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    • 6. 发明授权
    • Formation of an isolating wall
    • 形成隔离墙
    • US06759726B1
    • 2004-07-06
    • US09426822
    • 1999-10-22
    • Christine AnceauFabien PierreOlivier Bonnaud
    • Christine AnceauFabien PierreOlivier Bonnaud
    • H01L21336
    • H01L21/761H01L21/2257H01L21/763
    • A method of forming an isolating wall in a semiconductor substrate of a first conductivity type, including the steps of boring in the substrate separate recesses according to the desired isolating wall contour; filling the recesses with a material containing a dopant of the second conductivity type; and performing an anneal step so that regions of the second conductivity type diffused from neighboring recesses join. A first series of recesses is formed from the upper surface and a second series of recesses is formed from the lower surface. The recesses have a substantially rectangular section, the large dimension of which is perpendicular to the alignment of the recesses and a depth smaller than or equal to the half-thickness of the substrate.
    • 一种在第一导电类型的半导体衬底中形成隔离壁的方法,包括以下步骤:在所述衬底中钻孔,根据期望的隔离壁轮廓分离凹槽; 用含有第二导电类型的掺杂剂的材料填充凹部; 并执行退火步骤,使得从相邻凹部扩散的第二导电类型的区域接合。 从上表面形成第一系列凹部,并且从下表面形成第二系列凹部。 凹部具有基本上矩形的部分,其大尺寸垂直于凹部的对准并且深度小于或等于基底的半厚度。