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1. 发明授权

US08902596B2 Data storage device 有权
标题翻译：数据存储设备
公开(公告)号：US08902596B2
公开(公告)日：2014-12-02
申请号：US13424858
申请日：2012-03-20
申请人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
发明人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
IPC分类号： H05K1/14 , H01R12/70 , H01R12/71
CPC分类号： H01R12/7005 , H01R12/718
摘要： A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.
摘要翻译：数据存储装置包括印刷电路板（PCB），连接片，虚拟片和引导件。存储芯片安装在PCB上。连接片形成在PCB的第一表面上，以将PCB与第一电缆电连接。虚设凸片形成在PCB的第一表面上。引导构件形成在虚拟翼片上以引导第一缆线的插入方向。因此，没有单独的连接器的数据存储装置可以通过相对简单的过程以较低的成本制造。

2. 发明授权

US08502932B2 Liquid crystal display device and manufacturing and repairing methods thereof 有权
标题翻译：液晶显示装置及其制造和修理方法
公开(公告)号：US08502932B2
公开(公告)日：2013-08-06
申请号：US12862021
申请日：2010-08-24
申请人： Dong Chun Kang , Dae Young Seok , Mon Soo Kang , Jae Ho Yoon , Hyun Jeong Lee
发明人： Dong Chun Kang , Dae Young Seok , Mon Soo Kang , Jae Ho Yoon , Hyun Jeong Lee
IPC分类号： G02F1/1343
CPC分类号： G02F1/136259 , G02F2001/136263 , H01L27/124
摘要： An LCD device is disclosed. The LCD device includes: a gate line and a gate electrode formed on a substrate; a common line formed in the same layer as the gate line; a gate insulation film entirely formed on the substrate with the gate line; a data line formed on the gate insulation film opposite to the common line and configured to cross with the gate line and to define a pixel region; a source electrode formed to protrude from the data line; a drain electrode separated by a first distance from the source electrode; a passivation film entirely formed on the substrate with the data line; and a pixel electrode formed on the passivation film and connected to the drain electrode. The common line includes first and second common lines separated by a second distance from each other, and a third common line formed within the second distance between the first and second common lines and used as a repair pattern during a repairing process.
摘要翻译：公开了一种LCD装置。 LCD装置包括：栅极线和形成在基板上的栅电极; 与栅极线形成在同一层中的公共线; 栅极绝缘膜完全形成在具有栅极线的基板上; 形成在与所述公共线相对的所述栅极绝缘膜上并被配置为与所述栅极线交叉并且限定像素区域的数据线; 形成为从所述数据线突出的源电极; 漏极，与源电极分开第一距离; 在数据线上完全形成在基板上的钝化膜; 以及形成在钝化膜上并连接到漏电极的像素电极。公共线包括彼此间隔第二距离的第一和第二公共线，以及形成在第一和第二公共线之间的第二距离内的第三公共线，并且在修复过程期间用作修复图案。

3. 发明申请

US20130047704A1 MULTI-FUNCTIONAL VEHICLE FOR MEASURING AIR POLLUTION 审中-公开
标题翻译：用于测量空气污染的多功能车辆
公开(公告)号：US20130047704A1
公开(公告)日：2013-02-28
申请号：US13586547
申请日：2012-08-15
申请人： Gwi Nam Bae , Seung Bok Lee , Hyoun Cher Jin , Seung Jae Lee , Dong Hun Lee , Dong Chun Shin , Seok Hwan Lee , Chang Soo Kim
发明人： Gwi Nam Bae , Seung Bok Lee , Hyoun Cher Jin , Seung Jae Lee , Dong Hun Lee , Dong Chun Shin , Seok Hwan Lee , Chang Soo Kim
IPC分类号： G01N1/22
CPC分类号： G01N1/2273 , G01N1/2202 , G01N15/06 , G01N2001/021 , G01N2001/2223
摘要： Provided is a multi-functional vehicle including: a sampling unit through an external air flows in, the sampling unit having a particle sampling inlet tube and a gas sampling inlet tube; a flow distribution unit for supplying the air flowing in through the particle sampling inlet tube to a particle measuring device; a manifold for supplying the air flowing in through the gas sampling inlet tube to a gas measuring device; a particle measuring device for measuring particles in the air supplied from the flow distribution unit; a gas measuring device for measuring gas in the air supplied from the manifold; an animal exposure chamber system for receiving the air from at least one of the flow distribution unit and the manifold and performing an animal exposure experiment; and a data management unit for storing and monitoring air pollution data measured by the particle measuring device and the gas measuring device.
摘要翻译：提供一种多功能车辆，包括：通过外部空气的取样单元流入，取样单元具有粒子取样入口管和气体取样入口管; 流量分配单元，用于将通过所述粒子采样入口管流入的空气供给到粒子测量装置; 用于将通过所述气体取样入口管流入的空气供给到气体测量装置的歧管; 用于测量从所述流量分配单元供应的空气中的颗粒的颗粒测量装置; 用于测量从歧管供应的空气中的气体的气体测量装置; 用于从流量分配单元和歧管中的至少一个接收空气并进行动物暴露实验的动物暴露室系统; 以及数据管理单元，用于存储和监视由粒子测量装置和气体测量装置测量的空气污染数据。

4. 发明申请

US20120142424A1 SCENARIO-BASED LOAD TESTING APPARATUS AND METHOD 有权
标题翻译：基于场景的负载测试装置和方法
公开(公告)号：US20120142424A1
公开(公告)日：2012-06-07
申请号：US13242711
申请日：2011-09-23
申请人： Chang-Sik CHO , Dong-Chun Lee , Su-Young Bae , Hang-Kee Kim , Kang-Min Sohn , Chang-Joon Park
发明人： Chang-Sik CHO , Dong-Chun Lee , Su-Young Bae , Hang-Kee Kim , Kang-Min Sohn , Chang-Joon Park
IPC分类号： A63F9/24
CPC分类号： A63F13/358 , A63F2300/534 , A63F2300/535
摘要： Disclosed herein is a scenario-based load testing apparatus and method. The scenario-based load testing apparatus includes a packet analysis unit, a scenario creation unit, and a load generation unit. The packet analysis unit creates a virtual map and game grammar by capturing and analyzing packets sent between a server and a client. The scenario creation unit creates a scenario of a virtual user on the virtual map. The load generation unit generates a load by creating packet data corresponding to the virtual user in compliance with the game grammar and the scenario.
摘要翻译：这里公开了基于情景的负载测试装置和方法。基于情况的负载测试装置包括分组分析单元，场景创建单元和负载生成单元。分组分析单元通过捕获和分析在服务器和客户端之间发送的分组来创建虚拟映射和游戏语法。场景创建单元在虚拟地图上创建虚拟用户的场景。负载生成单元通过根据游戏语法和场景创建与虚拟用户对应的分组数据来生成负载。

5. 发明授权

US08189342B2 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US08189342B2
公开(公告)日：2012-05-29
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： H05K1/14
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

6. 发明授权

US07906423B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07906423B2
公开(公告)日：2011-03-15
申请号：US12650093
申请日：2009-12-30
申请人： Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
发明人： Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
IPC分类号： H01L21/44
CPC分类号： H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10689 , H05K2201/2036 , Y02P70/613
摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
摘要翻译：半导体器件包括半导体封装，电路板和间隔保持元件。半导体封装具有从主体突出的主体和引线。电路板具有与引线电连接的第一焊盘。间隔保持构件插入在电路板和主体之间。间隔保持构件保持引线与第一焊盘之间的间隔。因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

7. 发明授权

US07675176B2 Semiconductor package and module printed circuit board for mounting the same 有权
标题翻译：半导体封装和模块印刷电路板用于安装
公开(公告)号：US07675176B2
公开(公告)日：2010-03-09
申请号：US11968035
申请日：2007-12-31
申请人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
发明人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K1/111 , H01L2924/0002 , H05K3/3452 , H05K2201/0367 , H05K2201/09381 , H05K2201/094 , H05K2201/09845 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.
摘要翻译：提供了用于安装它的半导体封装和模块印刷电路板（PCB）。半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

8. 发明授权

US07518873B2 Heat spreader, semiconductor package module and memory module having the heat spreader 有权
标题翻译：散热器，半导体封装模块和具有散热器的存储模块
公开(公告)号：US07518873B2
公开(公告)日：2009-04-14
申请号：US11481179
申请日：2006-07-06
申请人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
发明人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.
摘要翻译：散热器包括散热板和压力夹。散热板将热量从热源辐射出来。压力夹将散热板固定在热源上。压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。脊柱布置在散热板上。一个或多个肋从脊部延伸并接触热源。钩部分从脊柱延伸并由热源支撑。压力夹还包括将脊柱连接到钩部件的安装部件。在脊柱和散热板之间形成弯曲空间。散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

9. 发明申请

US20090056979A1 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module 有权
标题翻译：印刷电路板，制造印刷电路板的方法，具有印刷电路板的存储模块和制造存储器模块的方法
公开(公告)号：US20090056979A1
公开(公告)日：2009-03-05
申请号：US12231196
申请日：2008-08-29
申请人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
发明人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/0272 , H05K1/0203 , H05K2201/064 , Y10T29/49124
摘要： A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
摘要翻译： PCB可以包括绝缘构件，冷却构件和电路图案。冷却构件可以内置在绝缘构件中。冷却部件可以具有冷却流体可以流过的冷却通道。电路图案可以形成在绝缘构件上。因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

10. 发明授权

US07280233B2 Method and apparatus for inspecting an edge exposure area of a wafer 失效
标题翻译：用于检查晶片的边缘曝光区域的方法和装置
公开(公告)号：US07280233B2
公开(公告)日：2007-10-09
申请号：US10787765
申请日：2004-02-27
申请人： Koung-Su Shin , Sun-Yong Choi , Chung-Sam Jun , Dong-Chun Lee , Kwang-Jun Yoon
发明人： Koung-Su Shin , Sun-Yong Choi , Chung-Sam Jun , Dong-Chun Lee , Kwang-Jun Yoon
IPC分类号： G01B11/02 , G01B11/14 , G01B11/28 , G01N21/00
CPC分类号： G01N21/9503 , G01N21/9501 , G01N21/9505
摘要： For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.
摘要翻译：为了对晶片的边缘曝光区域进行自动缺陷检查，光学单元将光束提供到晶片的边缘部分，并且检测单元检测从边缘部分反射的光。检测单元将检测到的光转换为电信号，以将电信号传送到处理单元。处理单元分析电信号以测量边缘部分的反射率，将测量的反射率与参考反射率进行比较，并计算边缘曝光区域的宽度。处理单元将计算的宽度与参考宽度进行比较，以检测边缘曝光区域中的任何缺陷。

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