim
IPC分类号： H04B7/02
CPC分类号： H04B1/3838 , H01Q1/243 , H01Q21/28
摘要： A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.
摘要翻译：具有至少两个天线的移动设备可以避免用户对该设备的掌握所引起的传输问题。传感器单元设置在设备主体的特定位置，并通过检测诸如用户的手的特定对象的接触或接近来产生传感器信号。当接收到传感器信号时，控制单元根据传感器信号选择一个天线，并根据所选择的天线建立通信路径。通信路径中所选择的天线通常相对不受用户对移动设备的掌握而导致的传输降级。与移动设备被抓握时的典型性能下降相比，可能由于用户的掌握而降低的移动设备的辐射特性可以表现出相对较小或没有劣化。

3. 发明申请

US20100237478A1 Lead frame and semiconductor package having the same 有权
标题翻译：引线框架和半导体封装相同
公开(公告)号：US20100237478A1
公开(公告)日：2010-09-23
申请号：US12659472
申请日：2010-03-10
申请人： Geun-Woo Kim , Ho-Geon Song , Man-Hee Han
发明人： Geun-Woo Kim , Ho-Geon Song , Man-Hee Han
IPC分类号： H01L23/52 , H01L23/495
CPC分类号： H01L23/49548 , H01L23/4951 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2924/01079 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.
摘要翻译：提供了一种引线框架，其可以包括框架，引线结构和坝条。框架可以包括被配置为接收半导体芯片的多个开口。引线结构可以在开口中。引线结构还可以包括内引线和外引线。内引线可以被配置为电连接到半导体芯片，并且外引线可以从内引线延伸。在示例性实施例中，引线结构可沿第一方向延伸。阻挡杆可以布置在内引线和外引线之间。根据示例性实施例，阻挡杆可以沿着基本上垂直于第一方向的第二方向延伸。在示例性实施例中，阻挡杆可以具有沿第二方向延伸的第一强度增强部分。还提供了具有引线框架的半导体封装。

4. 发明申请

US20140208850A1 APPARATUS AND METHOD OF DETECTING A DEFECT OF A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：检测半导体器件缺陷的装置和方法
公开(公告)号：US20140208850A1
公开(公告)日：2014-07-31
申请号：US13753111
申请日：2013-01-29
申请人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
发明人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
IPC分类号： G01N29/14
CPC分类号： G01N29/14 , G01N29/4454 , G01N2291/0289 , H01L21/67288
摘要： A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
摘要翻译：一种半导体器件缺陷检测装置，包括：设置在半导体处理设备上的传感器，所述传感器被配置为检测与半导体处理设备接触的半导体器件发射的信号; 以及信号分析器，被配置为基于在预定频率范围内的检测信号来确定半导体器件是否有缺陷。

5. 发明授权

US08620245B2 Mobile device having at least two antennas and operation control method thereof 有权
标题翻译：具有至少两个天线的移动设备及其操作控制方法
公开(公告)号：US08620245B2
公开(公告)日：2013-12-31
申请号：US12773060
申请日：2010-05-04
申请人： Chang Gwon Chung , Hyun Kim , Myeong Hwa Kim , Geun Woo Kim , Kyung Hwan Jo , Doo Na Kim
发明人： Chang Gwon Chung , Hyun Kim , Myeong Hwa Kim , Geun Woo Kim , Kyung Hwan Jo , Doo Na Kim
IPC分类号： H04B17/02
CPC分类号： H04B1/3838 , H01Q1/243 , H01Q21/28
摘要： A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.
摘要翻译：具有至少两个天线的移动设备可以避免用户对该设备的掌握所引起的传输问题。传感器单元设置在设备主体的特定位置，并通过检测诸如用户的手的特定对象的接触或接近来产生传感器信号。当接收到传感器信号时，控制单元根据传感器信号选择一个天线，并根据所选择的天线建立通信路径。通信路径中所选择的天线通常相对不受用户对移动设备的掌握而导致的传输降级。与移动设备被抓握时的典型性能下降相比，可能由于用户的掌握而降低的移动设备的辐射特性可以表现出相对较小或没有劣化。

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