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1. 发明授权

US07739791B2 Method of producing an overmolded electronic module with a flexible circuit pigtail 有权
标题翻译：用柔性电路引线制造包覆成型电子模块的方法
公开(公告)号：US07739791B2
公开(公告)日：2010-06-22
申请号：US11978063
申请日：2007-10-26
申请人： Scott D. Brandenburg , David A Laudick , Gary E. Oberlin
发明人： Scott D. Brandenburg , David A Laudick , Gary E. Oberlin
IPC分类号： H05K13/00
CPC分类号： H05K3/284 , B29C45/14377 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C45/72 , H05K1/118 , H05K1/147 , H05K3/361 , H05K5/065 , H05K2201/0239 , H05K2203/1121 , H05K2203/1316 , Y10T29/49121 , Y10T29/49144 , Y10T29/49146 , Y10T29/49172 , Y10T29/5193
摘要： A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.
摘要翻译：一种制造包括模制的电子组件的方法，包括电路板和柔性电路互连，通过将组件固定在模腔中，使得柔性电路的一部分从模具突出，并且在模具和柔性模具之间提供可压缩的弹性体界面电路密封模腔，并保护柔性电路免受模具夹紧力的损坏。模具腔内柔性电路的一部分预先涂覆有确保与模塑料具有良好粘附性的材料，并且热耦合到柔性电路部分的热交换器从模具突出以保护柔性电路免受损坏由于模具和模具化合物的热传导。

2. 发明申请

US20090106974A1 Method of producing an overmolded electronic module with a flexible circuit pigtail 有权
标题翻译：用柔性电路引线制造包覆成型电子模块的方法
公开(公告)号：US20090106974A1
公开(公告)日：2009-04-30
申请号：US11978063
申请日：2007-10-26
申请人： Scott D. Brandenburg , David A. Laudick , Gary E. Oberlin
发明人： Scott D. Brandenburg , David A. Laudick , Gary E. Oberlin
IPC分类号： H01L23/31 , H01L23/433
CPC分类号： H05K3/284 , B29C45/14377 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C45/72 , H05K1/118 , H05K1/147 , H05K3/361 , H05K5/065 , H05K2201/0239 , H05K2203/1121 , H05K2203/1316 , Y10T29/49121 , Y10T29/49144 , Y10T29/49146 , Y10T29/49172 , Y10T29/5193
摘要： A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.
摘要翻译：一种制造包括模制的电子组件的方法，包括电路板和柔性电路互连，通过将组件固定在模腔中，使得柔性电路的一部分从模具突出，并且在模具和柔性模具之间提供可压缩的弹性体界面电路密封模腔，并保护柔性电路免受模具夹紧力的损坏。模具腔内柔性电路的一部分预先涂覆有确保与模塑料具有良好粘附性的材料，并且热耦合到柔性电路部分的热交换器从模具突出以保护柔性电路免受损坏由于模具和模具化合物的热传导。

3. 发明授权

US07106588B2 Power electronic system with passive cooling 有权
标题翻译：电力电子系统被动冷却
公开(公告)号：US07106588B2
公开(公告)日：2006-09-12
申请号：US10694191
申请日：2003-10-27
申请人： Gary E. Oberlin , Bruce A. Myers , Thomas A. Degenkolb , Darrel E. Peugh
发明人： Gary E. Oberlin , Bruce A. Myers , Thomas A. Degenkolb , Darrel E. Peugh
IPC分类号： H05K7/20 , H01L23/427 , H05K7/06
CPC分类号： H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.
摘要翻译：本发明涉及从大功率电子设备散热的装置和方法。该组件包括大电流衬底，诸如支撑电子器件的印刷电路板，与电子器件热耦合的热管和还形成散热器的组装壳体，以及可以热耦合的热瞬变抑制材料与电子设备和热管。

4. 发明授权

US06999317B2 Thermally enhanced electronic module with self-aligning heat sink 有权
标题翻译：具有自对准散热器的热增强型电子模块
公开(公告)号：US06999317B2
公开(公告)日：2006-02-14
申请号：US10639572
申请日：2003-08-12
申请人： Suresh K. Chengalva , Gary E. Oberlin , Matthew R. Walsh
发明人： Suresh K. Chengalva , Gary E. Oberlin , Matthew R. Walsh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.
摘要翻译：热增强型电子模块包括导热壳体，自对准导热散热器和集成电路（IC）封装。壳体包括尺寸适于接收散热器的一部分的孔径。 IC封装包括与第一表面相对的第一表面和第二表面，并且将IC封装的第一表面面向衬底安装到衬底。当散热器定位在孔中并固定到壳体上时，IC封装的第二表面与散热器热接触。

5. 发明授权

US07038308B2 Multi-path bar bond connector for an integrated circuit assembly 失效
标题翻译：用于集成电路组件的多路径接合连接器
公开(公告)号：US07038308B2
公开(公告)日：2006-05-02
申请号：US10919864
申请日：2004-08-17
申请人： Gary E. Oberlin , Todd P. Oman
发明人： Gary E. Oberlin , Todd P. Oman
IPC分类号： H01L23/48
CPC分类号： H01L23/49844 , H01L23/488 , H01L23/492 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L2224/37011 , H01L2224/37599 , H01L2224/40091 , H01L2224/40225 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/37099
摘要： A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.
摘要翻译：可焊接棒接合连接器在衬底和安装在衬底上的IC芯片的高电流端子之间建立初级互连，并且在IC芯片的衬底和低电流端子之间建立一个或多个次互连。棒接合连接器包括焊接到IC芯片的高电流端子的板部分和从板部分延伸到衬底上的多个接合位置的多个腿部元件。至少一个腿元件的下侧设置有包括与相应的腿元件电隔离的导体的次级电路。次级电路的导体焊接到IC芯片的基板和低电流端子，除了由板部分和其它支脚元件建立的主互连之外，还建立辅助互连。

6. 发明授权

US06593527B1 Integrated circuit assembly with bar bond attachment 有权
标题翻译：集成电路组件与棒结合附件
公开(公告)号：US06593527B1
公开(公告)日：2003-07-15
申请号：US10124782
申请日：2002-04-17
申请人： Scott D. Brandenburg , Robert Vajagich , Gary E. Oberlin
发明人： Scott D. Brandenburg , Robert Vajagich , Gary E. Oberlin
IPC分类号： H02G308
CPC分类号： H01L24/41 , H01L23/492 , H01L23/49562 , H01L24/31 , H01L24/37 , H01L24/40 , H01L2224/37011 , H01L2224/4007 , H01L2224/40091 , H01L2224/40225 , H01L2224/4103 , H01L2224/45124 , H01L2224/73263 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/1306 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/48 , H01L2224/37099
摘要： An integrated circuit assembly 10 is provided, including a substrate 14 having at least one substrate contact surface 18, an integrated circuit device 12 having at least one first contact surface 16, and a bar bond element 22. The bar bond element 22 provides communication between the at least one substrate contact surface 18 and the at least one first contact surface 16. The bar bond element 22 includes a conductive plate element 23 having an integrated circuit foot portion 24, a substrate foot portion 26 and a strain relief loop 46 positioned between the integrated circuit foot portion 24 and the substrate foot portion 26.
摘要翻译：提供集成电路组件10，其包括具有至少一个基板接触表面18的基板14，具有至少一个第一接触表面16的集成电路设备12和条形接合元件22.条形接合元件22提供所述至少一个基板接触表面18和所述至少一个第一接触表面16.所述条接合元件22包括导电板元件23，该导电板元件具有集成电路脚部24，基底脚部26和应变消除环46，集成电路脚部24和基板脚部26。

7. 发明授权

US07551439B2 Fluid cooled electronic assembly 有权
标题翻译：流体冷却电子组件
公开(公告)号：US07551439B2
公开(公告)日：2009-06-23
申请号：US11396322
申请日：2006-03-28
申请人： Darrel E. Peugh , Bruce A. Myers , Gary E. Oberlin
发明人： Darrel E. Peugh , Bruce A. Myers , Gary E. Oberlin
IPC分类号： H05K7/20
CPC分类号： H01L23/053 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , H01L2924/13055 , H01L2924/00
摘要： An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.
摘要翻译：提供电子组件，其具有用于冷却密封隔室内的电子设备的热冷却流体，例如液体。组件包括大致限定密封的流体隔室的壳体，设置在壳体内的电子设备和用于冷却电子设备的冷却液体。组件包括与密封流体隔室流体连通的入口和出口端口，用于允许冷却液体通过隔室以冷却电子设备。流体流动通道形成为与壳体内的电子装置热连通。流体通道包括允许液体与电子设备热连通流动的通道以冷却设备。

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