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1. 发明授权

US5919402A Electronically conducting polymers with silver grains 失效
标题翻译：具有银晶粒的电子导电聚合物
公开(公告)号：US5919402A
公开(公告)日：1999-07-06
申请号：US697641
申请日：1996-08-29
申请人： Oliver J. Murphy , G. Duncan Hitchens , Dolibor Hodko
发明人： Oliver J. Murphy , G. Duncan Hitchens , Dolibor Hodko
IPC分类号： C08F2/50 , C08G61/12 , C23C26/00 , C25D5/54 , G03F7/027 , H01B1/12 , H01C7/00 , H01C17/242 , H01G9/02 , H01G9/025 , H05K1/09 , H05K1/16 , H05K3/10 , H05K3/18 , H05K9/00 , H01B1/02
CPC分类号： H01G9/025 , C08G61/124 , C23C26/00 , C25D5/54 , G03F7/027 , H01B1/12 , H01C17/242 , H01C7/005 , H05K1/095 , H05K1/16 , H05K1/167 , H05K3/185 , H05K3/188 , H05K9/0081 , H05K1/162 , H05K1/165 , H05K2201/0329 , H05K2203/0514 , H05K3/105
摘要： The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
摘要翻译：本发明提供了由已经选择性地暴露于紫外光，激光或电子束的吡咯和电子受体的光敏剂形成的电子导电聚合物膜。制剂可以包括光引发剂，柔韧剂，溶剂等。这些解决方案可用于包括印刷电路板和通孔电镀在内的应用，并可在非导电基板上进行直接金属化处理。在形成导电聚合物图案之后，可以通过使用钯和电沉积铜使聚合物敏化来形成印刷线路板。

2. 发明授权

US06203682B1 Well designs for electrokinetic remediation 失效
标题翻译：电动修复的设计
公开(公告)号：US06203682B1
公开(公告)日：2001-03-20
申请号：US09139991
申请日：1998-08-25
申请人： Dolibor Hodko
发明人： Dolibor Hodko
IPC分类号： C25C122
CPC分类号： E21B43/00 , B01D61/56 , B09C1/085 , E02D3/11
摘要： The invention provides an apparatus for electrokinetic transport through soil, comprising an electrode and a containment surrounding the electrode, the containment comprising a layer of a porous material and a rigid porous member disposed between the electrode and the porous material to support or secure the first material. The porous material and rigid porous member allow passage of water, hydrogen ions, hydroxyl ions and one or more target ions. A preferred porous material is clay or ceramic and a preferred rigid porous member is a perforated plastic tube.
摘要翻译：本发明提供了一种用于通过土壤进行电动运输的装置，其包括电极和围绕电极的容纳物，所述容纳物包括多孔材料层和设置在电极和多孔材料之间的刚性多孔构件，以支撑或固定第一材料。多孔材料和刚性多孔构件允许水，氢离子，羟基离子和一个或多个目标离子通过。优选的多孔材料是粘土或陶瓷，优选的刚性多孔构件是穿孔塑料管。

3. 发明授权

US5871672A Electronically and ionically conducting polymer matrix 失效
标题翻译：电子和离子导电聚合物基质
公开(公告)号：US5871672A
公开(公告)日：1999-02-16
申请号：US705735
申请日：1996-08-30
申请人： Oliver J. Murphy , G. Duncan Hitchens , Dolibor Hodko
发明人： Oliver J. Murphy , G. Duncan Hitchens , Dolibor Hodko
IPC分类号： C08F2/50 , C08G61/12 , C23C26/00 , C25D5/54 , G03F7/027 , H01B1/12 , H01C7/00 , H01C17/242 , H01G9/02 , H01G9/025 , H05K1/09 , H05K1/16 , H05K3/10 , H05K3/18 , H05K9/00 , H01B1/00
CPC分类号： H01G9/025 , C08G61/124 , C23C26/00 , C25D5/54 , G03F7/027 , H01B1/12 , H01C17/242 , H01C7/005 , H05K1/095 , H05K1/16 , H05K1/167 , H05K3/185 , H05K3/188 , H05K9/0081 , H05K1/162 , H05K1/165 , H05K2201/0329 , H05K2203/0514 , H05K3/105
摘要： The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
摘要翻译：本发明提供了由已经选择性地暴露于紫外光，激光或电子束的吡咯和电子受体的光敏剂形成的电子导电聚合物膜。制剂可以包括光引发剂，柔韧剂，溶剂等。这些解决方案可用于包括印刷电路板和通孔电镀在内的应用，并可在非导电基板上进行直接金属化处理。在形成导电聚合物图案之后，可以通过使用钯和电沉积铜使聚合物敏化来形成印刷线路板。

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