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    • 1. 发明申请
    • Method of forming a body-tie
    • 形成身体的方法
    • US20070257317A1
    • 2007-11-08
    • US11415703
    • 2006-05-02
    • Paul FechnerGordon ShawEric Vogt
    • Paul FechnerGordon ShawEric Vogt
    • H01L27/12
    • H01L29/78615H01L29/66772
    • A method of forming a body-tie. The method includes forming the body-tie during an STI scheme of an SOI process. During the STI scheme, a first trench is formed. The first trench stops before a buried oxide layer of the SOI substrate. The first trench may determine a height of body tie that is shared between at least two FETs. A second trench may also be formed within the first trench. The second trench stops in the SOI substrate. The second trench defines the location and shape of a body-tie. Once the location and shape of the body-tie are defined, an oxide is deposited above the body-tie. The deposited oxide prevents certain implants from entering the body tie. By preventing these implants, a source and a drain implant may be self-aligned to the source and drain areas without requiring the use of the photoresist mask to shield the body tie regions from the source and drain implant.
    • 一种形成身体的方法。 该方法包括在SOI工艺的STI方案期间形成体系。 在STI方案中,形成第一沟槽。 第一沟槽在SOI衬底的掩埋氧化物层之前停止。 第一沟槽可以确定在至少两个FET之间共享的身体连接的高度。 也可以在第一沟槽内形成第二沟槽。 第二沟槽在SOI衬底中停止。 第二个沟槽定义了一个领带的位置和形状。 一旦定义了身体领带的位置和形状,就会在身体绑带上方沉积氧化物。 沉积的氧化物防止某些植入物进入身体束带。 通过防止这些植入物,源极和漏极注入可以与源极和漏极区域自对准,而不需要使用光致抗蚀剂掩模来屏蔽源极和漏极植入物的主体连接区域。
    • 3. 发明申请
    • Dose rate simulation
    • 剂量率模拟
    • US20060145086A1
    • 2006-07-06
    • US11029308
    • 2005-01-05
    • Harry LiuKeith GolkeEric VogtMichael Liu
    • Harry LiuKeith GolkeEric VogtMichael Liu
    • G01T1/24
    • G06F17/5036
    • Behaviors of a transistor during a dose rate event can be modeled using a circuit simulation software package. A subcircuit model replaces a transistor in a circuit design to be simulated. The subcircuit model can be in the form of a schematic-based representation or a netlist. The subcircuit model provides a model of a source junction and a drain junction in the transistor during the dose rate event. The subcircuit model also includes the size of the transistor being replaced and the dose rate of the dose rate event. Once the transistor is replaced with the subcircuit model, a dose rate simulation may be performed to determine the dose rate hardness of the circuit design.
    • 在剂量率事件期间晶体管的行为可以使用电路仿真软件包进行建模。 子电路模型取代要仿真的电路设计中的晶体管。 子电路模型可以是基于原理图的表示形式或网表。 子电路模型在剂量率事件期间提供晶体管中的源极结和漏极结的模型。 子电路模型还包括被替换的晶体管的尺寸和剂量率事件的剂量率。 一旦晶体管被子电路模型替代,可以执行剂量率模拟来确定电路设计的剂量率硬度。