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1. 发明申请

US20200251412A1 PREFORMED LEAD FRAME AND LEAD FRAME PACKAGE MADE FROM THE SAME 审中-公开
公开(公告)号：US20200251412A1
公开(公告)日：2020-08-06
申请号：US16447350
申请日：2019-06-20
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng HUANG
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00
摘要： A preformed lead frame includes multiple lead frame units, a connecting member connecting the lead frame units, a molding layer molded over the lead frame units and the connecting member, and a solder layer. The molding layer has opposite upper and lower surfaces, a plurality of side surfaces each extending therebetween, and a plurality of spaced-apart elongated grooves indented from the lower surface towards the upper surface. Each of the lead frame units includes a row of spaced-apart leads each having a grooved surface and a grooved soldering surface indented from the grooved surface towards the upper surface. The solder unit includes multiple solder layers for filling the elongated grooves. A lead frame package formed from the preformed lead frame is also disclosed.

2. 发明申请

US20200227343A1 SEMICONDUCTOR DEVICE PACKAGE 审中-公开
公开(公告)号：US20200227343A1
公开(公告)日：2020-07-16
申请号：US16245428
申请日：2019-01-11
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng HUANG
IPC分类号： H01L23/495 , H01L23/31 , H01L33/52
摘要： A semiconductor device package includes a metallic leadframe unit including a supporting base and a plurality of leads, a molding layer the leadframe unit, a plurality of solder grooves, and a semiconductor device disposed on the supporting base. The solder grooves are located under the leads such that lead bottom surfaces are uncovered by the molding layer. Each of the solder grooves has an end opening at a molding-layer side surface. The molding-layer side surface has a plurality of surface sections connected with each other, and any two adjacent ones of the surface sections define a joint portion. The leads are correspondingly exposed from the surface sections. The metallic leadframe unit is unexposed from the joint portions.

3. 发明授权

US10424535B2 Pre-molded leadframe device 有权
公开(公告)号：US10424535B2
公开(公告)日：2019-09-24
申请号：US15977244
申请日：2018-05-11
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng Huang
IPC分类号： H01L23/495 , H01L23/48 , H01L23/498 , H01L33/48 , H01L33/62 , H01L21/48 , H01L33/60
摘要： A pre-molded leadframe device includes a leadframe and a first molding layer. The leadframe includes a plurality of leadframe units spaced apart from one another, a framing portion surrounding and spaced apart from all of the leadframe units, and a gap interposed among the leadframe units and the framing portion. Each of the leadframe units has a leadframe top surface and a leadframe bottom surface. The first molding layer fills the gap and has a molding-layer bottom surface that is coplanar with the leadframe bottom surfaces. The first molding layer is further formed with a plurality of solder grooves, each of which extends across the gap and having at least one end connected to one of the leadframe units.

4. 发明申请

US20190181305A1 LIGHT EMITTING DEVICE PACKAGE 审中-公开
公开(公告)号：US20190181305A1
公开(公告)日：2019-06-13
申请号：US15977252
申请日：2018-05-11
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng HUANG
IPC分类号： H01L33/48 , H01L33/62 , H01L33/60
CPC分类号： H01L33/486 , H01L23/49861 , H01L33/0033 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/97 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： Alight emitting device package includes a leadframe unit, a molding layer, and a light emitting device. The leadframe unit has opposite leadframe top and bottom surfaces. The molding layer encloses the leadframe unit, and has a molding-layer bottom surface, a molding-layer surrounding surface extending upward from the molding-layer bottom surface to surround the leadframe unit, and a plurality of solder grooves indented from the molding-layer bottom surface. Each of the solder grooves has one end meeting the leadframe unit and another end opening at the molding-layer surrounding surface. The light emitting device is disposed on the leadframe top surface of the leadframe unit.

5. 发明授权

US09799613B1 Lead frame device 有权
公开(公告)号：US09799613B1
公开(公告)日：2017-10-24
申请号：US15422257
申请日：2017-02-01
申请人： Chang Wah Technology Co., Ltd.
发明人： Chia-Neng Huang
IPC分类号： H01L33/62 , H01L23/00 , H01L23/544 , H01L23/495
CPC分类号： H01L23/562 , H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L23/544 , H01L2223/5446 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A lead frame device includes a metallic outer frame member, a lead frame package preform, and an encapsulant. The metallic outer frame member includes a pair of spaced apart longitudinal and transverse sections. The lead frame package preform includes at least one die pad surrounded by the metallic outer frame member such that a gap is formed around the die pad within the metallic, and a plurality of spaced apart leads. Each of the spaced apart leads has a first portion connected to the metallic outer frame member, a second portion proximal to and spaced apart from the die pad, a top surface, and a recess indented from the top surface. The encapsulant is filled in the recess. The disclosure also provides a lead frame device assembly.

6. 发明申请

US20160043019A1 Composite Lead Frame Structure 有权
标题翻译：复合引线框架结构
公开(公告)号：US20160043019A1
公开(公告)日：2016-02-11
申请号：US14454807
申请日：2014-08-08
申请人： Chang Wah Technology CO., LTD.
发明人： Chia-Neng Huang
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L23/49517 , H01L23/49534 , H01L23/49861 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： The present invention relates to a structure of a composite lead frame generally having a die bonding layer and a solder layer and may further have an cohesive layer between the die bonding layer and the solder layer. The die bonding layer is made of flex substrate and the solder layer is made of traditional lead frame. Thus, the composite lead frame structure is suitable for the flip chip or wire bonding packaging process of LED and also suitable for semiconductor IC packaging process. It is good in electric and heat conductivity, and also with higher mechanical strength, resulting high pin counts and minimization of resulted IC.
摘要翻译：本发明涉及通常具有管芯接合层和焊料层的复合引线框架的结构，并且还可以在管芯接合层和焊料层之间具有内聚层。芯片接合层由柔性基板制成，焊料层由传统引线框架制成。因此，复合引线框架结构适用于LED的倒装芯片或引线键合封装工艺，也适用于半导体IC封装工艺。它具有良好的导电性和导热性，并且还具有较高的机械强度，从而产生高引脚数和最小化所得到的IC。

7. 发明申请

US20140110724A1 PROCESS OF MAKING A STRUCTURE FOR ENCAPSULATING LED CHIPS AND THE LED CHIPS ENCAPSULATION STRUCTURE 审中-公开
标题翻译：制造LED灯泡结构的过程和LED灯泡封装结构
公开(公告)号：US20140110724A1
公开(公告)日：2014-04-24
申请号：US13656651
申请日：2012-10-19
申请人： CHANG WAH ELECTROMATERTIALS INC. , CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng Huang
IPC分类号： H01L33/60 , H01L33/52
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2924/00014
摘要： A process of making a structure for encapsulating LED chips is provided with punching a reflective substrate into a reflective layer including through holes as reflective cups; punching an insulating substrate into an insulating layer including through holes, a flexible member having top and bottom formed with top and bottom layers of thermoset respectively, and top and bottom coatings formed on the top and bottom layers of thermoset respectively; punching a conductive substrate to form conductive members each having a solder pad and a lead leg; roughening bottom of the reflective layer; roughening top of the conductive substrate; filling an insulating material around the solder pads and the lead legs to form a lead frame; stacking and fastening the reflective layer, the insulating layer, and the lead frame fastened together; and electroplating the stack to form an airtight radiation emitting coating, thereby forming an LED chips encapsulation structure.
摘要翻译：制造用于封装LED芯片的结构的工艺被设置为将反射基板冲压成包括作为反射杯的通孔的反射层; 将绝缘基板冲压成包括通孔的绝缘层，分别具有形成有热固性顶层和底层的顶部和底部的柔性构件，以及分别形成在热固性材料的顶层和底层上的顶部和底部涂层; 冲压导电基板以形成各自具有焊盘和引脚的导电构件; 反光层底部粗糙化; 导电基板粗糙化顶部; 在焊盘和引线腿周围填充绝缘材料以形成引线框架; 堆叠和紧固反射层，绝缘层和引线框架紧固在一起; 并且电镀该堆叠以形成气密的辐射发射涂层，由此形成LED芯片封装结构。

8. 发明申请

US20220231208A1 COMPOSITE LEAD FRAME AND LIGHT-EMITTING DIODE PACKAGE STRUCTURE INCLUDING THE SAME 有权
公开(公告)号：US20220231208A1
公开(公告)日：2022-07-21
申请号：US17501531
申请日：2021-10-14
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng HUANG
IPC分类号： H01L33/60 , H01L33/62
摘要： A composite lead frame for mounting a light-emitting diode chip thereon includes a chip mounting seat having at least two electrodes spaced apart from each other by a gap and configured to electrically connect with the LED chip. Each electrode is formed with at least one through hole. A plurality of fillers made of polymer materials are filled in the gap and the through hole. A reflector cup is disposed on and cooperates with the electrodes to define a receiving space for receiving the LED chip. The reflector cup is composed of a silicon-based polymer material and a white inorganic filling material, and is connected to the electrodes and the fillers. A LED package structure including the composite lead frame is also disclosed.

9. 发明申请

US20210098358A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20210098358A1
公开(公告)日：2021-04-01
申请号：US16719180
申请日：2019-12-18
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng HUANG
IPC分类号： H01L23/498 , H01L23/31 , H01L23/00
摘要： A semiconductor package includes a lead frame, a chip unit, and an encapsulation layer. The lead frame includes a die pad and a plurality of package leads. Each of the package leads has a proximate segment and a distal segment relative to the die pad. Each of the package leads has an outer end surface which. interconnects bottom and top surface regions of the distal segment, and a cavity which is formed the bottom surface region of the distal segment, and which extends inwardly from the outer end surface. The chip unit includes a chip and a plurality of wire bonds. The encapsulation layer encapsulates the lead frame and the chip unit such that the distal segment of each of the package leads is exposed from the encapsulation layer.

10. 发明授权

US10607926B1 Preformed lead frame device 有权
公开(公告)号：US10607926B1
公开(公告)日：2020-03-31
申请号：US16502122
申请日：2019-07-03
申请人： CHANG WAH TECHNOLOGY CO., LTD.
发明人： Chia-Neng Huang
IPC分类号： H01L23/495 , H01L23/31 , H05K1/03
摘要： A preformed lead frame device includes multiple spaced-apart longitudinal sections, multiple spaced-apart transverse sections intersecting the longitudinal sections, and multiple preformed lead frame units each surrounded by two adjacent ones of the longitudinal sections and two adjacent ones of the transverse sections. Each of the preformed lead frame units includes a die pad sub-unit including a die pad portion, multiple pillar portions, and a first gap formed among the die pad portion and the pillar portions, a lead sub-unit including leads and a second gap formed among the die pad sub-unit and the leads, an adhesion-strengthening layer disposed in the first and second gaps, and a molding layer filling the first and second gaps to cover the adhesion-strengthening layer.

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