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    • 3. 发明申请
    • [MULTI-LEVEL MEMORY CELL]
    • [多级记忆体]
    • US20050145919A1
    • 2005-07-07
    • US10707677
    • 2004-01-02
    • Ko-Hsing ChangChiu-Tsung Huang
    • Ko-Hsing ChangChiu-Tsung Huang
    • H01L21/28H01L21/336H01L29/792H01L29/76
    • H01L29/66833H01L21/28282H01L29/7923
    • A multi-level memory cell including a substrate, a tunneling dielectric layer, a charge-trapping layer, a top dielectric layer, a gate and a pair of source/drain regions is provided. The tunneling dielectric layer, the charge-trapping layer and the top dielectric layer are sequentially formed between the substrate and the gate. The top dielectric layer has at least two portions, and the top dielectric layer in each portion has a different thickness. The source/drain regions are disposed in the substrate on each side of the gate. Since the thickness of the top dielectric layer in each portion is different, the electric field strength between the gate and the substrate when a voltage is applied to the memory cell are different in each portion. With the number of charges trapped within the charge-trapping layer different in each portion, a multiple of data bits can be stored within each memory cell.
    • 提供了包括衬底,隧道电介质层,电荷俘获层,顶部电介质层,栅极和一对源极/漏极区域的多层存储单元。 隧道介电层,电荷俘获层和顶部电介质层依次形成在基板和栅极之间。 顶部电介质层具有至少两个部分,并且每个部分中的顶部电介质层具有不同的厚度。 源极/漏极区域设置在栅极的每一侧的衬底中。 由于各部分的顶部电介质层的厚度不同,所以当向存储单元施加电压时,栅极与衬底之间的电场强度各不相同。 由于每个部分中的电荷俘获层内陷入的电荷数量不同,所以可以在每个存储单元内存储多个数据位。
    • 5. 发明申请
    • NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF
    • 非易失性存储器及其制造方法
    • US20080191262A1
    • 2008-08-14
    • US11768179
    • 2007-06-25
    • Ko-Hsing ChangChiu-Tsung Huang
    • Ko-Hsing ChangChiu-Tsung Huang
    • H01L29/788H01L21/8246
    • H01L29/792G11C16/0483H01L27/115H01L27/11568H01L29/40117H01L29/42336
    • The invention provides a non-volatile memory including a substrate, an active layer, device isolation layers and memory cells. The active layer disposed on the substrate protrudes from the substrate surface. Regarding the active layer, the device isolation layers are respectively disposed on the two sides thereof; the surface of the device isolation layers is lower than that of the active layer; the charge storage layer is disposed on the sidewalls thereof between the control gate and the active layer; the cap layer is disposed in the top section thereof between the control gate and the active layer, and the source/drain region is disposed in the active layer at the two sides of the control gate. Each of the memory cells includes a control gate, a charge storage layer, a cap layer and a source/drain region. The control gate disposed on the substrate crosses over the active layer.
    • 本发明提供一种非易失性存储器,其包括衬底,有源层,器件隔离层和存储器单元。 设置在基板上的有源层从基板表面突出。 关于有源层,器件隔离层分别设置在其两侧; 器件隔离层的表面低于有源层的表面; 电荷存储层设置在控制栅极和有源层之间的侧壁上; 盖层设置在控制栅极和有源层之间的顶部,并且源极/漏极区域设置在控制栅极两侧的有源层中。 每个存储单元包括控制栅极,电荷存储层,盖层和源极/漏极区域。 设置在基板上的控制栅极跨越有源层。
    • 6. 发明授权
    • Multi-level memory cell and fabricating method thereof
    • 多层存储单元及其制造方法
    • US07098109B2
    • 2006-08-29
    • US11160523
    • 2005-06-28
    • Chiu-Tsung HuangKo-Hsing Chang
    • Chiu-Tsung HuangKo-Hsing Chang
    • H01L21/336
    • H01L29/66833H01L21/28282H01L29/7923
    • A multi-level memory cell includes a substrate, an insulation layer, a silicon stripe, a first control gate, a second control gate, source/drain regions, silicon oxide/silicon nitride/silicon oxide composite layers. The insulation layer and the silicon stripe are sequentially disposed on the substrate. The first control gate and the second control gate are respectively disposed on the sidewalls of the silicon stripe, while the source/drain regions are configured in the silicon stripe beside both sides of the first control gate and the second control gate. The composite dielectric layers are disposed between the first control gate and the silicon stripe, and between the second control gate and the silicon stripe. Since a single memory structure can store a multiple bit of information, it is advantageous for minimizing devices.
    • 多层存储单元包括衬底,绝缘层,硅条,第一控制栅极,第二控制栅极,源极/漏极区域,氧化硅/氮化硅/氧化硅复合层。 绝缘层和硅条依次设置在基板上。 第一控制栅极和第二控制栅极分别设置在硅条的侧壁上,而源极/漏极区域配置在除了第一控制栅极和第二控制栅极两侧的硅条纹之外。 复合电介质层设置在第一控制栅极和硅条之间以及第二控制栅极和硅条之间。 由于单个存储器结构可以存储多个位的信息,所以最小化器件是有利的。
    • 8. 发明申请
    • MULTI-LEVEL MEMORY CELL AND FABRICATING METHOD THEREOF
    • 多层记忆体及其制作方法
    • US20050227443A1
    • 2005-10-13
    • US11160523
    • 2005-06-28
    • Chiu-Tsung HuangKo-Hsing Chang
    • Chiu-Tsung HuangKo-Hsing Chang
    • H01L21/28H01L21/336H01L29/792H01L21/8239
    • H01L29/66833H01L21/28282H01L29/7923
    • A multi-level memory cell includes a substrate, an insulation layer, a silicon stripe, a first control gate, a second control gate, source/drain regions, silicon oxide/silicon nitride/silicon oxide composite layers. The insulation layer and the silicon stripe are sequentially disposed on the substrate. The first control gate and the second control gate are respectively disposed on the sidewalls of the silicon stripe, while the source/drain regions are configured in the silicon stripe beside both sides of the first control gate and the second control gate. The composite dielectric layers are disposed between the first control gate and the silicon stripe, and between the second control gate and the silicon stripe. Since a single memory structure can store a multiple bit of information, it is advantageous for minimizing devices.
    • 多层存储单元包括衬底,绝缘层,硅条,第一控制栅极,第二控制栅极,源极/漏极区域,氧化硅/氮化硅/氧化硅复合层。 绝缘层和硅条依次设置在基板上。 第一控制栅极和第二控制栅极分别设置在硅条的侧壁上,而源极/漏极区域配置在除了第一控制栅极和第二控制栅极两侧的硅条纹之外。 复合电介质层设置在第一控制栅极和硅条之间以及第二控制栅极和硅条之间。 由于单个存储器结构可以存储多个位的信息,所以最小化器件是有利的。