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    • 2. 发明申请
    • Process and Assembly for Non-Destructive Surface Inspections
    • 非破坏性表面检查的过程和装配
    • US20070103676A1
    • 2007-05-10
    • US11464766
    • 2006-08-15
    • Norbert MarxerKenneth GrossHubert AltendorferGeorge Kren
    • Norbert MarxerKenneth GrossHubert AltendorferGeorge Kren
    • G01N21/88
    • G01N21/9501
    • A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies at the surface at collection angles away from the surface normal. In some applications, a lens arrangement with its axis along the surface normal is also used to collect the light scattered by the surface and any anomalies. The light scattered by the mirror and lenses may be directed to the same or different detectors. Preferably light scattered by the surface within a first range of collection angles from the axis is detected by a first detector and light scattered by the surface within a second range of collection angles from the axis is detected by a second detector. The two ranges of collection angles are different, with one detector optimized to detect scattering from large particles and defects and the other detector optimized to detect light from small particles and defects.
    • 光束沿着垂直于表面的方向指向表面。 使表面移动,使得光束沿着螺旋路径扫描表面。 椭圆镜被放置成其轴线沿着表面法线收集由表面散射的光和表面上的任何异常,其收集角度远离表面法线。 在一些应用中,其沿着表面法线的轴的透镜装置也用于收集由表面散射的光和任何异常。 由镜子和透镜散射的光可以被引导到相同或不同的检测器。 优选地,通过第一检测器检测由表面在从轴的收集角度的第一范围内的表面散射的光,并且由第二检测器检测在距离轴的第二收集角度范围内由表面散射的光。 收集角度的两个范围是不同的,一个检测器被优化以检测来自大颗粒和缺陷的散射,并且另一个检测器被优化以检测来自小颗粒和缺陷的光。
    • 5. 发明授权
    • Process and assembly for non-destructive surface inspections
    • 非破坏性表面检查的工艺和组装
    • US06271916B1
    • 2001-08-07
    • US08770491
    • 1996-12-20
    • Norbert MarxerKenneth P. GrossHubert AltendorferGeorge Kren
    • Norbert MarxerKenneth P. GrossHubert AltendorferGeorge Kren
    • G01N2188
    • G01N21/9501
    • A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies at the surface at collection angles away from the surface normal. In some applications, a lens arrangement with its axis along the surface normal is also used to collect the light scattered by the surface and any anomalies. The light scattered by the mirror and lenses may be directed to the same or different detectors. Preferably light scattered by the surface within a first range of collection angles from the axis is detected by a first detector and light scattered by the surface within a second range of collection angles from the axis is detected by a second detector. The two ranges of collection angles are different, with one detector optimized to detect scattering from large particles and defects and the other detector optimized to detect light from small particles and defects.
    • 光束沿着垂直于表面的方向指向表面。 使表面移动,使得光束沿着螺旋路径扫描表面。 椭圆镜被放置成其轴线沿着表面法线收集由表面散射的光以及在距表面法线的收集角度处的表面上的任何异常。 在一些应用中,其沿着表面法线的轴的透镜装置也用于收集由表面散射的光和任何异常。 由镜子和透镜散射的光可以被引导到相同或不同的检测器。 优选地,通过第一检测器检测由表面在从轴的收集角度的第一范围内的表面散射的光,并且由第二检测器检测在距离轴的第二收集角度范围内由表面散射的光。 收集角度的两个范围是不同的,一个检测器被优化以检测来自大颗粒和缺陷的散射,并且另一个检测器被优化以检测来自小颗粒和缺陷的光。
    • 8. 发明授权
    • Wafer inspection systems and methods for analyzing inspection data
    • 晶圆检查系统和检验数据分析方法
    • US07417724B1
    • 2008-08-26
    • US11746884
    • 2007-05-10
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • G01N21/88G06K9/00
    • G01N21/9501G01N21/9503H01L21/67005H01L21/67288
    • Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.
    • 提供晶圆检查系统和方法。 一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。 模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。 一种或多种模式包括后侧检查,边缘检查,前侧宏观缺陷检查或其组合。 另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。 传感器被配置为基本上同时检测从晶片返回的光。 用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板,所述支撑装置接触晶片的背面。 该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。
    • 9. 发明授权
    • Wafer inspection systems and methods for analyzing inspection data
    • 晶圆检查系统和检验数据分析方法
    • US07227628B1
    • 2007-06-05
    • US10964585
    • 2004-10-12
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • G01N21/88G06K9/00
    • G01N21/9501G01N21/9503H01L21/67005H01L21/67288
    • Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.
    • 提供晶圆检查系统和方法。 一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。 模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。 一种或多种模式包括后侧检查,边缘检查,前侧宏观缺陷检查或其组合。 另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。 传感器被配置为基本上同时检测从晶片返回的光。 用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板,所述支撑装置接触晶片的背面。 该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。