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1. 发明授权

US11939492B2 Adhesive resin composition, method for bonding adherends, and adhesive resin film 有权
公开(公告)号：US11939492B2
公开(公告)日：2024-03-26
申请号：US17744191
申请日：2022-05-13
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Hirokazu Iizuka , Kunihiro Takei , Yuiko Maruyama , Yuki Sato
IPC分类号： C09J7/20 , B32B37/12 , B32B38/00 , C09J7/30 , C09J123/26 , C09J151/06 , C09J163/04
CPC分类号： C09J123/26 , B32B37/12 , B32B38/0036 , C09J7/20 , C09J7/30 , C09J151/06 , C09J163/04 , C08L2201/56 , Y10T428/287 , C09J151/06 , C08L63/04
摘要： The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.

2. 发明授权

US11904577B2 Hot-melt adhesive resin film and production method thereof 有权
公开(公告)号：US11904577B2
公开(公告)日：2024-02-20
申请号：US17034334
申请日：2020-09-28
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Kunihiro Takei , Yuiko Maruyama , Hirokazu Iizuka
IPC分类号： B32B7/12 , B32B27/08 , B29C48/08 , B29C48/21 , B29C48/00 , B32B27/32 , B32B27/38 , C09J125/08 , C09J123/26 , C08L23/06 , C08L23/20 , C09J7/35 , B32B27/00 , C09J151/06 , C09J163/00 , C09J7/29 , B32B27/20 , B32B27/30 , B32B27/34 , B05D1/26 , B29K9/00 , B29K19/00 , B29K23/00 , B29K33/00 , B29K63/00 , B29K105/00
CPC分类号： B32B27/08 , B29C48/022 , B29C48/08 , B29C48/21 , B32B27/00 , B32B27/20 , B32B27/302 , B32B27/32 , B32B27/325 , B32B27/327 , B32B27/34 , B32B27/38 , C08L23/06 , C08L23/20 , C09J7/29 , C09J7/35 , C09J123/26 , C09J125/08 , C09J151/06 , C09J163/00 , B05D1/265 , B29K2009/00 , B29K2019/00 , B29K2023/06 , B29K2023/12 , B29K2033/08 , B29K2063/00 , B29K2105/0097 , B32B2250/05 , B32B2250/24 , B32B2250/40 , B32B2270/00 , B32B2307/306 , B32B2405/00 , C09J2301/124 , C09J2301/304 , C09J2423/006 , C09J2451/00 , C09J2463/00 , Y10T428/2813 , Y10T428/2848 , C09J2451/00 , C09J2463/00 , C09J151/06 , C08L51/003 , C08L23/06 , C08L23/12 , C08L53/025 , C08L23/20 , C08L23/22 , C08L23/12
摘要： A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.

3. 发明公开

US20240050313A1 PACKAGE 审中-公开
公开(公告)号：US20240050313A1
公开(公告)日：2024-02-15
申请号：US18494229
申请日：2023-10-25
申请人： Fujimori Kogyo Co., Ltd.
发明人： Atsushi Mio , Toyoaki Suzuki , Junpei Nomura , Kaho Toyabe , Hajime Okamoto
IPC分类号： A61J1/10 , A61J1/14 , B32B1/00 , B32B7/12 , B32B27/08 , B32B27/32
CPC分类号： A61J1/10 , A61J1/1468 , B32B1/00 , B32B7/12 , B32B27/08 , B32B27/322 , B32B27/325 , B32B2250/242 , B32B2307/7246 , B32B2439/46 , B32B2439/80 , A61J1/1475 , Y10T428/1352 , Y10T428/1334 , Y10T428/1341 , Y10T428/1379
摘要： A package has a bag body, at least one mouth part member bonded to the bag body, and a contained product being a liquid housed in the bag body. The bag body is formed in a bag shape by using laminates each having a sealant layer and a water vapor barrier layer composed at least of a fluorine-based resin, and by bonding together the sealant layers opposing each other so that the sealant layers are to be located on the inside of the bag body. The mouth part member is sandwiched between the oppositely facing sealant layers and is bonded thereto. The volume V of the contained product housed in the bag body is 0.1-20 cm3, and the relation between the area S (cm2) where the bag body is in contact with the contained product housed in the bag body and the aforementioned volume V (cm3) satisfies 0.05≤V/S≤0.25 (formula (I)).

4. 发明公开

US20240024875A1 METHOD FOR MANUFACTURING MICROCHIP FOR BLOOD COAGULATION TEST 审中-公开
公开(公告)号：US20240024875A1
公开(公告)日：2024-01-25
申请号：US18254817
申请日：2021-11-26
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Masato ABE , Takao SATO , Tomoko WADA , Tomoka NAGASATO , Kazuya HOSOKAWA
IPC分类号： B01L3/00
CPC分类号： B01L3/502761 , B01L3/502707 , B01L2200/12 , B01L2200/16 , B01L2300/0816 , B01L2300/069 , B01L2300/0663
摘要： A method for manufacturing a microchip for a blood coagulation test includes preparing a substrate which has, in the surface thereof, a groove serving as a flow channel, and has a first through-hole serving as an inlet and provided on one end side of the groove. A film having a surface coated with collagen and/or tissue thromboplastin is prepared so as to cover a region of a portion on the flow channel when the film is bonded to the surface, of the substrate, having the groove therein overlaps the surface, of the film, coated with the collagen and/or tissue thromboplastin.

5. 发明授权

US11845591B2 Pouring spout 有权
公开(公告)号：US11845591B2
公开(公告)日：2023-12-19
申请号：US17289911
申请日：2019-10-24
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Matsutaro Ono
IPC分类号： B65D47/08 , B65D75/00 , B65D75/58
CPC分类号： B65D47/0885 , B65D75/008 , B65D75/5883 , B65D2575/586
摘要： To provide a pouring spout in which an open state of the closing member is maintained while contents are being transferred. The above-described problem is solved by a pouring spout (10) including a spout main body (10A) and a closing unit (20). The spout main body (10A) includes at least a bonded part (15), a tubular part (11), and a channel (18). The closing unit (20) includes a closing member (21), an attaching part (24), and a coupling member (23). The spout main body (10A) is formed with an attached part (40). The coupling member (23) couples a first surface of the closing member (21) on the attaching part (24) side and facing the pouch main body part side, and the attaching member (24). The closing member (21) includes a fixed region corresponding to an area of a second surface opposite to the first surface on the attaching part (24) side thereof in which the coupling member (23) is coupled, the fixed region being supported by a nozzle (58) of a packaging container, thereby holding an angle θ formed by the closing member (21) with an end surface of the bonded part (15) on the pouch main body part side at less than 90 degrees.

6. 发明授权

US11826991B2 Hot-melt adhesive resin film and production method thereof 有权
公开(公告)号：US11826991B2
公开(公告)日：2023-11-28
申请号：US17476409
申请日：2021-09-15
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Kunihiro Takei , Yuiko Maruyama , Hirokazu Iizuka
IPC分类号： B32B7/12 , B32B27/08 , B32B27/32 , C09D123/26 , C09D5/00 , C09J123/26 , C09J201/00 , B32B27/00 , C09J151/06 , B32B37/00 , C09J7/29 , C09J7/35 , B32B27/20 , B32B27/30 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/12 , B32B37/18 , B05D5/10
CPC分类号： B32B27/08 , B32B27/00 , B32B27/20 , B32B27/302 , B32B27/32 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/00 , B32B37/12 , B32B37/185 , C09D5/00 , C09D123/26 , C09J7/29 , C09J7/35 , C09J123/26 , C09J151/06 , C09J201/00 , B05D5/10 , B32B2250/03 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2270/00 , B32B2307/306 , B32B2307/732 , B32B2323/10 , B32B2325/00 , B32B2363/00 , B32B2367/00 , B32B2377/00 , B32B2405/00 , C09J2301/124 , C09J2301/304 , C09J2301/414 , C09J2423/00 , C09J2423/006 , C09J2423/106 , C09J2451/00 , C09J2463/00 , C09J2467/006 , C09J2479/08 , Y10T428/287 , Y10T428/2813 , Y10T428/2848 , C09J2451/00 , C09J2463/00 , C09J151/06 , C08L51/003
摘要： The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

7. 发明公开

US20230364892A1 Laminate And Package 审中-公开
公开(公告)号：US20230364892A1
公开(公告)日：2023-11-16
申请号：US18029573
申请日：2021-10-25
申请人： Fujimori Kogyo Co., Ltd.
发明人： Toshihiko Mori , Naoto Fujikawa , Hiroshi Kuwabara
IPC分类号： B32B27/08 , B32B27/32 , B32B7/12 , B65D65/40 , B65D75/00 , B65D75/58
CPC分类号： B32B27/08 , B32B27/32 , B32B7/12 , B65D65/40 , B65D75/008 , B65D75/5883 , B32B2255/10 , B32B2255/28 , B32B2439/46 , B32B2307/4023 , B32B2250/242 , B32B2250/02
摘要： This laminate has an inner layer formed of a polyethylene-based resin, an outer layer formed of a polyethylene-based resin, and a barrier layer laminated between the inner layer and the outer layer. The inner layer is formed as a sealant layer that is an innermost layer of the laminate, and the barrier layer is laminated in contact with an outer surface of the inner layer. Accordingly, it is possible to provide a laminate and a package which are formed of a mono-material and have a barrier property.

8. 发明公开

US20230311115A1 METHOD FOR MANUFACTURING MICROCHIP FOR LIQUID SAMPLE ANALYSIS 审中-公开
公开(公告)号：US20230311115A1
公开(公告)日：2023-10-05
申请号：US18043311
申请日：2021-08-31
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Masato ABE , Tomoko WADA , Takao SATO , Kazuya HOSOKAWA
IPC分类号： B01L3/00
CPC分类号： B01L3/502707
摘要： A method for manufacturing a microchip for analyzing a component in a liquid sample by passing the sample through a flow path provided inside and performing a reaction in a reaction portion provided in a portion of the flow path, the method including: a step of providing a substrate including on the surface thereof a groove serving as a flow path and a reaction portion in a portion between the both ends of the groove; a step of applying an adhesive agent or a gluing agent on an area other than the groove on the grooved surface of the substrate; a step of providing a film on an area of which a reaction substance is applied; and a step of attaching the film on the substrate in a specific manner.

9. 发明公开

US20230294388A1 Resin Laminate, Packaging Container, And Production Method For Resin Laminate 审中-公开
公开(公告)号：US20230294388A1
公开(公告)日：2023-09-21
申请号：US18014713
申请日：2021-07-08
申请人： Fujimori Kogyo Co., Ltd.
发明人： Chisato Nagami , Junko Fuchu , Atsushi Manabe , Takahisa Nagai
IPC分类号： B32B27/32 , B32B27/08 , B32B38/18 , B32B37/15
CPC分类号： B32B27/32 , B32B27/08 , B32B38/1808 , B32B37/153 , B32B2255/10 , B32B2250/03 , B32B2250/24 , B32B2255/26 , B32B2307/7242 , B32B2307/7265 , B32B2037/243
摘要： There is provided a resin laminate including: at least a first layer; a second layer; and an intermediate layer laminated in contact with the first layer and the second layer, in which a surface of the first layer in contact with the intermediate layer is an oxidized surface, a surface of the intermediate layer in contact with the first layer is an oxidized surface, the first layer is a layer in which a thermoplastic resin is used as a forming material or a layer in which cellophane is used as a forming material, and the intermediate layer is made of polyethylene having a density of 0.915 g/cm3 or less.

10. 发明授权

US11710881B2 Electrode lead wire member and battery 有权
公开(公告)号：US11710881B2
公开(公告)日：2023-07-25
申请号：US17198393
申请日：2021-03-11
申请人： FUJIMORI KOGYO CO., LTD.
发明人： Kunihiro Takei , Hirokazu Iizuka , Shunsuke Takeyama
IPC分类号： H01M50/571 , H01M50/562 , H01M50/553 , H01M50/197 , H01M50/198 , H01M50/186 , H01M50/193 , H01M50/178
CPC分类号： H01M50/571 , H01M50/178 , H01M50/186 , H01M50/193 , H01M50/197 , H01M50/198 , H01M50/553 , H01M50/562
摘要： Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.

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